WHY YOU SHOULD ATTEND OUR FIRST EVER NATIONAL SEMICONDUCTOR INFRASTRUCTURE REAL ESTATE EVENT — USE CODE SEMICONDUCTOR20 for $20 off

America is doubling down on semiconductor investment at a national, state and a local level. CHIPS Act has been a major catalyst in the recent semiconductor real estate boom, but that is not the only Act that has passed in recent years showing support from the Government. In 2021, the United States Innovation and Competition Act (USICA) was passed, which provides funding for FY2022-FY2026 to support U.S. semiconductor manufacturing, research and development, and supply chain security. This support from the very top has propelled semiconductor real estate and transformed communities across America. 

At this event, we will discuss semiconductor real estate and discuss the most significant pain points for semiconductor companies when looking for commercial real estate as well as the opportunities that are still available in this booming sector. 

What our all-star panelists will discuss:

– Site selection (proximity to power, water transportation and skilled labor)

– Regulations (managing chemical, radiation exposure and electrical hazards)

– Development and design

– Funding and Capital Markets

Join us this November in Phoenix, AZ for our first ever semiconductor infrastructure real estate event!

Please email [email protected] with any questions, comments or requests to speaker and/or sponsor!

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is a 4-day course that offers an in-depth look into the semiconductor manufacturing process, and the individual processing technologies required to make them. We place special emphasis on the basics surrounding each technique, and we delve into the current issues related to manufacturing the next generation devices. This course is a must for every manager, engineer and technician working in the semiconductor industry, using semiconductor components or supplying tools to the industry.

By focusing on the basics of each processing step and the issues surrounding them, participants will learn why certain techniques are preferred over others. Our instructors work hard to explain how semiconductor processing works without delving heavily into the complex physics and mathematical expressions that normally accompany this discipline.

Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of disciplines in order to effectively perform failure analysis. This requires knowledge of subjects like: design, testing, technology, processing, materials science, chemistry, and even optics! Failed devices and low yields can lead to customer returns and idle manufacturing lines that can cost a company millions of dollars a day. Your industry needs competent analysts to help solve these problems. Failure and Yield Analysis is a 4-day course that offers detailed instruction on a variety of effective tools, as well as the overall process flow for locating and characterizing the defect responsible for the failure. This course is designed for every manager, engineer, and technician working in the semiconductor field, using semiconductor components or supplying tools to the industry.

By focusing on a Do It Right the First Time approach to the analysis, participants will learn the appropriate methodology to successfully locate defects, characterize them, and determine the root cause of failure.

Package reliability and qualification continues to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can involve tradeoffs between performance and reliability; assessing the impact of new materials; dealing with limited margins, and other factors. This requires information on subjects like: statistics, testing, technology, processing, materials science, chemistry, and customer expectations. While customers expect high reliability levels, incorrect testing, calculations, and qualification procedures can severely impact reliability. Semiconductor Reliability and Product Qualification is a 4-day course that offers detailed instruction on a variety of subjects pertaining to semiconductor reliability and qualification. This course is designed for every manager, engineer, and technician concerned with reliability in the semiconductor field, qualifying semiconductor components, or supplying tools to the industry.