MAGAZINE
March
Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
Synopsys, Inc. today announced broad EDA and IP collaborations with TSMC for advanced node designs and have been deployed across a range of AI, high-performance computing, and mobile designs.
EFC Awarded CGA Environmental Excellence Award
In significant recognition of its commitment to sustainable practices, EFC Gases & Advanced Materials was awarded the 2024 Compressed Gas Association (CGA) Environmental Excellence Award at its annual meeting.
Silex Announces the First Pure-Play MEMS 12-inch Wafer Fab
Silex today announces the first 12-inch wafer fab for pure-play MEMS manufacturing.
Omdia Forecasts Strong Recovery in Large-Area Display Market for 2024
Research from Omdia’s newly released Large Area Display Market Tracker 4Q23 has found shipments of large-area displays (all displays above 9 inches), including both LCD and OLED, are forecasted to increase by 7.4% year-over-year (YoY) in units and 11.1% YoY in area in 2024.
Micron Secures $6.1B in CHIPS Funding
The proposed CHIPS funding will underwrite Micron’s plans to build the largest leading-edge memory fabrication semiconductor facility in the U.S. in Clay, NY.
JCET Q1 2024 Revenue and Net Profit Achieve Double-digit Year-on-Year Growth
JCET Group, a global provider of integrated circuit (IC) back-end manufacturing and technology services, today announced its financial results for the first quarter of 2024.
Opening Up the Potential of Thin-Film Electronics for Flexible Chip Design
New research demonstrates feasibility of ‘foundry’ model for flexible electronics.
A Flexible Microdisplay Can Monitor Brain Activity in Real-Time During Brain Surgery
The device represents a huge leap ahead to visualize brain activity to guide neurosurgeons.
ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement
ROHM and STMicroelectronics announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.
Axcelis Wins the Texas Instruments 2023 Supplier Excellence Award
Axcelis Technologies, Inc., a supplier of enabling ion implantation solutions for the semiconductor industry, has received the Texas Instruments (TI) 2023 Supplier Excellence Award
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
Samsung Electronics Co., Ltd. today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
The 2024 IEEE Symposium on VLSI Technology & Circuits To Showcase Breakthroughs in Microelectronics
For the last 44 years, the IEEE Symposium on VLSI Technology & Circuits has delivered a unique convergence of technology and circuits for the microelectronics industry, with maximum synergy between both domains.
Syensqo Joins the SEMI Climate Consortium
The partnership aims to accelerate implementation of a sustainability roadmap across the entire value chain.
Lattice Wins 2024 Environment + Energy Leader Award
Lattice Semiconductor, the low power programmable leader, today announced its Lattice Avant FPGA platform was selected as a 2024 Environment + Energy Leader Award winner.
Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
Silicon Creations, a supplier of high-performance analog and mixed-signal intellectual property (IP), announced a significant milestone: surpassing 10 million wafers in production containing Silicon Creations IP in collaboration with TSMC.
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
The U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) program.
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
New goals target additional reductions and removal of greenhouse gas emissions to help fight climate change.
SEMI Applauds U.S. CHIPS Act Award for Samsung Electronics Facilities
The award includes $6.4 billion in grants and an investment tax credit to help fund two new leading-edge logic fabs, a research and development fab, and an advanced packaging facility in Taylor, Texas.
Aaron Woolf, Dylan Peterson Join SIA Team
Woolf will serve as director of global policy for economic security and Peterson will be a communications associate.
Silicontent and yieldWerx Announce Collaboration
yieldWerx continues to partner with global semiconductor companies and has partnered with Silicontent to bring improvements in yield management and quality.
SK hynix Partners with TSMC
SK hynix Inc. announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology.
Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
Omni Design Technologies, a provider of high-performance, low-power mixed-signal intellectual property (IP), today announced it has joined the Intel Foundry Accelerator IP Alliance.
Featured Video
Is your semiconductor plant seeking methods to enhance sustainability in wafer manufacturing and water reclamation? The semiconductor sector faces two challenges: waste reduction and water usage. The use of on-line water analytics can assist in overseeing water quality in both wafer manufacturing and reclamation/reuse procedures. This video underscores the significance of monitoring the levels of conductivity, TOC, and microbes to identify impurities that may lead to rejected wafers. Monitoring these parameters also ensures the purity of water to improve wafer quality and yield. Furthermore, this video emphasizes the importance of monitoring the levels of dissolved oxygen, TOC, and pH in waste streams to optimize water recovery.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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