The Semiconductor Industry Association (SIA) today applauded Senate approval of the U.S.-Mexico-Canada Agreement (USMCA), which passed with strong bipartisan support earlier today. SIA represents U.S. leadership in semiconductor manufacturing, design, and research, with members accounting for approximately 95 percent of U.S. semiconductor company sales. “Congressional approval of the USMCA is a major win for free trade and America’s global leadership in semiconductors and the technologies they enable,” said John Neuffer, SIA president and CEO. “The agreement will help ensure that more products researched, designed, and made in America – including semiconductors – can flow to customers around the world. We applaud the Administration and Congress for negotiating and approving this landmark agreement.”
Synopsys, Inc. (Nasdaq: SNPS) today announced that it has joined the new Autonomous Vehicle Computing Consortium. The Consortium brings together leading experts in the automotive, automotive supply, semiconductor and computing industries to help accelerate the delivery of safer and affordable vehicles. As a member of the Consortium, Synopsys will actively contribute to the development of a set of recommendations for system architectures and computing platforms that will be used to address the challenges of deploying self-driving vehicles at scale.
Worldwide semiconductor revenue totaled $418.3 billion in 2019, down 11.9% from 2018, according to preliminary results by Gartner, Inc. Intel regained the No. 1 position in the market as the downturn in the memory market negatively impacted many of the top vendors, including Samsung Electronics, the No. 1 vendor by revenue in 2018 and 2017. Intel reclaimed its position as the No. 1 global semiconductor vendor by revenue in 2019, recovering the position from Samsung Electronics, which held it for the past two years. Intel’s semiconductor revenue declined 0.7% in 2019, driven by a slowdown in the server market, an ongoing constrained CPU supply and the 4Q19 sale of its cellular modem business to Apple.
Optical sensing in the mid to long infrared (5microns – um) is becoming of utmost importance in different fields since it is proving to be an excellent tool for environmental monitoring, gas sensing, thermal imaging as well as food quality control or the pharmaceutical industry, to name a few. The amount of information hidden within this very rich spectral window opens new possibilities for multi or even hyperspectral imaging. Even though there are technologies that can address these challenges, they are very complex and expensive.
Quantum physics is moving out of the laboratory and into our everyday lives. Despite the big headline results about quantum computers solving problems impossible for classical computers, technical challenges are standing in the way of getting quantum physics into the real world. New research published in Nature Communications from teams at Aalto University and Lund University hopes to provide an important tool in this quest.
Synopsys, Inc. (Nasdaq: SNPS) today announced that Dr. John R. Rogers, principal engineer of imaging optics in the Optical Solutions Group at Synopsys, has been named the 2020 recipient of the SPIE Rudolf and Hilda Kingslake Award in Optical Design. SPIE, the international society for optics and photonics, presents the award in recognition of significant achievements in the field of optical design and optical engineering theory.
Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch International will headline the event with keynotes. Event registration is open.
Nepes (KOSDAQ: 033640), one of the top tier advanced packaging service providers, announces that it has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker. Fan-Out manufacturing is stabilized for mass production of the advanced package line recently acquired from Deca Technologies. “High Reliability Fan-out Package,” supplied by nepes, is a high-tech solution with more than 2 times BLR (Board Level Reliability) performance versus standard fan-out technologies by reducing physical stress on chips through sidewall protection structures.
Graphene-based heterostructures of the van der Waals class could be used to design ultra-compact and low-energy electronic devices and magnetic memories. This is what a paper published in the latest issue of the Nature Materials journal suggests. The results have shown that it is possible to perform an efficient and tunable spin-charge conversion in these structures and, for the first time, even at room temperature.
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Korea from February 5-7th, 2020 at the COEX in Seoul, booth #C236. During the show, the company will unveil and demonstrate its new WaferSense® Auto Resistance Sensor™ (ARS) with CyberSpectrum™ software for semiconductor tool set-up and diagnostics.
Researchers reach a critical milestone on the path to versatile colloidal quantum dot laser diodes by successfully demonstrating a quantum dot LED that also operates as an optically pumped laser.
Silicon Mobility, the technology player powering control solutions for a cleaner, safer, and smarter mobility, is pleased to announce the appointment of former Robert Bosch GmbH executive Rainer Kallenbach as CEO of the company as of January 6, 2020. The current CEO Bruno Paucard will remain with the company as COO and on the Board of Directors.
TECHCET—the electronic materials advisory services firm providing business and technology information— announced that global revenues for semiconductor manufacturing and packaging materials are expected to grow 5.7% year-over-year (YoY) in 2020 to US$49.5B, of which 65% represents semiconductor fab materials.
The New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY CREATES) today announced discussions to form a new Strategic Engagement with SEMI, the global industry association representing the electronics manufacturing and design supply chain. The announcement was made at the SEMI Industry Strategy Symposium, attended by several hundred C-Level semiconductor executives. Formed as a new and flexible industry interface in New York, NY CREATES is tasked with bridging academic, research, and industry innovation of the advanced electronics sector in New York.
Victrex plc today announces the creation of a joint-venture between its subsidiary, Victrex Hong Kong Limited, and Yingkou Xingfu Chemical Company Limited, to build and operate a new PEEK polymer manufacturing facility in Liaoning, China, subject to certain performance conditions, including finalizing land purchase and permit applications. Victrex, which will be the majority partner and lead the joint-venture, will benefit by further differentiating and complementing its portfolio of PEEK and PAEK grades, in anticipation of a range of significant long-term growth opportunities across several end markets in China, as well as aligning with China’s ‘Made in China 2025’ initiative, where specifying domestically produced PEEK in certain applications is expected to gain momentum.
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications. Building upon successful 7nm designs, Cadence and Broadcom are expanding the collaboration to include the creation of 5nm designs using Cadence® digital implementation solutions. With these Cadence solutions in place, Broadcom can further augment engineering productivity and improve silicon performance and power.
The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme Data Driven Innovation and Growth. The annual three-day conference of C-level executives gives the year’s first comprehensive outlook of the global electronics manufacturing industry. For the nearly 300 attendees at ISS 2020, opening day highlighted market and technology opportunities and a reflection on the significant pricing and international trade challenges the semiconductor manufacturing supply chain faced in 2019.
Semiconductor industry innovators SK hynix, Intel, imec and Graphcore will kick off SEMICON Korea 2020 with keynotes focusing on the future of artificial intelligence (AI) as an estimated 500 companies and 55,000 visitors gather February 5-7 at the COEX in Seoul for the latest microelectronics developments, innovations and trends powering the next wave of industry growth. Themed Design the Smarter Future, SEMICON Korea 2020 will feature more than 30 technology programs offering leading insights into semiconductor manufacturing, AI, MEMS and sensors, mobility, and metrology and inspection.
Many of the most challenging optimization problems encountered in various disciplines of science and engineering,…
Researchers at the McKelvey School of Engineering at Washington University in St. Louis have devised a fully contained optical resonator system that can be used to turn transparency on and off, allowing for a measure of control that has implications across a wide variety of applications.
The power electronics sector is pushing to adapt and propose innovative products. Objectives are clearly to answer to the specific needs coming from EV/HEV makers and make sure, for the power electronics companies, to be part of this attractive growth. They are so working on the miniaturization of the components, circuits and system design and are developing new solutions to integrate several systems in one system (e-axle, integration of DC-DC converter with a battery, etc.). Of course, WBG technologies are part of the technology roadmap, especially SiC power devices.
SmartSens, the leading supplier of high-performance CMOS imaging systems, today announced that its SmartSens SC132GS product has been selected as the winner of the “IoT Semiconductor Solution of the Year” award in the 4th annual IoT Breakthrough Awards program from IoT Breakthrough, a leading market intelligence organization that recognizes the top companies, technologies and products in the global Internet-of-Things (IoT) market today. As 5G and AI-enabled applications accelerate toward industry-wide ‘intelligent’ system upgrades, SmartSens’ global shutter image sensor SC132GS is built specifically to power these applications.
Picosun Group, global provider of leading AGILE ALD® (Atomic Layer Deposition) thin film coating solutions, reports record performance of silicon-integrated, three-dimensional deep trench microcapacitors manufactured using its ALD technology. Increasing efficiency and performance demands of portable and wearable electronics, along with their shrinking size in accordance with the Moore’s law, set new challenges to the power management of these devices as well. A solution is further integration of the devices’ key components into so-called SiP (systems-in-package) or SoC (systems-on-chip) architectures, where everything, including the energy storage such as batteries or capacitors, is packed close to each other into one compact, microscale-miniaturized assembly.
Interview with Dr. Subodh Kulkarni, CyberOptics Corporation
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