MAGAZINE
March
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
NVIDIA today announced that TSMC and Synopsys are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC, the global association for electronics manufacturing, as its chief strategist for advanced packaging.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
UMass Amherst Researchers Join $26M Quantum Computing Effort to Build Internet of the Future
UMass is leading the core effort to design architectures and protocols for quantum networking for the National Science Foundation’s Center for Quantum Networks.
Weebit Nano to Demo its ReRAM Technology on GlobalFoundries’ 22FDX Platform
Weebit Nano Limited will showcase a live demo of Resistive Random-Access Memory (ReRAM) technology implemented in GlobalFoundries’ 22FDX platform.
Eurex Launches Futures Contract on Semiconductor Industry
Eurex, Europe’s leading derivatives exchange, is expanding its suite of sector index futures.
HiPace 30 Neo: Smallest Hybrid-Bearing High-Power Turbopump on the Market
The new HiPace 30 Neo turbopump from Pfeiffer Vacuum is a vacuum pump for compact analysis systems and portable applications.
Semiconductor Assembly and Test Facility Database Now Tracks OSAT and Integrated Device Manufacturers in 670 Facilities
New edition of SEMI’s database tracks 33% more facilities and highlights advanced packaging and factory certifications.
MPI Corporation’s Advanced Semiconductor Test Division Joins Forces with Keysight Technologies
MPI Corporation announced a landmark partnership with Keysight Technologies, a global innovation partner delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster.
Archer Miniaturizes Biochip gFET Chip Design
Archer Materials Limited, a semiconductor company advancing the quantum computing and medical diagnostics industries, has designed a miniaturized version of its Biochip graphene field effect transistor chip for fabrication at a commercial foundry.
SEALSQ Launches SEALBOX
SEALSQ Corp today announced the launch of SEALBOX, its innovative solution for IoT device provisioning at the manufacturing level.
Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System
LA9300AD enables detection of shallow microscopic defects, contributing to reduced manufacturing costs and improved yield.
Toray Develops Hybrid Bonding Resin for Enhancing Yield and Reliability in Semiconductor Packaging
Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding).
New Study Shows Analog Computing Can Solve Complex Equations and Use Far Less Energy
UMass Amherst research demonstrates that a memristor device can solve complex scientific problems using significantly less energy, overcoming one of the major hurdles of digital computing.
Quantum Experts Join Forces to Revolutionize European Quantum Computing
ORCA Computing, Pixel Photonics, Sparrow Quantum, and the Niels Bohr Institute (NBI) announce their collaboration on the Eurostars project ‘SupremeQ.’
Adeia Chooses Veeco to Accelerate Next-Generation Advanced Packaging Applications
Veeco Instruments Inc. today announced that Adeia Inc., a semiconductor R&D innovator has chosen the WaferStorm Wet Processing Systems for advanced packaging applications.
Global Semiconductor Materials Market Set to Achieve Record Highs
TECHCET forecasts a rebound in the global semiconductor materials market this year.
Researchers Design New Analog Chip Architecture With High Precision
Design combines the best of digital and analog computing and delivers >10x energy efficiency.
Adeia Presents Metrology Techniques for Improved Yield in Hybrid Bonding at IMAPS Device Packaging Conference 2024
Adeia Inc. will showcase the latest developments in hybrid bonding technology at the 20th Annual Device Packaging Conference (DPC 2024) on March 18-21, 2024, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona
Advancing Toward Wearable Stretchable Electronics
Researchers at Stanford have been working on skin-like, stretchable electronic devices for over a decade.
Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
Cadence Design Systems, Inc. today announced a collaboration with Arm to deliver a chiplet-based reference design and software development platform to accelerate software-defined vehicle (SDV) innovation.
Intel Appoints Stacy Smith to Board of Directors
Intel Corporation today announced that Stacy Smith, executive chairman of Kioxia Corporation, formerly Toshiba Memory Corporation, and chair of Autodesk Inc., was appointed to Intel’s board of directors, effective immediately. Smith will serve as an independent director and join the board’s Audit & Finance Committee.
SemiQon Announces Shipping of its Silicon-Based 4-qubit Quantum Chip and Transistors
Research groups around the world are now using these first-generation silicon-based chips helping the industry step faster to the million qubit level of quantum computing.
Featured Video
Winnie Nabea, Global Product Manager at Mettler-Toledo Thornton, explains the importance of monitoring silica in ultra-high purity (UHP) water used in semiconductor manufacturing plants. Silica is one of the most critical indicators of the health of the water system. A rise in silica levels means the resin is approaching exhaustion and needs to be regenerated. If silica is not monitored, contamination of the ultrapure water can occur. She explains where silica should be monitored, outside factors that may cause silica issues, the best methods for monitoring silica, and how Mettler-Toledo is helping semiconductor manufacturers monitor the overall health of their water treatment plants.
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