MAGAZINE
June
What’s in the June Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
Arteris Accelerates AI-Driven Silicon Innovation with Expanded Multi-Die Solution
In a market reshaped by the compute demands of AI, Arteris, Inc., a provider of system IP for accelerating semiconductor creation, today announced an expansion of its multi-die solution, delivering a foundational technology for rapid chiplet-based innovation.
Jabil Announces Planned Multi-Year $500 Million Investment in U.S. Manufacturing for Cloud and AI Data Center Infrastructure
Jabil Inc. today announced it intends to invest approximately $500 million over the next several years to expand its footprint in the Southeast United States to support cloud and AI data center infrastructure customers.
What’s in the June Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the June issue.
Research Study Demonstrates Novel Synthesis of High-Quality 2D Molybdenum Disulfide Using Veeco’s Fiji ALD System
Veeco Instruments Inc. announced today that the University of Michigan has published a breakthrough study on atomic layer deposition (ALD) of molybdenum disulfide (MoS2) using di-tert-butyl disulfide (TBDS) as a replacement for hydrogen sulfide (H2S).
EUV Tech Debuts Enhanced FALCON Photoresist Flood Exposure Tool
EUV Tech (EUVT) announced the release of the FALCON Photoresist Flood Exposure Tool.
Siemens Collaborates with Samsung Foundry on Advanced Node Product Certifications and EDA Innovation
Siemens Digital Industries Software announced today a significant expansion of its collaboration with Samsung Foundry, including extending certification for many of Samsung’s most advanced process technologies across Siemens’ comprehensive Electronic Design Automation (EDA) portfolio.
Phoenix to Host SEMICON West 2025 for the First Time, Showcasing Arizona’s Role as a Semiconductor Manufacturing Hub
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced strategic partnerships for this year’s SEMICON West with Alliance Sponsors Arizona Commerce Authority (ACA), Greater Phoenix Economic Council (GPEC), and Visit Phoenix.
Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes
Synopsys, Inc. announced today its ongoing close collaboration with Samsung Foundry to power the next generation of designs for advanced edge AI, HPC, and AI applications.
Silicon Catalyst Executive Richard Curtin Joins NLET as Advisor for Semiconductor Industry
The National Laboratory for Education Transformation, a California R&D nonprofit, today announced the appointment of Richard Curtin, Managing Partner at Silicon Catalyst as a Senior Advisor for the NLET Semiconductor Industry and AI Sector workgroup.
Astera Labs and Alchip Announce Strategic Partnership to Advance Silicon Ecosystem for AI Rack-Scale Connectivity
Astera Labs, a provider of purpose-built connectivity solutions for AI and cloud infrastructure, and Alchip Technologies, the high-performance ASIC leader, today announced a strategic partnership to advance the silicon ecosystem for next generation AI infrastructure.
Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips
Applied Materials, Inc. and CEA-Leti today announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors.
Global Semiconductor Sales Increase 2.5% Month-to-Month in April
The Semiconductor Industry Association (SIA) today announced global semiconductor sales were $57.0 billion during the month of April 2025, an increase of 2.5% compared to the March 2025 total of $55.6 billion and 22.7% more than the April 2024 total of $46.4 billion.
Creating the Building Blocks of Technology, Multiple Rings at a Time
Scientists succeed in converting common inert chemicals into functional complex molecules using a new technique.
Ambiq Receives Frost & Sullivan’s 2025 Global Company of the Year Award for Its Leadership in Healthcare Semiconductor Solutions
Frost & Sullivan announced that Ambiq has been awarded the 2025 Global Company of the Year Award in the semiconductor solutions for the healthcare industry for its outstanding achievements in innovation, technology advancement, and customer-centric strategy execution
GSA Board of Directors Announces Transition
The Global Semiconductor Alliance (GSA) Board of Directors today announced a leadership transition as it welcomes Sandeep Bharathi, Chief Development Officer at Marvell Technology, to the Board.
Nanotechnology in Cancer Treatment Market Positioned for Transformational Growth by 2029
Explore how nanomedicine and targeted therapies are shaping the future of cancer care in BCC Research’s global market analysis of nanotechnology in oncology.
TECHCET Projects CMP Market is Set to Reach $3.6B in 2025
TECHCET forecasts nearly a 6% increase in CMP consumables revenue in 2025, reaching approximately US $3.6 billion, as semiconductor production continues its recovery and ramps up for advanced logic and memory devices.
SEMI Announces Election of Tien Wu, ASE CEO, as International Board Chair
SEMI today announced that its International Board of Directors has elected Dr. Tien Wu, CEO of Advanced Semiconductor Engineering, Inc. (ASE), as its new chair, and Benjamin Loh, Chair of Comet AG, as its new vice chair, effective immediately, in accordance with the association’s by-laws.
Micron and Trump Administration Announce Expanded U.S. Investments in Leading-Edge DRAM Manufacturing and R&D
Micron Technology, Inc. and the Trump Administration today announced Micron’s plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, creating an estimated 90,000 direct and indirect jobs.
Imec Achieves Record-Breaking RF GaN-on-Si Transistor Performance for High-Efficiency 6G Power Amplifiers
Imec, a research and innovation hub in nanoelectronics and digital technologies, has set a new benchmark in RF transistor performance for mobile applications.
USTC Develops Weakly Space-Confined All-Inorganic Perovskite Light-Emitting Diodes
Researchers increased the brightness of perovskite LEDs (PeLEDs) to over 1.16 million nits and extended their lifespan to more than 180,000 hours.
Imec Presents 150 GSa/s Digital-to-Analog Converter (DAC) Achieving 300 Gb/s Data Transmission
This week at the 2025 Symposium on VLSI Technology and Circuits, imec announced a significant breakthrough in high-speed digital-to-analog conversion.
Cadence Advances Design and Engineering for Europe’s Manufacturers on NVIDIA Industrial AI Cloud
At NVIDIA GTC Paris, Cadence announced it is providing optimized solutions for the world’s first industrial AI cloud in collaboration with NVIDIA.
Siemens and NVIDIA Expand Partnership to Accelerate AI Capabilities in Manufacturing
Siemens and NVIDIA announced today an expansion of their partnership to accelerate the next era of industrial AI and digitalization and enable the factory of the future.
Featured Video
At SEMICON West 2024, Editor-in-Chief Pete Singer caught up with Nordson TEST & INSPECTION’s Carla Furanna who provides some insights into the company’s products for front, middle and backend applications. Products highlighted at the show include WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), and Gen 7™ Acoustic Micro Imaging (AMI) system. Additionally, the innovative SpinSAM™ AMI system was unveiled for the first time at the show. The new system delivers industry-leading throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
