MAGAZINE
April/May
TXOne Networks Introduces Breakthrough Capability for Intelligent Vulnerability Mitigation in New Release of TXOne SageOne
TXOne Networks today announced an expanded new version of its SageOne OT Cybersecurity Governance Platform.
SEMI Selects Kiterocket as Agency of Record
Kiterocket to support the global association’s communications strategy, amplify industry leadership, and advance cross-sector initiatives from advocacy to workforce development.
Micron Ships World’s First 1γ (1-Gamma)-Based LPDDR5X
Micron Technology, Inc. (Nasdaq: MU), announced today that it is shipping qualification samples of the world’s first 1γ (1-gamma) node-based low-power double data rate 5X (LPDDR5X) memory, designed to accelerate AI applications on flagship smartphones.
Soitec and PSMC Collaborate on Ultra-Thin TLT Technology for Nm-Scale 3D Stacking
Soitec today announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC).
Optimizing Tester Memory Resources with Xtreme Pooling Technology
Xtreme Pooling extends vector-memory capacity up to 896 GV per pin by dynamically redistributing unused memory across test processors.
Burn-In Test System for Semiconductor Market to Hit $1.4 Billion by 2031
The global market for Burn-In Test System for Semiconductor was valued at USD 756 Million in the year 2024 and is projected to reach a revised size of USD 1448 Million by 2031, growing at a CAGR of 9.9% during the forecast period.
Mouser Electronics Awarded Distributor of the Year Honors from OMRON Electronic Components for Fifth Consecutive Year
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, today announced it has been named 2024 E-Catalog Distributor of the Year by OMRON Electronic Components.
From Invention to AI Acceleration: Celebrating 40 Years of FPGA Innovation
This year marks the 40th anniversary of the first commercially available field-programmable gate array (FPGA), introducing the idea of reprogrammable hardware.
FormFactor, Inc. Announces Purchase of New Manufacturing Facility
FormFactor, Inc., a provider of test and measurement technologies for the semiconductor industry, today announced that it has purchased a manufacturing site in Farmers Branch, Texas.
Strategic Materials Conference 2025 Spotlights Materials Innovation to Advance Semiconductor Manufacturing
With materials innovation at the core of next-generation semiconductor technologies, the Strategic Materials Conference (SMC) 2025 brings together top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest trends and advancements.
Kopin Announces CFO Retirement and Transition
Kopin Corporation today announced the retirement of Rich Sneider.
Robert Schriesheim Appointed Interim Chief Financial Officer of Skyworks
Skyworks Solutions, Inc. announced today that Mark Dentinger will not be joining Skyworks as Chief Financial Officer (CFO) due to an unforeseen medical condition.
FormFactor Named #1 Global Supplier in Test Subsystems and Focused Chip Making Equipment
FormFactor, Inc., a semiconductor test and measurement supplier, has been named the #1 global supplier in both the Test Subsystems and Focused Chip Making Equipment categories in TechInsights’ 2025 global semiconductor industry customer satisfaction survey.
Exploiting the Full Potential of Multiferroic Materials for Magnetic Memory Devices
Researchers demonstrate a new strategy for magnetization reversal in multiferroic materials, opening pathways to more energy-efficient electronics.
A New Model to Accurately Develop Better OLEDs
Researchers develop a new analytical model detailing the kinetics of the exciton dynamics in TADF materials, the primary component in OLEDs.
TechniQuip Introduces TALON High Irradiance Multichannel LED Illumination
TechniQuip, designers and builders of precision OEM illumination for applications in semiconductor, life sciences and medical devices, announces today the introduction of the TALON series of multi-channel LED illuminators.
Marvell Delivers Advanced Packaging Platform for Custom AI Accelerators
Marvell Technology, Inc. has expanded the packaging ecosystem for AI infrastructure with an innovative multi-die solution that lowers total cost of ownership (TCO) for custom AI accelerator silicon.
Infineon Launches New Radiation Hardened GaN Transistors, Including One of the First DLA JANS Certified GaN Device
Infineon Technologies AG today announced the first of a new family of radiation hardened Gallium Nitride (GaN) transistors, fabricated at Infineon’s own foundry, based on its proven CoolGan technology.
Aeluma and Thorlabs Unveil Breakthrough with Large-Diameter Wafer Manufacturing Platform for Quantum Computing and Communication
Aeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies, together with Thorlabs, a vertically integrated photonics products manufacturer, today announced a major advancement in silicon photonics that could accelerate adoption of quantum computing and communication at commercial scale.
xMEMS Extends µCooling Fan-on-a-Chip to SSDs
xMEMS Labs, Inc., inventor of the world’s first monolithic silicon MEMS air pump, today announced the expansion of its µCooling fan-on-a-chip platform to solid-state drives (SSDs), enabling the first-ever in-drive active cooling for enterprise E3.S form factor SSDs used in AI data centers and NVMe M.2 SSDs used in laptop PCs.
Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains
Siemens Digital Industries Software announced today the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.
SEMICON Southeast Asia 2025 Closes with Over 25,000 Attendees
SEMICON Southeast Asia (SEA) 2025, the region’s flagship global electronics manufacturing and semiconductor supply chain event, concluded with over 25,000 attendees, including global CEOs, C-suite executives, leaders, decision-makers, summit delegates, exhibitors, and speakers, converging in Singapore for the 30th edition of the region’s most prominent microelectronics event.
Can AI Make Critical Communications Chips Easier to Design?
Radio frequency integrated circuits (RFIC) are critical to advancing communications capabilities—think moving from 5G networks to 6G—and many other technological applications. But these chips are also really hard to design.
Featured Video
Kuehne+Nagel offers logistics services specifically designed for the semiconductor industry, with an extensive network at key locations, experienced personnel, and capacity to meet the strict requirements of semiconductor fabs. At SEMICON West 2024, Barry O’Dowd, global head of semiconductor logistics at Kuehne+Nagel talked to Editor-in-Chief Pete Singer about how the company’s certified services ensure the stability of the supply chain. O’Dowd said the emphasis is on providing reliable, safe, and cost-effective logistics solutions, from precise transportation and risk mitigation to professionally trained staff and preapproved suppliers.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
