MAGAZINE
August/September
Navitas and BRUSA Announce Development Partnership to Accelerate EV Adoption
Navitas Semiconductor and BRUSA HyPower AG announced a technology development partnership to accelerate EV adoption of Navitas GaN power ICs to reduce the size and weight of power electronic components that are used for EV charging.
New Technique Speeds Measurement of Ultrafast Pulses
University of Rochester researchers have developed a time-domain single-pixel imaging technique to speed the measurement of ultrafast pulses in infrared and far infrared wavelengths
ACM Research Ships Its First 300mm, High-Temp Single-Wafer SPM Tool for Advanced Logic, DRAM and 3D-NAND Semiconductor Manufacturing
ACM Research, Inc. today announced it has shipped its first 300mm single-wafer Sulfuric Peroxide Mixture systems for wet clean and etch processes in advanced logic, DRAM and 3D-NAND integrated circuit manufacturing.
Truphone Enables Mass IoT Deployments With iSim Collaboration
Truphone announces that in collaboration with Sony Semiconductor Israel and Kigen, Truphone has successfully enabled its IoT platform and global connectivity to run on the integrated SIM of Sony’s Altair cellular IoT chipsets, powered by Kigen iSIM OS.
Panel-Level Heterogeneous Integration Technology for Analog ICs
Micro-transfer printing, a massively parallel pick-and-place process, may be used to produce HI analog ICs comprised of large arrays of ultra-thin separately manufactured components interconnected using redistribution layer technology.
EV Power Electronics: Driving Semiconductor Demand in a Chip Shortage, Reports IDTechEx
Is electrification sustainable amid a semiconductor shortage?
North American Semiconductor Equipment Industry Posts August 2021 Billings
North America-based semiconductor equipment manufacturers posted $3.65 billion in billings worldwide in August 2021.
SIA Welcomes Today’s White House Meeting on Semiconductor Supply Chain
The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding today’s meeting at the White House between Biden Administration officials and leaders in the semiconductor industry supply chain to discuss the global chip shortage and actions needed to strengthen America’s semiconductor supply chains.
Kopin Corporation Receives Follow On Order of Silicon Backplane Wafers for 2K x 2K OLED Microdisplays
Kopin Corporation announced today it has received an approximately $850,000 follow-on order for its proprietary Lightning 2K silicon backplane wafers.
IQM of Finland Places Multi-System Order for Veeco’s Atomic Layer Deposition System to Enable Next Generation Quantum Computing
Veeco Instruments Inc. today announced that IQM Finland OY, a quantum computing hardware company and a key player in Europe’s quantum ecosystem, has selected the plasma-enhanced Fiji Atomic Layer Deposition (ALD) System to help drive the future of quantum computing.
Foundry Market Tracking Toward Record-Tying 23% Growth in 2021
Application processors for 5G smartphones, networking and data center processors drive growth at leading edge but demand seen across all segments.
New Optical ‘Transistor’ to Speed Up Computation Up to 1,000 times, at Lowest Switching Energy Possible
An international research team led by Skoltech and IBM has created an extremely energy-efficient optical switch that could replace electronic transistors in a new generation of computers manipulating photons rather than electrons.
New AI Tool Developed by University of Liverpool Researchers Accelerates Discovery of Truly New Materials
Researchers at the University of Liverpool have created a collaborative artificial intelligence tool that reduces the time and effort required to discover truly new materials.
GOWIN Semiconductor Enables Education and Hobbyists Development Community
GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces a new user community called Magic Jelly Bean.
MicroAI to Bring AI Training to Renesas MCUs
MicroAI today announced that it has integrated its MicroAI AtomML technology with the Renesas RA Microcontroller (MCU) product line.
DARPA Researchers Can Now Accelerate Technology Innovation Using Microchip’s Low-Power FPGA Product Families
Microchip Technology Inc. today announced it has joined the Defense Advanced Research Projects Agency (DARPA) Toolbox initiative that gives the organization’s researchers simplified open licensing opportunities with commercial technology vendors.
Hokuyo, SiLC Technologies Collaborate to Bring 4D LiDAR Technology to Industrial Automation and Robotics Applications
Hokuyo Automatic Co. and SiLC have jointly announced a strategic collaboration to develop cost-effective 4D LiDAR solutions that improve machine vision in the next generation of advanced industrial and robotic applications.
Time-Resolved, In-Line Airborne Particle Sensing
IPS and wireless wafer/reticle format counters can detect particulate contamination events exactly when and where they occur, with results available in real-time, or stored for later analysis.
Center for Tech Diplomacy at Purdue Welcomes Bonnie Glick as Tech Tank’s New Director
The Center for Tech Diplomacy at Purdue (CTDP) announced that Bonnie Glick will be the inaugural Director of CTDP, a first-of-its-kind “tech tank” focused on the intersection of technology and foreign policy.
How Can a Digital Twin Help Semiconductor Systems Design?
A digital twin is a virtual, extremely detailed version of a physical asset. People create them as single components and all the way up to entire factories. Doing so can let them see the impact of certain decisions before moving ahead with them in real life.
Brooks Automation Announces Agreement To Sell Its Semiconductor Solutions Group Business To Thomas H. Lee Partners
Brooks Automation, Inc. today announced that it has entered into a definitive agreement to sell its Semiconductor Solutions Group business to Thomas H. Lee Partners for $3.0 billion in cash.
Materion to Acquire H.C. Starck’s Electronic Materials Portfolio
Materion Corporation today announced that it has entered into an agreement to acquire H.C. Starck Solutions’ industry-leading, electronic materials business, located in Newton, Massachusetts (HCS-Electronic Materials).
Work Commences to Develop the World’s Smallest Brain-Inspired Computer
Artificial intelligence (AI) has seen explosive growth in recent years, but despite major progress, the power required to run AI algorithms continues to increase.
Dr. Mohamed Saleem, Chief Technology Officer of Brooks Instrument, talks with Editor-in-Chief Pete Singer about how mass flow controllers (MFCs) are used in the semiconductor industry, and key differences between older thermal-based MFCs and newer pressure-based MFCs.
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The Chip Shortage Wake-up Call
An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.
Driving Fab Performance Metrics from the Sub-Fab to the Cleanroom
By Alan Ifould This is the 10th post to this blog in a year where change has been an overriding theme.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What’s Driving Changes in MEMS Sensors for Automotive?
The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive.
AMD Announces Use of TSMC 3D Fabric for Stacked Vertical SRAM Cache, TechInsights Confirms Current Ryzen 5950X is TSV-Capable
At Computex a couple of months ago Lisa Su of AMD gave a keynote talk detailing their new products, but at the tail end she surprised attendees by discussing their advancements in packaging technology.
