Governor Hochul and Micron Announce Members of Community Engagement Committee to Advise on Nation-Leading Semiconductor Project

Governor Kathy Hochul and Micron Technology, Inc. today announced the members of the Micron Community Engagement Committee, including representatives from Central New York and Micron that will support the company’s community investment strategy.

U.S. CHIPS Program Office Awards TECHCET with Sole Source Contract for Critical Materials Supply Chain Info

TECHCET announced it has been awarded a contract from the National Institute of Standards and Technology (NIST)/ CHIPS Program Office (CPO) for materials supply chain data and analysis.

Gartner Forecasts Worldwide Semiconductor Revenue to Decline 11% in 2023

Global semiconductor revenue is projected to decline 11.2% in 2023, according to the latest forecast from Gartner, Inc. In 2022, the market totaled $599.6 billion, which was marginal growth of 0.2% from 2021.

Semtech and Connected Development Launch New LoRa-Based IoT Development Board and Reference Design

Semtech Corporation and Connected Development, today announced the launch of the new XCVR Development Board and Reference Design integrating the LoRa Sub-GHz Radio Transceiver.

ROHM Introduces Ultra-Low-Profile, 12W Rated Metal Plate Shunt Resistor

ROHM Semiconductor today announced the industry’s thinnest (H: 0.03-inch) 12W rated metal plate shunt resistor (PSR350), optimized for high-power applications in the automotive and industrial equipment markets.

New Pirani/Bayard-Alpert Vacuum Gauge from Pfeiffer Vacuum Ensures Process Control and Operational Reliability

Many vacuum applications operate only within a specific pressure range. In order to operate such vacuum systems efficiently, the total pressure must be measured reliably.

Fujifilm Breaks Ground on New €30M Expansion to Grow Semiconductor Materials Manufacturing Capabilities in Europe

This marks one of Europe’s biggest capital expenditure investments in the semiconductor materials supply chain over the last decade.

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Design Systems, Inc. today announced that the Cadence 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp.

Atomera Signs Commercial License Agreement with STMicroelectronics

Atomera Incorporated, a semiconductor materials and technology licensing company, today announced the execution of a commercial license agreement with STMicroelectronics (ST).

Renesas Expands Focus on India with New NB-IoT Solution

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced an NB-IoT (Narrowband Internet of Things) chipset specifically for the Indian market.