DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor

DENSO CORPORATION and Quadric.inc have signed a development license agreement for a Neural Processing Unit (NPU), which is a semiconductor specialized for the arithmetic processing of AI.

Pfeiffer Vacuum+Fab Solutions Presents the New Generation of Rotary Vane Vacuum Pumps

Pfeiffer Vacuum+Fab Solutions introduces DuoVane, a new series of rotary vane vacuum pumps. Usable worldwide, reliable and efficient, they are the optimized successors to the proven pumps from the Pascal and DuoLine series.

Infineon Unveils the World’s Thinnest Silicon Power Wafer

After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon Technologies AG has unveiled the next milestone in semiconductor manufacturing technology.

Leading University Selects Veeco’s Molecular Beam Epitaxy System

Veeco Instruments Inc. announced today that it has received an order from the Ohio State University for its GENxcel R&D Molecular Beam Epitaxy (MBE) System.

Ultraprecise Method of Aligning 3D Semiconductor Chips Invented at UMass Amherst

The approach uses lasers and holograms and can detect misalignment as small as 0.017 nanometers.

Applied Materials and National University of Singapore Expand Semiconductor Research Lab

New phase will include larger, more advanced cleanroom, establishment of a Professorship at NUS, and new programmes for talent development.

Texas Instruments Expands Internal Manufacturing for GaN Semiconductors

Texas Instruments today announced it has begun production of gallium nitride (GaN)-based power semiconductors at its factory in Aizu, Japan.

Magnachip Expands Production of 7th Generation MXT LV MOSFETs

Magnachip Semiconductor Corporation announced today the expansion of production for its 7th generation 1)MXT LV MOSFETs, which are based on Magnachip’s Super Short Channel FET technology.

Towards Implementing Neural Networks on Edge IoT Devices

Researchers propose a novel magnetic RAM-based architecture that leverages spintronics to realize smaller, more efficient AI-capable circuits.

Critical Manufacturing Brings Highly Advanced Semiconductor MES Solution to SEMICON Europa

Critical Manufacturing is returning to SEMICON Europa 2024 to showcase its advanced Manufacturing Execution System (MES), tailored to the unique needs of the semiconductor industry.

ZEISS Launches New Crossbeam 550 Samplefab FIB-SEM

New TEM preparation platform with industry-leading automation yield.

New DUV Micro-LED Array Advances Maskless Photolithography

A team led by Prof. Sun Haiding from the University of Science and Technology of China (USTC) developed a vertically integrated micro-scale light-emitting diode (micro-LED) array, which was then applied in deep ultraviolet (DUV) maskless photolithography system for the first time.

Renesas Collaborates with Intel on Power Management Solution for New Intel Core Ultra 200V Series Processors

Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel Core Ultra 200V series.

US CHIPS Act Set to Reshape Helium Demand in the US

Two years after signing the US Chips Act into law for onshore chip manufacturing, over US$30 billion of the total US$39 billion in direct incentives have been awarded to date.

Tech and Talent to Supercharge the Semiconductor Industry

New CHIPS and Science Act funding supports Arizona State University efforts to create an ultra-energy-efficient chip and fill microelectronics workforce shortages.

Sunlit Chemical Expands Global Reach with U.S. Facility Opening in Phoenix

The new plant, strategically located in Phoenix, Ariz., will provide critical materials to support the U.S. semiconductor industry.

Top MRAM Maker Selects ClassOne Solstice S8 Single-Wafer System for High-Volume Manufacture of Non-Volatile MRAM Devices

The customer selected the Solstice system for its ability to deliver repeatable wet processing essential to meeting high-volume manufacturing (HVM) requirements.

DELO Introduces UV-Approach for Fan-Out Wafer-Level Packaging

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP).

EV Group Announces Management Board Expansion In Light Of Unabated Growth

EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced the expansion of its management board.

The Busch Group Drives Sustainable Future Technologies

October 24 is International Day of Climate Action, which aims to raise awareness of climate change and to highlight the importance of environmental protection.

Fractile Licenses Andes Technology’s RISC-V Vector Processor

Andes Technology, a supplier of high-efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, announced a partnership with Fractile, the company building the chips and systems needed to reach the next frontier of AI performance.

Broadcom President & CEO Hock Tan to Receive Global Semiconductor Alliance’s Highest Honor

Global Semiconductor Alliance (GSA) announced it will honor Hock Tan, President and CEO of Broadcom, with its prestigious Dr. Morris Chang Exemplary Leadership Award at this year’s Annual Awards Celebration on Dec. 5, 2024.

Earthquake on a Chip: Scientists Harness Sound Waves on the Surface of a Microchip

New chip design uses special glass to allow interactions between light and sound.

Featured Video

At SEMICON West 2024, Advanced Energy further expanded on the theme of ‘Advancing the Angstrom Era’ by demonstrating its latest plasma power, high-voltage and critical temperature measurement and control technologies. Editor-in-Chief Pete Singer talked to Dhaval Dhayatkar, a Senior Director of Marketing of Plasma Power at Advanced Energy, about the company’s latest products, including new, modular platforms that meet demands for high power, high efficiency and power density AC-DC solutions across semiconductor processing and test equipment.

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