TECHCET is forecasting continued strong growth for silicon carbide (SiC) wafer through 2023, despite the slowdown in the general global economy and other semiconductor materials markets.
Mitsubishi Electric to Ship Samples of SBD-embedded SiC-MOSFET Module
Mitsubishi Electric Corporation announced today that it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) module.
ROHM Begins Mass Production of 650V GaN HEMTs that Deliver Class-Leading Performance
ROHM Semiconductor today announced mass production of 650V GaN (Gallium Nitride) HEMTs GNP1070TC-Z and GNP1150TCA-Z optimized for a wide range of power supply systems applications.
SEMI NBMC Invites Proposals for Wearable Sensor Innovations
The Nano-Bio Materials Consortium (NBMC), a SEMI Technology Community, today issued a Request for Proposals (RFP) aimed at advancing human performance through innovations in wearable transdermal, subcutaneous, and textile-based sensor technologies. Selected projects will receive cash awards ranging from $500,000 to $1 million.
ESD Alliance Elects 10-Member Governing Council to 2-Year Term
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, today announced the election of its Governing Council for the 2023-2025 term.
GlobalFoundries Announces New General Manager to Lead Malta Manufacturing Site
GlobalFoundries (Nasdaq: GFS) (GF) today announced the appointment of Hui Peng Koh as vice president and general manager of the company’s semiconductor manufacturing facility in Malta, New York.
University of Southern California Launches $1B-Plus Initiative for Computing Including AI, Advanced Computation and Quantum Computing
USC President Carol L. Folt on Thursday announced a $1 billion-plus initiative for computing research and education across disciplines, with a focus on AI, machine learning and data science, augmented and virtual reality, robotics, gaming and block chain.
InPlay Unveils World’s Smallest Bluetooth SoC in WLCSP Package
The new package, measuring an ultra-small 1.1mm x 2.0mm x 0.35mm, sets the record as the world’s smallest Bluetooth System on a Chip (SoC).
Keysight Joins TSMC Open Innovation Platform 3DFabric Alliance
Keysight Technologies, Inc. (NYSE: KEYS) has joined the TSMC Open Innovation Platform (OIP) 3DFabric Alliance, which was formed recently by TSMC to accelerate 3D integrated circuit (IC) ecosystem innovation and readiness.
Robert Aslett Named Si2 President and CEO
Silicon Integration Initiative today announced that it appointed Robert Aslett as president and chief executive officer.
