Navitas Semiconductor and BRUSA HyPower AG announced a technology development partnership to accelerate EV adoption of Navitas GaN power ICs to reduce the size and weight of power electronic components that are used for EV charging.
University of Rochester researchers have developed a time-domain single-pixel imaging technique to speed the measurement of ultrafast pulses in infrared and far infrared wavelengths
ACM Research, Inc. today announced it has shipped its first 300mm single-wafer Sulfuric Peroxide Mixture systems for wet clean and etch processes in advanced logic, DRAM and 3D-NAND integrated circuit manufacturing.
Truphone announces that in collaboration with Sony Semiconductor Israel and Kigen, Truphone has successfully enabled its IoT platform and global connectivity to run on the integrated SIM of Sony’s Altair cellular IoT chipsets, powered by Kigen iSIM OS.
Micro-transfer printing, a massively parallel pick-and-place process, may be used to produce HI analog ICs comprised of large arrays of ultra-thin separately manufactured components interconnected using redistribution layer technology.
Is electrification sustainable amid a semiconductor shortage?
North America-based semiconductor equipment manufacturers posted $3.65 billion in billings worldwide in August 2021.
The Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding today’s meeting at the White House between Biden Administration officials and leaders in the semiconductor industry supply chain to discuss the global chip shortage and actions needed to strengthen America’s semiconductor supply chains.
Kopin Corporation announced today it has received an approximately $850,000 follow-on order for its proprietary Lightning 2K silicon backplane wafers.
Veeco Instruments Inc. today announced that IQM Finland OY, a quantum computing hardware company and a key player in Europe’s quantum ecosystem, has selected the plasma-enhanced Fiji Atomic Layer Deposition (ALD) System to help drive the future of quantum computing.
Application processors for 5G smartphones, networking and data center processors drive growth at leading edge but demand seen across all segments.
An international research team led by Skoltech and IBM has created an extremely energy-efficient optical switch that could replace electronic transistors in a new generation of computers manipulating photons rather than electrons.
Researchers at the University of Liverpool have created a collaborative artificial intelligence tool that reduces the time and effort required to discover truly new materials.
GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces a new user community called Magic Jelly Bean.
MicroAI today announced that it has integrated its MicroAI AtomML technology with the Renesas RA Microcontroller (MCU) product line.
Microchip Technology Inc. today announced it has joined the Defense Advanced Research Projects Agency (DARPA) Toolbox initiative that gives the organization’s researchers simplified open licensing opportunities with commercial technology vendors.
Hokuyo Automatic Co. and SiLC have jointly announced a strategic collaboration to develop cost-effective 4D LiDAR solutions that improve machine vision in the next generation of advanced industrial and robotic applications.
IPS and wireless wafer/reticle format counters can detect particulate contamination events exactly when and where they occur, with results available in real-time, or stored for later analysis.
The Center for Tech Diplomacy at Purdue (CTDP) announced that Bonnie Glick will be the inaugural Director of CTDP, a first-of-its-kind “tech tank” focused on the intersection of technology and foreign policy.
A digital twin is a virtual, extremely detailed version of a physical asset. People create them as single components and all the way up to entire factories. Doing so can let them see the impact of certain decisions before moving ahead with them in real life.
Brooks Automation, Inc. today announced that it has entered into a definitive agreement to sell its Semiconductor Solutions Group business to Thomas H. Lee Partners for $3.0 billion in cash.
Materion Corporation today announced that it has entered into an agreement to acquire H.C. Starck Solutions’ industry-leading, electronic materials business, located in Newton, Massachusetts (HCS-Electronic Materials).
Artificial intelligence (AI) has seen explosive growth in recent years, but despite major progress, the power required to run AI algorithms continues to increase.
Pressure-based Mass Flow Controllers for Semiconductor Processing
Dr. Mohamed Saleem, Chief Technology Officer of Brooks Instrument, talks with Editor-in-Chief Pete Singer about how mass flow controllers (MFCs) are used in the semiconductor industry, and key differences between older thermal-based MFCs and newer pressure-based MFCs.
Semiconductor Daily Digest in your inbox