ASM Breaks Ground on New Innovation and Manufacturing Center in Hwaseong, Korea

ASM International N.V. will take its symbolic first step in bringing its US$100 million multi-year investment in Hwaseong (Dongtan), South Korea, to fruition, with the groundbreaking ceremony tomorrow on its expanded innovation and manufacturing center.

KRISS Propels Quantum and AI Research with New Skyrmion Transistors

This breakthrough paves the way for the development of next-generation ultra-low-power devices and is anticipated to make significant contributions to quantum and AI research.

BOE Presents Trailblazing Semiconductor Display Tech at SID Display Week 2023

It was the 60th edition of the SID Display Week and coincided with the 30th anniversary of the founding of BOE, a global leader in the semiconductor display industry.

Singapore-based Start-up SiNBLE Launches IC Design Implementation Service

Singapore-based start-up SiNBLE announced its official launch today, offering the integrated circuit (IC) and subsystem design implementation service.

Seoul Semiconductor Unveils 2nd-generation LED Technology for Future Displays at Display Week 2023

During this exhibition, Seoul Semiconductor will showcase microLED displays enabled by its WICOP Pixel technology that delivers the highest level of brightness in the industry.

Toshiba Releases Small Photorelay with High Speed Turn-On Time that Helps Shorten Test Time for Semiconductor Testers

Toshiba Electronic Devices & Storage Corporation has launched “TLP3476S,” a photorelay in the S-VSON4T package that cuts turn-on time to half that of Toshiba’s current product, TLP3475S. Volume shipments start today.

Michigan Announces State’s Largest-Ever Push to Achieve Global Semiconductor Superiority

Michigan Lt. Gov. Garlin Gilchrist II announced today the Great Lakes State is launching its largest-ever campaign to promote careers, recruit talent and attract new businesses to fill jobs in Michigan’s thriving semiconductor industry. 

NXP Semiconductors Announces Changes to its Board of Directors

The Board of Directors of NXP has appointed Ms. Julie Southern to serve as its Chair, effective immediately.

Alchip Technologies Sets Record Q1 Revenue

Historically strong artificial intelligent chip shipments to North American customer accounted for much of the significant jump in first quarter revenue, according to President and CEO Johnny Shen.

IEEE International Electron Devices Meeting (IEDM) Announces 2023 Call for Papers

Under the theme “Devices for a Smart World Built Upon 60 Years of CMOS,” the 69th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.

Breakthrough in Computer Chip Energy Efficiency Could Cut Data Center Electricity Use

Researchers at Oregon State University and Baylor University have made a breakthrough toward reducing the energy consumption of the photonic chips used in data centers and supercomputers.

Ayar Labs Adds $25 Million in Expansion of Its $130 Million Series C

Ayar Labs today announced it has raised an additional $25 million in Series C1 funding, bringing its total Series C raise to $155 million.

Semiconductor Chemical Revenues Fall as Energy Prices Rise

Wet chemical market decline follows wafer start slowdown.

EV Group and Dymek Company Form Joint Venture Company in Malaysia

EV Group and Dymek Company today announced that they have established a new joint venture company in Malaysia.

SEMI North America Advisory Board Welcomes New Members From ASML and Breker Verification Systems

SEMI today announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, co-founder, CFO and COO of Breker Verification Systems, and Michael Lercel, Senior Director of Global Strategic Marketing at ASML.

Applied Materials Convenes Leaders from Industry, Academia and Government at “Summit to Advance Semiconductor Leadership”

Applied Materials, Inc. today hosted the Summit to Advance Semiconductor Leadership – an event focused on exploring solutions for overcoming key challenges facing the semiconductor industry on its path to becoming a $1 trillion market over the next decade.

NVIDIA Collaborates With Microsoft to Accelerate Enterprise-Ready Generative AI

NVIDIA today announced that it is integrating its NVIDIA AI Enterprise software into Microsoft’s Azure Machine Learning to help enterprises accelerate their AI initiatives.

Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027

Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022.

Imec First to Demonstrate Conductor Films on 300mm Wafers with Lower Resistivity than Cu and Ru

This week, at the 2023 IEEE International Interconnect Technology Conference (2023 IEEE IITC), imec provides the first experimental evidence that the resistivity of a thin conductor film on a 300mm Si wafer can be lower than that of Cu and Ru, which are currently used in interconnect metallization schemes.

XlynX Crosslinker Enables Ultra-Stable Perovskite Solar Cells

The past decade has seen remarkable progress in the field of perovskite solar cells (PSCs), a next-generation technology that offers a lower cost and easier to manufacture alternative to conventional silicon solar cells.

SEMICON Southeast Asia 2023 Opens Tomorrow with Chip Industry Resilience and Growth in Focus

SEMICON Southeast Asia opens tomorrow with critical semiconductor industry topics including supply chain resilience, sustainability, Smart Manufacturing, Smart Mobility, Smart MedTech, and workforce development in focus.

NY CREATES Announces New International Partnership

The New York Center for Research, Economic Advancement, Science, Technology and Engineering (NY CREATES) and the Korea Institute of Advancement of Technology (KIAT) recently signed a Joint Declaration to promote collaboration and partnership between the two organizations in the field of technological innovation, with a primary focus on semiconductors.

Purdue Signs Landmark U.S.-Japan Agreement in Semiconductors at G7 Summit

On Sunday (May 21) in Hiroshima, Japan, Purdue President Mung Chiang signed another landmark international agreement, partnering with Micron, Tokyo Electron and other educational institutions in the United States and Japan to establish the “UPWARDS Network” for workforce advancement and research and development in semiconductors.

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