What’s in the March Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.

Successful Visualization of Two-Dimensional Electron Gas in High-Frequency/Power Device

The group led by Professor Naoya Shibata of the University of Tokyo, in collaboration with Sony Group Corporation, succeeded in directly observing a two-dimensional electron gas that accumulated at the semiconductor interface.

Kioxia and Western Digital Announce Newest 3D Flash Memory

Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology.

What’s in the March Issue?

Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.

JCET Accelerates Technology Upgrades and Transformation in 2022

JCET Group, a global provider of integrated circuit (IC) manufacturing and technology services, today announced its full year financial results for the year ended December 31, 2022.

Georgia Tech and GlobalFoundries to Collaborate on Joint Semiconductor Research and Workforce Development

New partnership to include educational opportunities for Georgia Tech students and faculty, STEM outreach, and joint R&D programs on GF technology.

Tokyo Electron Named Among the Top 500 Organizations in the 2023 Certified Health & Productivity Management Outstanding Organizations Recognition Program

It is the fourth year in a row that TEL and six TEL Group companies operating in Japan, together earned recognition in this program.

Global Wafer Level Optics Market to Reach US$ 24,908M by 2031 at Staggering CAGR of 51.07%

Additionally, the market is also expected to see a growth in volume, with a CAGR of 50.68% during the same period.

Industrial-Grade Silicon Carbide MOSFET from Diodes Incorporated Enables Higher Power Density

Diodes Incorporated introduces the latest addition to its portfolio of Silicon Carbide (SiC) products: the DMWS120H100SM4 N-channel SiC MOSFET.

U.S. Secretary of Commerce Gina Raimondo Announces Fiber Manufacturing Expansions in North Carolina

Today, as part of the Biden-Harris Administration’s Investing in America tour, U.S. Secretary of Commerce Gina Raimondo and Assistant Secretary of Commerce for Communications and Information Alan Davidson traveled to Hickory, NC to celebrate the announcement of new fiber optic cable production in the U.S. made possible by the Administration’s Internet for All Initiative.

New Global Semiconductor Packaging Materials Outlook – US$26B Market to Approach US$30B by 2027

TECHCET and TechSearch International, Inc. recently announced that the market for Semiconductor Packaging Materials totaled US$26.1 billion in revenues for 2022, and is forecasted to approach US$30 billion in 2027.

Synopsys.ai Unveiled as Industry’s First Full-Stack, AI-Driven EDA Suite for Chipmakers

At its annual Synopsys Users Group (SNUG) Silicon Valley Conference, Synopsys, Inc. (Nasdaq: SNPS) today launched Synopsys.ai, a suite of AI-driven solutions for the design, verification, testing and manufacturing of the most advanced digital and analog chips.

Wolfspeed Hosts the First Stop on the Biden Administration’s ‘Invest in America’ Tour at its Durham HQ

Today, Wolfspeed, Inc. hosted the first stop of President Joe Biden’s ‘Invest in America’ tour at the company’s Durham, N.C. headquarters.

New SIA Map Highlights Broad U.S. Semiconductor Ecosystem

The semiconductor ecosystem in the United States is broad and diverse, as illustrated by SIA’s new U.S. Semiconductor Ecosystem Map, a first-of-its-kind tool that allows users to explore industry activities across the country, including nearly 500 locations in 42 states. 

Omdia: Samsung Leads While BOE Increases Small Medium AMOLED Shipment Market Share in 2022 

New research from Omdia’s latest Small medium display market tracker indicates that, in 2022, Samsung maintained its top position with 56% of the total market in terms of small medium size AMOLED market share, with BOE gradually approaching Samsung at 12%.

New Chip Design to Provide Greatest Precision in Memory to Date

A team led by USC, MIT, and the University of Massachusetts, developed a protocol for devices to reduce “noise” and demonstrated the practicality of using this protocol in integrated chips.

ACM Research Receives First Purchase Order for Ultra C SiC Substrate Cleaning Tool

The platform leverages ACM’s patented Space Alternated Phase Shift (SAPS) cleaning technology which is designed to achieve more comprehensive cleaning without damage to device features.

Adeia Signs Long-Term Semiconductor Patent License Agreement with Kioxia

Adeia Inc., the company whose patented innovations enhance billions of devices, today announced that Kioxia Corporation entered into a long-term agreement to license Adeia’s semiconductor patent portfolio, including those relating to hybrid bonding.

Pfeiffer Vacuum Offers a New Vacuum Calculator

Pfeiffer Vacuum offers their customers a vacuum calculation tool to identify specific vacuum products for their application, examine evacuation as well as pump down curves and perform different calculations for self-configurated pumping solutions.

ON Partners Sees 30% Growth in Semiconductor Talent Market Since the Implementation of the CHIPS and Science Act

This month, ON Partners, a pure-play retained executive search firm building diverse C-level and board leadership teams, announced a 30% growth in semiconductor market executive leadership opportunities since the passing of the Creating Helpful Incentives to Produce Semiconductors and Science Act of 2022 (CHIPS and Science Act).

Micross Celebrates the Grand Opening of its New Flagship Semiconductor and Specialty Electronics Manufacturing Facility in Apopka, FL

Micross Components, Inc. celebrated the grand opening of its new 85,000 sq. ft. flagship semiconductor and specialty electronics manufacturing facility in Apopka, FL, on March 20, 2023. 

New Resources for CHIPS Applicants

Today, the Department of Commerce is releasing pre-application and application instructions, guidebooks, and other resources for the first CHIPS for America funding opportunity for leading-edge, current-generation, mature-node, and back-end semiconductor fabrication facilities.

Park Systems Introduces Park NANOstandard for Traceable Calibration Standards

Park Systems, a provider of Atomic Force Microscopy (AFM) and nano-metrology solutions, announced the launch of its Park NANOstandard product line.

2026 All-Time High in Store for Global 300mm Semiconductor Fab Capacity After 2023 Slowdown, SEMI Reports

After strong growth in 2021 and 2022, the 300mm capacity expansion is expected to slow this year due to soft demand for memory and logic devices.  

Scientists Integrate Two-Dimensional Materials Into Silicon Microchips for Advanced Data Storage and Computation

A team of scientists at King Abdullah University of Science and Technology (KAUST) led by Dr. Mario Lanza, associate professor of materials science and engineering, has successfully integrated two-dimensional materials on silicon microchips, and achieved excellent integration density, electronic performance and yield.

Plasma Power for the Angstrom Era

Preview AE’s newest innovation for a new era in #semiconductor technology. The shorter steps, frequent transitions, and longer recipes of the most advanced applications require an ambitious approach to #plasmapower delivery. Advanced Energy is once again breaking new ground, leveraging over four decades of expertise and progress, with a new solution to fill the need for transformational power delivery technologies. Watch the video and discover our newest solution, designed to empower innovative applications that move device architectures to ever-smaller dimensions. #PreparefortheAngstromEra

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