What’s in the March Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.

TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production

NVIDIA today announced that TSMC and Synopsys are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.

Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC, the global association for electronics manufacturing, as its chief strategist for advanced packaging.

What’s in the March Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.

UMass Amherst Researchers Join $26M Quantum Computing Effort to Build Internet of the Future

UMass is leading the core effort to design architectures and protocols for quantum networking for the National Science Foundation’s Center for Quantum Networks.

Weebit Nano to Demo its ReRAM Technology on GlobalFoundries’ 22FDX Platform

Weebit Nano Limited will showcase a live demo of Resistive Random-Access Memory (ReRAM) technology implemented in GlobalFoundries’ 22FDX platform.

Eurex Launches Futures Contract on Semiconductor Industry

Eurex, Europe’s leading derivatives exchange, is expanding its suite of sector index futures.

HiPace 30 Neo: Smallest Hybrid-Bearing High-Power Turbopump on the Market

The new HiPace 30 Neo turbopump from Pfeiffer Vacuum is a vacuum pump for compact analysis systems and portable applications.

Semiconductor Assembly and Test Facility Database Now Tracks OSAT and Integrated Device Manufacturers in 670 Facilities

New edition of SEMI’s database tracks 33% more facilities and highlights advanced packaging and factory certifications.

MPI Corporation’s Advanced Semiconductor Test Division Joins Forces with Keysight Technologies

MPI Corporation announced a landmark partnership with Keysight Technologies, a global innovation partner delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster.

Archer Miniaturizes Biochip gFET Chip Design

Archer Materials Limited, a semiconductor company advancing the quantum computing and medical diagnostics industries, has designed a miniaturized version of its Biochip graphene field effect transistor chip for fabrication at a commercial foundry.

SEALSQ Launches SEALBOX

SEALSQ Corp today announced the launch of SEALBOX, its innovative solution for IoT device provisioning at the manufacturing level.

Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System

LA9300AD enables detection of shallow microscopic defects, contributing to reduced manufacturing costs and improved yield.

Toray Develops Hybrid Bonding Resin for Enhancing Yield and Reliability in Semiconductor Packaging

Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding).

New Study Shows Analog Computing Can Solve Complex Equations and Use Far Less Energy

UMass Amherst research demonstrates that a memristor device can solve complex scientific problems using significantly less energy, overcoming one of the major hurdles of digital computing.

Quantum Experts Join Forces to Revolutionize European Quantum Computing

ORCA Computing, Pixel Photonics, Sparrow Quantum, and the Niels Bohr Institute (NBI) announce their collaboration on the Eurostars project ‘SupremeQ.’

Adeia Chooses Veeco to Accelerate Next-Generation Advanced Packaging Applications

Veeco Instruments Inc. today announced that Adeia Inc., a semiconductor R&D innovator has chosen the WaferStorm Wet Processing Systems for advanced packaging applications.

Global Semiconductor Materials Market Set to Achieve Record Highs

TECHCET forecasts a rebound in the global semiconductor materials market this year.

Researchers Design New Analog Chip Architecture With High Precision

Design combines the best of digital and analog computing and delivers >10x energy efficiency.

Adeia Presents Metrology Techniques for Improved Yield in Hybrid Bonding at IMAPS Device Packaging Conference 2024

Adeia Inc. will showcase the latest developments in hybrid bonding technology at the 20th Annual Device Packaging Conference (DPC 2024) on March 18-21, 2024, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona

Advancing Toward Wearable Stretchable Electronics

Researchers at Stanford have been working on skin-like, stretchable electronic devices for over a decade.

Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem

Cadence Design Systems, Inc. today announced a collaboration with Arm to deliver a chiplet-based reference design and software development platform to accelerate software-defined vehicle (SDV) innovation.

Intel Appoints Stacy Smith to Board of Directors

Intel Corporation today announced that Stacy Smith, executive chairman of Kioxia Corporation, formerly Toshiba Memory Corporation, and chair of Autodesk Inc., was appointed to Intel’s board of directors, effective immediately. Smith will serve as an independent director and join the board’s Audit & Finance Committee.

SemiQon Announces Shipping of its Silicon-Based 4-qubit Quantum Chip and Transistors

Research groups around the world are now using these first-generation silicon-based chips helping the industry step faster to the million qubit level of quantum computing.

Featured Video

Winnie Nabea, Global Product Manager at Mettler-Toledo Thornton, explains the importance of monitoring silica in ultra-high purity (UHP) water used in semiconductor manufacturing plants. Silica is one of the most critical indicators of the health of the water system. A rise in silica levels means the resin is approaching exhaustion and needs to be regenerated. If silica is not monitored, contamination of the ultrapure water can occur. She explains where silica should be monitored, outside factors that may cause silica issues, the best methods for monitoring silica, and how Mettler-Toledo is helping semiconductor manufacturers monitor the overall health of their water treatment plants.

Featured Products

EVENTS

march

202418marAll Day21IMAPS 20th International Conference & Exhibition on Device PackagingWe-Ko-Pa Resort and Conference Center, 10438 N Fort McDowell Rd

202420marAll Day22SEMICON China 2024Shanghai New International Expo Centre, 2345 Longyang Rd, Shi Ji Gong Yuan, PudongFeatured

april

202402aprAll Day03US International Semiconductor Executive SummitFairmont Scottsdale Princess

202410aprAll Day112024 CMC ConferenceCrowne Plaza Phoenix-Chandler Golf Resort, San Marcos Place OneFeatured

202421aprAll Day25SESHA SymposiumHilton Resort at the Peak, 7677 North 16th Street, Phoenix, AZ 85020

202430aprAll Day01mayThermal Management Expo 2024Suburban Collection Showplace, 46100 Grand River Ave. Novi, MI 48374Featured

202401mayAll Day02MEMS & Sensors Technical Congress — MSTC 2024University of California, Los Angeles, 405 Hilgard Avenue, Covel Commons in Sunset Village, Housing at Luskin CenterFeatured

may

202430aprAll Day01mayThermal Management Expo 2024Suburban Collection Showplace, 46100 Grand River Ave. Novi, MI 48374Featured

202401mayAll Day02MEMS & Sensors Technical Congress — MSTC 2024University of California, Los Angeles, 405 Hilgard Avenue, Covel Commons in Sunset Village, Housing at Luskin CenterFeatured

202406mayAll Day09ESTECH 2024Contamination Control • Environmental Test/Reliability • Nanotechnology FacilitiesPlanet Hollywood, 3667 S Las Vegas BlvdFeatured

202413mayAll Day16Advanced Semiconductor Manufacturing Conference — ASMC 2024Hilton Albany, 40 Lodge StreetFeatured

202414mayAll Day17Display Week 2024San Jose McEnery Convention Center, 408 Almaden BlvdFeatured

202416may1:00 pm5:00 pmWomen in Semiconductors — WIS 2024Hilton Albany, 40 Lodge StreetFeatured