MAGAZINE
July
President Biden Signs CHIPS Act Into Law
The legislation provides a 25% tax credit for U.S. facilities that produce semiconductors or chipmaking equipment and $52 billion in funding for new semiconductor programs.
Akoustis Ships Second 5G Mobile Filter Design in its New Wafer-Level-Package to First Foundry Customer
Akoustis Technologies, Inc., an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has completed the second design iteration of a 5G mobile filter and shipped samples to its first XBAW mobile foundry customer.
Henkel and CITC Forge Partnership to Accelerate High-Thermal Die Attach Solutions
Henkel and Chip Integration Technology Center (CITC) announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for radio frequency (RF) and power electronics.
Gwangju Institute of Science and Technology Scientists Improve the Power Output of Triboelectric Nanogenerators with Carbon Particles
Mesoporous carbon spheres facilitate charge transport and high surface charge densities in triboelectric nanogenerators for a 1300-fold higher output current.
Micron Announces $40 Billion Investment in Leading-Edge Memory Manufacturing in the US
Largest ever investment in U.S. memory manufacturing will create an estimated 40,000 American jobs, strengthen national security and bolster supply chain resilience.
GlobalFoundries and Qualcomm Announce Extension of Long-term Agreement to Secure U.S. Supply through 2028
Today’s announcement secures wafer supply and commitments to support U.S.-based manufacturing through capacity expansion at GF’s most advanced semiconductor manufacturing facility, in Malta, New York.
Nordson Corporation Announces Agreement to Acquire CyberOptics Corporation
The acquisition enhances Nordson’s test and inspection platform, providing differentiated technology that expands Nordson’s product offering in the semiconductor and electronics industries.
GlobalFoundries, Applied Materials and Ford to Co-Host CEO Summit to Secure U.S. Chip Supply Chain
GlobalFoundries, Applied Materials, Inc. and Ford Motor Company today announced that the three companies’ CEOs will be co-hosting a summit of senior government officials, CEOs and C-suite executives from companies either involved in technology manufacturing or companies whose ability to compete depends on continued innovation, technology leadership and access to semiconductor chips in the U.S.
Towards Higher Nanopatterning Resolution with Molecules that Fill Nanogaps Better
Ultraviolet nanoimprint lithography (UV-NIL) is a method of creating patterns at the nanoscale with widespread applications in optoelectronics, photonics, and biology due to its low cost and scalability.
U.S. Chip Expansions Squeezed by Shortages of Specialty Materials
What is the root cause of the semiconductor chip shortage? Is it simply a matter of chipmakers not having enough production capacity, or is something else at play?
NEO Semiconductor Awarded “Best of Show” for Most Innovative Memory Technology
X-NAND Gen2 that enables 3D NAND flash memory with 20X faster write performance received top honors at Flash Memory Summit 2022.
Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce
According to TrendForce research, Intel plans to outsource the tGPU chipset in Meteor Lake to TSMC for manufacture.
SkyWater Joins the American Semiconductor Innovation Coalition
Industry consortium proposes solutions for the National Semiconductor Technology Center and the National Advanced Packaging Manufacturing Program requested in the CHIPS+ Act.
IC Sales Turn Negative as Economy Weighs on Market
Never-before seen decline in June IC market driven by steep drop in memory pricing.
The Democratization of Chip Design
The open-source silicon movement with a community-based, open-source platform of easy-to-use, easy-to-access tools is a practical and efficient way to ensure innovation and has the potential to drive exponential semiconductor industry growth.
Smart Microrobots Learn How to Swim and Navigate with Artificial Intelligence
The AI-powered swimmer is able to switch between different locomotory gaits adaptively to navigate toward any target location on its own.
InnovationLab Demonstrates Breakthrough PCB Production Method Based on Additive Manufacturing
InnovationLab, the expert in printed electronics “from lab to fab”, announces it has achieved a breakthrough in additive manufacturing of printed circuit boards (PCBs), helping meet higher environmental standards for electronics production while also reducing costs.
US/China Tension Must Be Seen in the Context of Taiwan’s TSMC’s Critical Role in the Global Semi Supply Chain
Following the news of raising tension between the US and China as a result of US House Speaker Nancy Pelosi recent visit to Taiwan; Josep Bori, Research Director in the Thematic team at GlobalData, a leading data and analytics company, offers his view.
New Wafer-like and Reticle-like Sensors Deliver Fast, Easy Measurements Inside the Process Chamber
Sensors are available for a range of routine and specialized applications. The two newest sensors offer significant advancements in terms of performance and range of application.
An Interview with Kistler’s Robert Hillinger
Robert Hillinger, Business Development Manager at Kistler, explains how dynamic force measurement increases process reliability in semiconductor production.
Lip-Bu Tan, Executive Chairman of Cadence Design Systems and Chairman of Walden International, to Receive Semiconductor Industry’s Top Honor
Tan, renowned tech visionary and venture capital pioneer, will accept 2022 Robert N. Noyce Award during SIA Awards Dinner on Nov. 17.
SK hynix Develops World’s Highest 238-Layer 4D NAND Flash
SK hynix Inc. announced today that it has developed the industry’s highest 238-layer NAND Flash product.
Kioxia Launches Second Generation of High-Performance, Cost-Effective XL-FLASH Storage Class Memory Solution
Kioxia Corporation today announced the launch of the second generation of XL-FLASH, a Storage Class Memory (SCM) solution based on its BiCS FLASH 3D flash memory technology, which significantly reduces bit cost while providing high performance and low latency.
At SEMICON West 2022, Advanced Energy Industries, Inc. announced an expansion of its Luxtron® family of FluorOptic® Thermometry (FOT) solutions with a new converter platform and two proprietary phosphor formulations that enable high accuracy temperature measurement over an expanded temperature range for the most advanced semiconductor etch and deposition processes. Editor-in-Chief Pete Singer talks to Dhaval Dhayatkar, Senior Director of Marketing at AE about the new product and other news, and Frederick Pearsall, Product Manager, gives a demo of the AE electrostatic chuck system.
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The Chip Shortage Wake-up Call
An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.
IPCC 6th Assessment Report Working Group III – Mitigation
The evidence is clear: the time for action is now. We can halve emissions by 2030.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What’s Driving Changes in MEMS Sensors for Automotive?
The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive.
Apple’s M1 Ultra Does Use InFO_LSI – or is it CoWoS-L?
On March 8, Apple held their “Peek Performance” event, introducing the all-new Mac Studio including within it the M1 Ultra processor and its unique (up to now) packaging.
