What’s in the October Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue.

Egis Group Announces Strategic Collaboration with Arm

This collaboration enables both Egis and Alcor Micro to leverage Neoverse CSS for new chiplet solutions targeting the High-Performance Computing (HPC) and generative AI application markets, combining the strength of Egis’ specialized integrated circuit design and the power efficiency of Arm technology.  

Rambus Unveils Industry-First Complete Chipsets for Next-Generation DDR5 MRDIMMs and RDIMMs

Rambus Inc. today unveiled industry-first, complete memory interface chipsets for Gen5 DDR5 RDIMMs and next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs).

What’s in the October Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the October issue.

Intel and AMD Form x86 Ecosystem Advisory Group

Intel Corp. and AMD today announced the creation of an x86 ecosystem advisory group bringing together technology leaders to shape the future of the world’s most widely used computing architecture.

Spin-Wave Reservoir Chips Can Prove Revolutionary in the Edge Computing Technology

“Our ultimate goal is to establish edge computing technology utilizing spin-wave reservoir chips, with the aim of developing a wide range of applications including biomedical imaging and autonomous vehicles.” said Sekiguchi.

Biden-Harris Administration Announces Preliminary Terms with Wolfspeed

Proposed CHIPS investment of up to $750M would support construction of world’s largest silicon carbide 200mm ecosystem and create over 5,000 jobs in North Carolina and New York.

SurplusGLOBAL Appoints Dr. Benjamin Jeong as Chief AI Officer

SurplusGLOBAL, a platform company specializing in semiconductor equipment and parts, is accelerating innovation in the semiconductor distribution industry by incorporating artificial intelligence (AI) technology.

Seoul Semiconductor’s Patent Enforcement Leads to LED Sales Ban of Infringing Products in Eight European Countries

Seoul Semiconductor Co., Ltd. and its affiliate Seoul Viosys announces that the Unified Patent Court has issued a judgment ordering a sales ban, recall and destruction of products infringing Seoul’s “No Wire” (WICOP) patent in eight European countries.

Mouser Electronics Celebrates Its 2024 Best-in-Class Award Winners

Mouser Electronics, Inc. announced the 2024 recipients of the Mouser Best-in-Class Awards. The annual awards event occurred on October 10 near the global distributor’s corporate headquarters in the Dallas/Fort Worth Metroplex.

SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future

Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.

SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel

SEMIFIVE, a design solution provider and pioneer of platform-based custom silicon solutions, has announced the conclusion of a contract with HyperAccel to develop a generative AI chip, Bertha, for mass production.

Lattice Announces CFO Transition

Lattice Semiconductor today announced the resignation of its Chief Financial Officer (CFO), Sherri Luther, effective immediately, to pursue a new opportunity.

UCSB Researchers Create the First Ever Visualization of Photoexcited Charges Traveling Across the Interface of Two Semiconductor Materials

UC Santa Barbara researchers have achieved the first-ever “movie” of electric charges traveling across the interface of two different semiconductor materials.

Engineering Perovskite Materials at the Atomic Level Paves Way for New Lasers, LEDs

Researchers have developed and demonstrated a technique that allows them to engineer a class of materials called layered hybrid perovskites (LHPs) down to the atomic level, which dictates precisely how the materials convert electrical charge into light.

Energetiq Technology Unveils Next-Generation Electrodeless Z-Pinch EUV Light Source for Metrology

Energetiq Technology announced the launch of the EQS-10 Electrodeless Z-Pinch EUV Light Source.

IMEC Announces Commitments to Automotive Chiplet Program

This week, at an exclusive gathering in Detroit (MI), bringing together the global automotive ecosystem to discuss the evolution towards chiplets in cars (Automotive Chiplet Forum 2024), imec announced that Arm, ASE, BMW Group, Bosch, Cadence Design Systems, Inc., Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo are the first that have committed to join its Automotive Chiplet Program (ACP).

SEALSQ Getting Ready for the Arrival of Quantum Computers

As quantum-computing brings a paradigm shift in computational power by harnessing the principles of quantum mechanics, the need for enhanced security has never been greater.

Lantronix Announces Five New System-in-Package Solutions Powered by Qualcomm

Lantronix Inc. today announced its powerful new System-in-Package (SiP) solutions powered by Qualcomm Technologies’ chipsets that reinforce Lantronix’s position in industrial and enterprise IoT innovation, bringing advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the edge.

Infineon and AWL-Electricity Partner to Improve Wireless Power with GaN Power Semiconductors

Infineon Technologies AG today announced a partnership with Canada-based AWL-Electricity Inc., a pioneer in MHz resonant capacitive coupling power transfer technology.

Ceramic Equipment Components Growth Trend 2025

Semiconductor equipment components market to grow in support of chip expansions.

Keysight Unveils 3kV High Voltage Wafer Test System for Power Semiconductors

Increased productivity and efficiency with one-pass test enabled by a high-voltage switching matrix.

Research to Use Machine Learning to ’Reverse-Engineer’ New Composite Materials

Professors receive NSF grant for deep-learning model that can customize microarchitecture based on specific needs.

ROHM’s New PWM Controller ICs with SOP Package for Power Supplies in a Wide Variety of Industrial Applications

ROHM Semiconductor today announced new external FET-type controller ICs utilizing PWM current control mode optimized for AC-DC power supplies in various industrial applications.

Featured Video

Marposs offers a complete range of non-contact sensors used for thin-film metrology, wafer dimensional characterization, wafer inspection and packaging inspection. The company’s sensors can work inside automatic inspection machines to find defects and dimensional variation. At SEMICON West 2024, Editor-in-Chief Pete Singer talked to Frank Powell, business development manager at MARPOSS about new solutions for the semiconductor industry and the Solarius line of 3D measurement technology, including the new Polaris and Polaris Plus 3D systems.

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