MAGAZINE
January/February
What’s in the January/February Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the January/February issue.
Arteris Revolutionizes Semiconductor Design with FlexGen
Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today introduced FlexGen, a revolutionary, smart network-on-chip (NoC) interconnect IP.
eBeam Initiative Member Companies to Take Center Stage at SPIE Advanced Lithography and Patterning Conference
Member participation includes eight keynotes and nearly 300 presentations; live member event to provide insight on lithography and photomask trends.
What’s in the January/February Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the January/February issue.
Global Semiconductor Manufacturing Industry Reports Solid Q4 2024 Results, SEMI Reports
The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-on-year (YoY) growth across most of the key industry segments.
Applied Materials Accelerates Chip Defect Review with Next-Gen eBeam System
Applied Materials, Inc. today introduced a new defect review system to help leading semiconductor manufacturers continue pushing the limits of chip scaling.
Lam Research Ushers in New Era of Semiconductor Metallization with ALTUS Halo for Molybdenum Atomic Layer Deposition
Lam Research Corp. today unveiled ALTUS Halo, the world’s first atomic layer deposition (ALD) tool that harnesses the capabilities of the metal molybdenum in the production of leading-edge semiconductors.
Lam Research Unveils Industry’s Most Advanced Conductor Etch Technology to Date
Lam Research Corp. today introduced Akara, a breakthrough innovation in plasma etch and the most advanced conductor etch tool available.
Cambridge GaN Devices Secures $32M to Drive Global Growth in Power Semiconductor Industry
Cambridge GaN Devices has successfully closed a $32 million Series C funding round.
EV Group Highlights Revolutionary Temporary Wafer Bonding and Debonding Solution for HBM and 3D DRAM at SEMICON Korea
EV Group today announced that it is highlighting its IR LayerRelease temporary bonding and debonding (TB/DB) solution, as well other wafer bonding and lithography technologies, at the SEMICON Korea 2025 expo in Seoul, Korea on February 19-21.
Irresistible Materials Names Dinesh Bettadapur CEO
Bettadapur to drive the commercialization and market adoption of company’s innovative EUV photoresist platform.
Synopsys Teams Up with SEMI Foundation to Drive Workforce Development Initiatives in Semiconductor Industry
Synopsys, Inc. and the SEMI Foundation today announced the signing of a Memorandum of Understanding (MoU) at Synopsys’ corporate headquarters in Sunnyvale, Calif. to advance workforce development within the semiconductor chip design sector.
Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
Gartner Says Worldwide Semiconductor Revenue Grew 18% in 2024
Worldwide semiconductor revenue in 2024 totaled $626 billion, an increase of 18.1% from 2023, according to preliminary results by Gartner, Inc. Revenue is projected to total $705 billion in 2025.
New Biosensors Could Revolutionize Cancer Detection
BME researchers combine precision and simplicity in cell-free biosensors, transforming diagnostic tools.
SEMI ISS Europe 2025 Speakers to Address AI, Sustainability, Supply Chain Resilience, and Workforce Development
The SEMI Industry Strategy Symposium Europe (ISS Europe) 2025, March 12-14 in Sopot, Poland, is themed AI: Catalyst to Propel Europe’s Competitiveness.
IKO’s New High-Thrust Linear Motor Stage Delivers Long Stroke Lengths in Constrained Spaces
IKO announced its LT170H2 direct drive linear motor stage for dynamic applications such as semiconductor fabrication which require high thrust forces and long strokes.
Immunotherapy Against Melanoma: Efficacy Can Be Predicted With a Chip
A team of researchers have developed a “gut-on-chip” (a miniature model of the human intestine on a chip-sized device) capable of reproducing the main features of intestinal inflammation and of predicting the response of melanoma patients to immunotherapy treatment.
Mouser Electronics Honored with 2024 Distribution Excellence Award by Lattice Semiconductor
Mouser was recognized for having the broadest portfolio of in-stock Lattice products, as well as the support of Lattice’s online webstore platform.
HUHUTECH Launches Kumamoto Warehousing and Logistics Center in Japan
HUHUTECH International Group Inc., a professional provider of factory facility management and monitoring systems, today announced the official opening of its semiconductor industry-supporting warehousing and logistics center located in Kumamoto Prefecture, Japan, through its Japanese subsidiary, HUHU Technology Co., Ltd.
ULVAC Develops Roll-to-Roll Lithium Deposition System
ULVAC, Inc. announced the EWK-030, a roll-to-roll deposition system designed for lithium coating applications, scheduled for launch in May 2025.
Synopsys Expands Hardware-Assisted Verification Portfolio
Synopsys, Inc. today announced the expansion of its industry-leading hardware-assisted verification (HAV) portfolio with new HAPS prototyping and ZeBu emulation systems using the latest AMD Versal Premium VP1902 adaptive SoC.
Global Electronics and Semiconductor Materials Market to Reach $119.8 Billion by 2034
The electronics and semiconductor materials market is growing with AI, 5G, and automotive advancements. Key players like TSMC and Intel invest in SiC and GaN for high-performance chips.
E&R: Taiwan-Based Semiconductor Equipment Supplier Driving Advanced Packaging Innovation
E&R (E&R Engineering Corp.), a Taiwan-based semiconductor equipment manufacturer with 30 years of expertise, has supplied over 500 advanced semiconductor packaging tools to major OSATs worldwide, specializing in laser and plasma solutions.
Featured Video
Huber USA is focused on providing high precision thermoregulation solutions in research and industry, offering temperature control solutions for applications from -125°C to +425°C. At SEMICON West 2024, Editor-in-Chief Pete Singer talked to Huber semiconductor specialist Nate George about the company’s dynamic temperature control systems, including new Unistat 815 and TC100c CS chillers, classic heating and cooling circulators, its push into natural refrigerants, applications in deposition and etch, and its 4-year warranty, 24/7 service program.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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