MAGAZINE
March
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
New from PI: Advancing Sustainable, Lead-Free Piezoelectric Ceramics
PI Ceramic and Ultrasonic Advisors are hosting an exclusive webinar on the latest advancements in sustainable, lead-free piezoelectric ceramics for medical and industrial sensing and actuation applications.
InPsytech Joins Intel Foundry Accelerator IP Alliance
InPsytech, Inc., a provider of high-performance semiconductor intellectual property (IP) solutions under Egis Group, announced its participation in the Intel Foundry Accelerator IP Alliance.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
NoMIS Power Achieves Major Breakthrough in SiC Short-Circuit Withstand Time
NoMIS Power, a leader in advanced silicon carbide (SiC) power semiconductor technology, has announced a major breakthrough in improving the short-circuit withstand time (SCWT) of SiC MOSFETs.
Intel Appoints Lip-Bu Tan as Chief Executive Officer
Intel Corporation today announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.
Keysight Enables Dynamic Test on a Wide-Bandgap Power Semiconductor Bare Chip
Keysight Technologies, Inc. has enhanced its double-pulse test portfolio enabling customers to benefit from accurate and easy measurement of the dynamic characteristics of Wide-Bandgap (WBG) power semiconductor bare chips.
Spinning, Twisted Light Could Power Next-Generation Electronics
Researchers, led by the University of Cambridge and the Eindhoven University of Technology, have created an organic semiconductor that forces electrons to move in a spiral pattern, which could improve the efficiency of OLED displays in television and smartphone screens, or power next-generation computing technologies such as spintronics and quantum computing.
TransPak’s Global Growth Continues with Expansion in Wales
The 44,000-square-foot TransPak Wales facility strategically positions the company to support the growing needs of its customers in Europe, particularly within the semiconductor and data server industries.
SEALSQ Announces the Establishment of SEALSQ Singapore Ltd to Develop a Post-Quantum Semiconductor Personalization Center
This initiative reinforces SEALSQ’s commitment to advancing secure semiconductor technologies for the post-quantum era.
CoolCAD Electronics and RFMW Announce Distribution Agreement for High-Power Silicon Carbide Semiconductor Devices
RFMW today announced a strategic partnership with CoolCAD Electronics to enhance its portfolio of high-power and high-voltage silicon carbide (SiC) semiconductor devices.
Global Technologies Makes Acquisition in France
Mycronic’s Global Technologies division has acquired Hprobe, a company headquartered in Grenoble, France, which has developed a unique technology for high-speed magnetic testing of Magnetoresistive Random Access Memories (MRAMs) and magnetic sensors.
Alpha and Omega Semiconductor Adds Two New Advanced MOSFET Package Options for High-Current Applications
Alpha and Omega Semiconductor Limited today announced the release of two surface mounting package options for its industry-leading high power MOSFET portfolio.
Omni Design Technologies Opens Austin Design Center
Omni Design Technologies, a provider of high-performance, low-power Swift data acquisition and signal-processing solutions, today announced the opening of a new design center in Austin, Texas.
Microchip Technology Unveils 32-bit MCU Family with Integrated High-Performance Analog Peripherals
To address the increasing demand for high-performance, math-intensive applications in a wide range of industries, Microchip Technology has released the PIC32A family of MCUs
OpenLight and Tower Semiconductor Demonstrate 400G/lane Modulators Built on Silicon Photonic Wafers
The 400G demonstration is built using OpenLight’s IP on Tower’s existing silicon photonics platform already supporting customers at 100G and 200G/lane.
Wet Chemicals on Track for Steady Growth
TECHCET is anticipating growth of ~3% for Wet Chemicals and Specialty Cleans used in semiconductor manufacturing in 2025.
Gradiant Wins Second Semiconductor Water Treatment Project in Dresden
Gradiant today announced a major contract to design and build an ultrapure water (UPW) facility for one of the world’s largest semiconductor manufacturers in Dresden, Germany.
Everspin Expands High-Reliability MRAM Portfolio with New Automotive-Grade Offerings
Everspin Technologies, Inc., a developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, today announced its latest high-reliability MRAM expansion.
NVIDIA Continues to Dominate Global Semiconductor Sector
NVIDIA has retained its position as the world’s most valuable semiconductor brand, according to a new report from Brand Finance, the world’s leading brand valuation consultancy.
TSI Introduces the Nano LPM System for Semiconductor Ultrapure Water Nanoparticle Detection
This innovation empowers semiconductor manufacturers to make real-time, data-driven decisions before product quality and yield is affected.
ASML and imec Sign Strategic Partnership Agreement
ASML Holding N.V. (ASML) and imec, a research and innovation hub in nanoelectronics and digital technologies, today announce that they have signed a new strategic partnership agreement, focusing on research and sustainability.
European Chips Diversity Alliance Hosts Future Proofing Access to Diverse Talent Event to Strengthen Semiconductor Workforce
The European Chips Diversity Alliance (ECDA), a European Union-funded initiative coordinated by SEMI Europe, today announced a full-day event on March 27 dedicated to advancing underrepresented groups in the semiconductor industry in collaboration with Learnovate, MIDAS Ireland, and EudaOrg.
SIA Applauds TSMC’s Expanded Investment in U.S. Semiconductor Manufacturing
The Semiconductor Industry Association (SIA) today released the following statement.
Featured Video
Kuehne+Nagel offers logistics services specifically designed for the semiconductor industry, with an extensive network at key locations, experienced personnel, and capacity to meet the strict requirements of semiconductor fabs. At SEMICON West 2024, Barry O’Dowd, global head of semiconductor logistics at Kuehne+Nagel talked to Editor-in-Chief Pete Singer about how the company’s certified services ensure the stability of the supply chain. O’Dowd said the emphasis is on providing reliable, safe, and cost-effective logistics solutions, from precise transportation and risk mitigation to professionally trained staff and preapproved suppliers.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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