MAGAZINE
July
Managing Complex Logistics in Today’s Semiconductor Industry
The complexity of the semiconductor manufacturing process is well known, but the logistics of supplying a megafab with equipment and materials can be equally complex. Delivering just one EUV lithography tool, for example, takes three Boeing 747 cargo planes, 40 freight containers and 20 trucks.
Researchers Develop Device to Make Artificial Intelligence More Energy Efficient
Energy consumption from artificial intelligence could be reduced by a factor of at least 1,000 with this device.
AMI Joins NXP Semiconductors Partner Program
AMI announced that it has formally joined the NXP Semiconductors Partner Program.
Managing Complex Logistics in Today’s Semiconductor Industry
The complexity of the semiconductor manufacturing process is well known, but the logistics of supplying a megafab with equipment and materials can be equally complex. Delivering just one EUV lithography tool, for example, takes three Boeing 747 cargo planes, 40 freight containers and 20 trucks.
Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility
Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced today it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act.
Fractile Raises $15M Seed Funding
Fractile, a UK company building a groundbreaking new AI chip to deliver exponential performance improvements for AI models, has today exited stealth and announced $15m (£12m) in seed funding.
IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory
Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules.
Analog Devices and Flagship Pioneering Announce Strategic Partnership
Analog Devices, Inc. (Nasdaq: ADI), a global semiconductor leader, and Flagship Pioneering, the bioplatform innovation company, today announced a strategic alliance to accelerate the development of a fully digitized biological world.
IEEE Leaders Reveal Top Three Technology Megatrends Driving the Need to Upskill and Reskill Employees
2024 Technology Megatrends predicted to boost productivity and future-proof the global workforce are Artificial General Intelligence, Digital Transformation, and Sustainability.
Intel Names Naga Chandrasekaran to Lead Foundry Manufacturing and Supply Chain
Dr. Chandrasekaran succeeds retiring Keyvan Esfarjani as chief global operations officer.
Boston Semi Equipment Launches New Test Site Module for Zeus Test Handler to Support Power IC Manufacturers
Boston Semi Equipment (BSE) today introduced a new test site module for its Zeus gravity feed test handler to support high-voltage and partial discharge (HVPD) applications in power electronics manufacturing.
Pusan National University Researchers Explore the Interplay Between High-Affinity DNA and Carbon Nanotubes
Researchers demonstrate the intricate interactions between single-stranded DNA sequences and carbon nanotubes.
Chiplet Summit to Focus on New Packages and AI Applications in 2025
Chiplet Summit announces its third annual event on January 21-23 at the Santa Clara Convention Center. The 2025 meeting focuses on a new level in chip design: system-in-package (SiP).
SiMa.ai and Ortecs Announce Agreement to Deliver Edge AI Technology in Israel
Through its partnership with SiMa.ai, Ortecs will expand its portfolio and provide its customers and the market in Israel with a new artificial intelligence offering.
KIOXIA Honored by FMS With Lifetime Achievement Award for 3D NAND Flash Invention
KIOXIA, the inventor of NAND flash memory, is the recipient of the FMS: the Future of Memory and Storage Lifetime Achievement Award for 2024.
Foam Fluidics Showcase Rice Lab’s Creative Approach to Circuit Design
Next-generation soft robotics and wearable technologies could sport foam-based fluidic circuits.
Quantum Transistors Awarded Up to €17.5M by European Innovation Council for Pioneering Solution Enabling Quantum Computing on a Chip
Quantum Transistors has been awarded up to €17.5 million by the European Innovation Council (EIC). Quantum Transistors received an initial grant from the EIC Accelerator of €2.5 million combined with a future equity investment of €15 million through the EIC Fund.
Growing Colorado’s Advanced Industries: Grants Look to Expand Semiconductor Industry into New Regions of Colorado
Today, the Global Business Development Division of the Colorado Office of Economic Development & International Trade (OEDIT) announced the first grant recipients of the Colorado CHIPS Community Support Program.
Imec Achieves Record-Low Charge Noise for Si MOS Quantum Dots Fabricated on a 300mm CMOS Platform
The results highlight the maturity of 300mm fab-based qubit processes ultimately enabling large-scale quantum computers.
AMD President Victor Peng to Retire
AMD today announced that AMD President Victor Peng is retiring effective August 30, 2024.
Pragmatic Semiconductor Appoints Murthy Renduchintala to Board of Directors
Semiconductor veteran joins the FlexIC technology pioneer enabling sustainable item-level intelligence in trillions of devices over the next decade.
EFC Gases & Advanced Materials Announce $210 Million Investment in Semiconductor Industry in McGregor, Texas
EFC Gases & Advanced Materials unveiled plans for a cutting-edge manufacturing facility in McGregor, Texas, following the recent acquisition of 195 acres of land from the City of McGregor.
Micron Introduces the World’s Fastest Data Center SSD
Micron Technology, Inc. today announced availability of the Micron 9550 NVMe SSD – the world’s fastest data center SSD and industry leader in AI workload performance and power efficiency.
SirenOpt Raises $6.6M in Seed Funding
Non-destructive solution evaluates material quality and improves industrial efficiency across battery, aerospace, semiconductor, electronics, and other advanced manufacturing industries.
Researchers Develop ‘Organ on a Chip’ for Better Drug Testing
Testing drugs is challenged by ethical and biological concerns. A group of academic researchers across institutions have joined forces with Virginia Tech’s Jeff Schultz to find a solution that could give human-oriented results with synthetic tools.
Featured Video
Huber USA is focused on providing high precision thermoregulation solutions in research and industry, offering temperature control solutions for applications from -125°C to +425°C. At SEMICON West 2024, Editor-in-Chief Pete Singer talked to Huber semiconductor specialist Nate George about the company’s dynamic temperature control systems, including new Unistat 815 and TC100c CS chillers, classic heating and cooling circulators, its push into natural refrigerants, applications in deposition and etch, and its 4-year warranty, 24/7 service program.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
EVENTS
September
