CG Power and Industrial Solutions Limited, Renesas, and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.

Airspace Expands Presence in Asia

Airspace Technologies, Inc., the California-based provider of critical logistics solutions powered by AI, announced its recent expansion into Southeast Asia.

Jon Kemp Named Chair of SEMI Board of Industry Leaders

DuPont today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI.

Edgewater Wireless Selected to Join the Alliance of Semiconductor Innovation Canada (ASIC)

Edgewater Wireless Systems Inc. announced that it has joined the Alliance of Semiconductor Innovation Canada (‘ASIC’),an organization dedicated to promoting the Canadian semiconductor ecosystem.

AI-enabled Atomic Robotic Probe to Advance Quantum Material Manufacturing

Scientists from the National University of Singapore (NUS) have pioneered a new methodology of fabricating carbon-based quantum materials at the atomic scale by integrating scanning probe microscopy techniques and deep neural networks.

Renesas Unveils Powerful Single-Chip RZ/V2H MPU for Next-Gen Robotics with Vision AI and Real-Time Control

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its popular RZ Family of microprocessors (MPUs) with a new device targeting high-performance robotics applications.

Pfeiffer Vacuum Introduces New HiCube Neo Turbo Pumping Station

With pumping speeds ranging from 80 to 800 l/s, the HiCube Neo vacuum pumping station is ideal for demanding high vacuum and ultra-high vacuum applications.

FormFactor and Tabor Electronics Collaborate to Demonstrate a Full Stack 5-Qubit Quantum Computer, Powered by QuantWare

FormFactor, Inc., a semiconductor test and measurement supplier, together with Tabor Electronics LLC, today presented the Echo-5Q project, a demonstration of a full stack 5-Qubit Quantum Computer for research and education, leveraging a QPU supplied by QuantWare.

TANAKA Precious Metals Appoints Bodo Albrecht as President for the Americas

TANAKA Precious Metals announced the appointment of Bodo Albrecht as President of TANAKA Kikinzoku (America).

Shahriar Moinian of Broadcom Wins Si2 Pinnacle Award

Shahriar Moinian, distinguished engineer at Broadcom Corp., has won the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for their exceptional contributions to Si2’s success as a leading semiconductor research and development joint venture.

Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies

IPC, the global association for electronics manufacturing, praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.

CHIPS for America Announces Funding Opportunity to Expand U.S. Semiconductor Packaging

Today, the U.S. Department of Commerce issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors.

Wise-integration Raises €15 Million in Series B Funding Round to Support International Growth for Its Innovative GaN Solutions

Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power supplies, today announced financing of €15 million.

Silicon Wafers Market – Growth on the Horizon 2024-2028

Wafer shipments expected to pick up in late 2024.

Keysight Introduces Leading Benchmarking Solution to Fast-Track Deployment of Artificial Intelligence Infrastructure

The solution significantly improves benchmarking of new AI infrastructures with unprecedented scale and efficiency.

UAlbany Partners with DeepHow on AI Training for Semiconductor Manufacturing

The University at Albany’s College of Nanotechnology, Science, and Engineering (CNSE) is partnering with software developer DeepHow to adapt and deploy the company’s next-generation artificial intelligence video training platform.

Ancora’s Double Side Cooling GaN-FET Demonstrates Superior Robustness and Long Term Reliability

Ancora Semiconductor Inc. has recently passed a series of rigorous DMTBF (Demonstrated Mean Time Between Failures) tests for its double-sided cooling GaN (Gallium Nitride) field-effect transistor.

Samsung and Nova Publish Joint Research at SPIE Advanced Lithography Conference

The papers will be presented at the SPIE by Nova and Samsung, at the Metrology, Inspection and Process Control conference.

Rinchem Opens Massive Custom Chemical Warehouse in Surprise, Arizona to Support Semiconductor Giant

This facility, boasting 123,516 square feet and 16,000 pallet positions, allows Rinchem to strategically support the booming semiconductor industry in the Phoenix Metro Area.

Vishay Intertechnology Appoints David McConnell Chief Financial Officer

Vishay Intertechnology, Inc. today announced that its Board of Directors has appointed David McConnell, Senior Vice President -Corporate Treasurer and Risk Management, to the role of Executive Vice President – Chief Financial Officer, replacing Lori Lipcaman who is resigning from that position.

eBeam Initiative Marks 15-Year Anniversary

The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today marks its 15-year anniversary at an annual meeting being held in conjunction with the SPIE Advanced Lithography + Patterning Conference in San Jose.

Accellera Systems Initiative Honors Shalom Bresticker with First Distinguished Service Award

Accellera Systems Initiative (Accellera) announced today that Shalom Bresticker, a longtime friend and contributor to Accellera standards efforts, is honored with the first Distinguished Service Award.

Samsung Develops Industry-First 36GB HBM3E 12H DRAM

Samsung Electronics Co., Ltd. today announced that it has developed HBM3E 12H, the industry’s first 12-stack HBM3E DRAM and the highest-capacity HBM product to date.

Featured Video

Process Technology’s co-CEOs Jody Richards and Sid Srivastava share a vision of how the company is bringing new innovation to heating and power in the semiconductor industry, “Enabling our customers to achieve more with products that do more.” At SEMICON West 2023, Editor-in-Chief Pete Singer talked to the duo about the company’s sustainability efforts and new products, including the Lufran DI water recycling system, the SHX explosion proof heater for IPA, and the Dynatronix power supply for electrochemical deposition.

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202406marAll Day08APE 2024 — ASIA PHOTONICS EXPOMarina Bay Sands SingaporeFeatured

202418marAll Day21IMAPS 20th International Conference & Exhibition on Device PackagingWe-Ko-Pa Resort and Conference Center, 10438 N Fort McDowell Rd

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