MAGAZINE
October
PI’s New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
PI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
xMEMS Introduces Sycamore, a 1mm Thin Near-Field Full-Range MEMS Micro Speaker
xMEMS Labs, developers of the foremost platform for piezoMEMS innovation and creators of the world’s leading all-silicon micro speakers, today announced xMEMS Sycamore, the company’s latest breakthrough in micro fidelity (µFidelity) audio.
Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs
Renesas Electronics Corporation today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).
indie Semiconductor Extends Automotive Photonics Leadership With Advanced Optical Component Integration Capabilities
indie Semiconductor has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.
GlobalFoundries and U.S. Department of Commerce Announce Award Agreement on CHIPS Act Funding for Essential Chip Manufacturing
GlobalFoundries and the U.S. Department of Commerce have announced an award of up to $1.5 billion in direct funding to GF through the CHIPS and Science Act.
Revenues Continue to Rise on Mixed Performance, with a New Record High Expected in 2025
TECHCET has increased their latest forecast for total semiconductor revenues in 2024, now expected to gain nearly 13% over 2023, reaching > $617B.
Global Semiconductor Manufacturing Industry Records Strong Growth in Q3 2024, SEMI Reports
The global semiconductor manufacturing industry in the third quarter of 2024 showed strong momentum with all key industry indicators performing positive quarter-on-quarter (QoQ) increases for the first time in two years.
Global Semiconductor Alliance Announces 2024 Award Nominees
The prestigious awards will be presented at GSA’s Awards Celebration on Thursday, Dec. 5, 2024.
Natcast CEO Deirdre Hanford to Deliver Keynote Remarks at 2024 SIA Awards Dinner
Natcast is the non-profit entity operating the National Semiconductor Technology Center (NSTC), established by the CHIPS and Science Act.
C-Hawk Technology Pioneers Robotic Plastic Welding with New Roberto Platform for Semiconductor Equipment Manufacturing
C-Hawk Technology announced its new patent-pending Roberto platform, an integrated robotics system that automates plastic welding and sets new benchmarks for quality, precision, scalability and safety in manufacturing for plastic welded assemblies and subassemblies.
Sagence AI Emerges from Stealth Tackling Economic Viability of Inference Hardware for Generative AI
Sagence AI today emerged from stealth unveiling a groundbreaking advanced analog in-memory compute architecture that directly addresses the untenable power/performance/price and environmental sustainability conundrum facing AI inferencing.
Applied Materials Announces New Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing
Company convenes top semiconductor R&D leaders to advance high-performance, low-power AI chip packaging technologies.
CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins
The Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina.
TetraMem Inc and SK hynix Announce Research Partnership
Today, TetraMem Inc & SK hynix Inc announced that they have signed an SOW outlining their partnership on a joint research project to advance the promise of in-memory computing (IMC) for AI applications.
JEDEC Announces Enhanced NAND Flash Interface Standard With Increased Speeds and Efficiency
JEDEC Solid State Technology Association today announced the publication of JESD230G: NAND Flash Interface Interoperability Standard.
NVIDIA Accelerates Google Quantum AI Processor Design With Simulation of Quantum Device Physics
NVIDIA today announced it is working with Google Quantum AI to accelerate the design of its next-generation quantum computing devices using simulations powered by the NVIDIA CUDA-Q platform.
FormFactor Receives SK hynix Best Partner Award
FormFactor, Inc., a supplier of electrical test and measurement solutions for the semiconductor industry, announced today that it has been recognized as an outstanding partner by SK hynix, a global leader in DRAM and Flash memory manufacturing.
TechSearch International Analyzes Hybrid Bonding Developments and Panel Market Growth
In its latest Advanced Packaging Update, TechSearch International provides an update on developments in hybrid bonding including applications, technical challenges, and proposed solutions. The report focuses on hybrid bonding for high-performance applications.
AlixLabs Awarded 345,000€ Swedish Innovation Agency Grant
Funds awarded from Swedish innovation agency’s “Acceleration of deep tech companies 2024” call.
SEMI Europe Recognizes Schneider Electric as a Leader in Diversity and Inclusion at SEMICON Europa 2024
SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion announced Schneider Electric as the recipient of the 2023 SEMI Industry Leader in Diversity and Inclusion Award.
xMEMS Active Micro-Cooling “Fan on a Chip” Named as CES Innovation Awards 2025 Honoree
The recently announced xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling air pump for small, thin electronics devices and next-generation artificial intelligence (AI) solutions, has been named a CES Innovation Awards 2025 Honoree in the best in computer hardware and components category.
TANAKA Successfully Develops the World’s First Manufacturing Technology for Platinum Materials with Nano-Sized Crystal Grains
TANAKA Kikinzoku Kogyo K.K., which develops industrial precious metal products as one of the core companies of TANAKA Precious Metals, announced that it has succeeded in developing the world’s first bulk platinum with controlled crystal grain size in the nano scale.
NVIDIA’s AI-Driven Triumph Over Intel Powered by Strategic Innovations, GlobalData Reveals
In a historic shift, NVIDIA has taken Intel’s coveted spot on the Dow Jones Industrial Average.
Featured Video
Huber USA is focused on providing high precision thermoregulation solutions in research and industry, offering temperature control solutions for applications from -125°C to +425°C. At SEMICON West 2024, Editor-in-Chief Pete Singer talked to Huber semiconductor specialist Nate George about the company’s dynamic temperature control systems, including new Unistat 815 and TC100c CS chillers, classic heating and cooling circulators, its push into natural refrigerants, applications in deposition and etch, and its 4-year warranty, 24/7 service program.
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