MAGAZINE
March
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
FormFactor Doubles Capacity at Taiwan Service Center to Meet Growing Demand
Strategic investment enhances local capabilities to elevate customer support and satisfaction with FormFactor products.
Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
Ansys today announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC’s N2 silicon process technology.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
Sivers Semiconductors Announces Strategic OEM Partnership with O-Net Technologies
Sivers Semiconductors AB today announced a strategic partnership with O-Net Technologies to produce high-performance external laser sources, a critical component enabling next-generation AI data center architectures.
Tokyo Electron and IBM Renew Collaboration for Advanced Semiconductor Technology
Today, IBM and Tokyo Electron (TEL) announced an extension of their agreement for the joint research and development of advanced semiconductor technologies.
Exploring AI’s Role in Decarbonizing the Chemical Industry: A Multi-Scale Perspective
As the chemical industry seeks sustainable transformation, decarbonization requires intelligent solutions across multiple scales to enhance efficiency and reduce emissions. A research team led by Professor Xiaonan Wang at Tsinghua University has systematically reviewed AI-driven multi-scale smart systems for decarbonizing this energy-intensive sector.
lowRISC and SCI Semiconductor Release Sunburst Chip Repository for Secure Microcontroller Development
Open source release accelerates path to market for commercial CHERIoT-based secure microcontrollers, supporting industry adoption and innovation.
Natcast Announces Dr. Craig Child as Director of the CHIPS for America EUV Accelerator
Industry veteran will lead Natcast on-site staff and enable NSTC Members and Natcast researchers to leverage state-of-the-art EUV technology in advancing innovation and U.S. economic and national security.
UMC Unveils New Fab Expansion in Singapore in Grand Opening Ceremony
New 22nm fab to be one of the most advanced semiconductor manufacturing facilities in Singapore and is set to create approximately 700 new jobs.
Keysight Unveils Architecture for Scaling AI Data Centers
Keysight Technologies, Inc. introduces the Keysight Artificial Intelligence (KAI) architecture, a portfolio of end-to-end solutions designed to help customers scale artificial intelligence (AI) processing capacity in data centers by validating AI cluster components using real-world AI workload emulation.
Altera Starts Production Shipments of Industry’s Highest Memory Bandwidth FPGA
Altera Corporation today announced production shipments of its Agilex 7 FPGA M-Series, the industry’s first high-end, high-density FPGA to feature integrated high bandwidth memory and support for DDR5 and LPDDR5 memory technologies
Completion of New Production Facility for Semiconductor Manufacturing Equipment in Kasado Area
Hitachi High-Tech Corporation announced that the new production facility for semiconductor manufacturing equipment was completed and started the operation on March 17, 2025.
NEDO Approves Rapidus’ FY2025 Plan and Budget for 2nm Semiconductor Projects
Rapidus Corporation today announced that its plans and budget for fiscal year 2025 have been approved by Japan’s New Energy and Industrial Technology Development Organization (NEDO).
Ayar Labs Unveils World’s First UCIe Optical Chiplet for AI Scale-Up Architectures
Company achieves breakthrough with 8 Tbps bandwidth, enhancing AI performance and efficiency with only openly available optical chiplet.
Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
This system is designed to meet the growing demand for high-throughput electro-optical testing of silicon photonic wafers driven by co-packaged optics (CPO) applications.
HieFo Introduces High Efficiency CW Lasers for Silicon Photonics Transceivers
HieFo announced today the product launch of multiple new high-efficiency Continuous Wave DFB indium phosphide (InP) lasers, designed to address the ever-increasing demands of silicon photonics based optical transceivers.
NHanced Semiconductors President Robert Patti to Detail “Foundry 2.0” at SEMIEXPO Heartland
New manufacturing model extends Moore’s Law via advanced packaging, employing a range of 3D IC processes.
PhotonDelta and Silicon Catalyst Announce Strategic Collaboration
Collaboration covers access to Silicon Catalyst’s comprehensive incubation program to deliver expertise and access to funding.
Retym Launches Out of Stealth with $180 Million to Drive AI Infrastructure Innovation
Retym (pronounced “Re-Time”), a semiconductor firm, has emerged from stealth with over $180 million raised across multiple rounds to drive AI Infrastructure Innovation.
Imec Pioneers Photonic Code-Division Multiplexing FMCW 144GHz Distributed Radar
Technology could revolutionize next-generation driver assistance systems and other high-precision sensing applications
GlobalFoundries Certifies Ansys Lumerical Photonic Design Tools for GF Fotonix Platform
Ansys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform.
Gstar Speeds Up Indonesian Silicon Wafer Plant Setup with Equipment Shipment
Gstar has marked a significant milestone with the shipment of its first batch of core equipment for its new photovoltaic manufacturing facility in Indonesia.
SEALSQ and IC’ALPS Join Forces to Advance Post-Quantum Secure ASICs for Automotive Functional Safety
SEALSQ Corp. today announces a strategic collaboration with IC’ALPS, a ASIC design house specializing in custom integrated circuits ready for IATF16949 standard, mastering Functional Safety for ISO 26262 with solutions tailored to meet the required ASIL levels.
xMEMS Introduces Lassen, its First “Amplifier-less” High-Performance Silicon MEMS Tweeter Speaker
xMEMS Labs today announced xMEMS Lassen, the company’s newest innovation for delivering micro fidelity (µFidelity) audio to mass-market consumer earbuds.
Featured Video
At SEMICON West 2024, Editor-in-Chief Pete Singer caught up with Nordson TEST & INSPECTION’s Carla Furanna who provides some insights into the company’s products for front, middle and backend applications. Products highlighted at the show include WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), and Gen 7™ Acoustic Micro Imaging (AMI) system. Additionally, the innovative SpinSAM™ AMI system was unveiled for the first time at the show. The new system delivers industry-leading throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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