MAGAZINE
August/September
U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing
With $3.1 billion spending ceiling, new 10-year contract provides U.S. Dept. of Defense an assured supply of securely manufactured semiconductors for use in the nation’s most sensitive applications.
FPT and Silvaco Ink Deal, Advancing Semiconductor Workforce and Business Expansion
FPT Semiconductor, a subsidiary of FPT Corporation (FPT), today announced its partnership with Silvaco, US-based leading provider of TCAD, EDA software, and Design IP, aiming at fostering workforce and business growth in the semiconductor sector.
Samco Plasma Etching System RIE-10NR Updates University of Illinois Urbana-Champaign’s Material Research Lab
Samco reveals plans to install plasma etching system RIE-10NR early 2024 as the newest update to the Materials Research Lab (MRL) at the University of Illinois Urbana-Champaign (UIUC).
Linx Consulting to Host Conference and Workshop this November
The Electronic Specialty Gases & Systems Conference 2023 will be held November 14 to 16, 2023 at Gila River Resorts in Chandler, AZ.
Wearable Optical Device Shows Promise for Detecting Postpartum Hemorrhage
Researchers use laser speckle imaging to provide early warning for a common cause of maternal mortality.
NXP Honored with Prestigious Automotive Awards
NXP Semiconductors N.V. announced that it has been honored by three automotive partners.
Purdue Center Addresses Pressing Challenge of Securing Semiconductor Chips
Purdue University’s emergence as a leader in semiconductor chips also requires it to usher in a new level of security that protects those essential chips needed for everything from your car and cellphone to artificial intelligence and machine learning.
MITRE Responds to CHIPS Act Awards for Eight Regional Innovation Hubs
Yesterday, the Department of Defense (DoD) announced the first set of awards under the CHIPS Act totaling nearly $240 million to build eight regional innovation hubs through its Microelectronics Commons initiative.
Deputy Secretary of Defense Kathleen Hicks Announces $238M CHIPS and Science Act Award
Deputy Secretary of Defense Kathleen Hicks announced the award today of $238 million in “Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act” funding for the establishment of eight Microelectronics Commons (Commons) regional innovation hubs.
ITRI Leads Global Semiconductor Collaboration for Heterogeneous Integration to Pioneer Pilot Production Solutions
The introduction of Generative AI (GAI) has significantly increased the demand for advanced semiconductor chips, drawing increased attention to the development of complex calculations for large-scale AI models and high-speed transmission interfaces.
Cadence to Acquire Intrinsix Corporation from CEVA
Cadence Design Systems, Inc. and CEVA, Inc., a licensor of wireless connectivity and smart sensing technologies, today announced that they have entered into a definitive agreement for Cadence to acquire Intrinsix Corporation, a wholly owned subsidiary of CEVA and a provider of design engineering solutions focused on the U.S. aerospace and defense industry.
SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain’s Carbon Emissions
The SEMI Semiconductor Climate Consortium (SCC) today issued its first report of the semiconductor ecosystem’s greenhouse gas (GHG) emissions profile, an in-depth analysis of the semiconductor value chain’s carbon footprint and priority-ranked carbon emission sources for the industry to address.
Omdia: Large-Area Displays Expected to See Further Decline in Unit Shipments by 7.3% YoY While Area Shipments Increase by 0.5% YoY in 2023
Previous forecasts that large-area displays, including both LCD and OLED shipments, will decrease by 3.2% year-over-year (YoY) in 2023 has now been decreased further to -7.3% YoY in the latest forecast owing to deeper demand erosions and panel makers’ utilization management.
Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports
Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm volume fabs (excluding EPI) as the industry reaches a record high of more than 7.7 million wafers per month.
Marposs Introduces the MICROMEASURE 2 3D Measuring System
Marposs Inc. announced the latest addition to its highly successful line of Industry 4.0 metrology solutions, the STIL MICROMEASURE 2 3D Measuring System.
Aspinity Raises $5 Million Series B Funding to Bring Breakthrough AI/ML Technology to a Global Market
Aspinity today announced that it has closed $5 million in Series B funding from current investors Anzu Partners, Birchmere Ventures, Mountain State Capital and Riverfront Ventures.
OMNIVISION Announces New TheiaCel Technology and Automotive Image Sensor for LED-Flicker-Free Exterior Cameras
OMNIVISION today debuted its OX08D10 8-megapixel (MP) CMOS image sensor with TheiaCel technology at AutoSens Brussels.
Plasma-Therm Announces Acquisition of Thin Film Equipment SrL
Plasma-Therm, a manufacturer of plasma-process equipment for the semiconductor and compound semiconductor markets, today announced that it has acquired Thin Film Equipment SrL (TFE), effective September 18, 2023.
Brooks Instrument Introduces New Coriolis Mass Flow Controllers for Low-Flow, High-Accuracy Applications
Brooks Instrument has released a new series of Quantim QMC Coriolis mass flow controllers (MFCs) designed to provide high accuracy for very low flows of liquids and gasses.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products.
indie Semiconductor Acquires EXALOS AG
indie Semiconductor today announced it has entered into a definitive agreement and completed the acquisition of privately held EXALOS AG, a Swiss photonics company, specializing in the design of high-performance optical semiconductors.
Unveiling the Invisible: A Bioinspired CMOS-Integrated Polarization Imaging Sensor
Polarimetric imaging can uncover features invisible to human eyes and conventional imaging sensors, hence is becoming an ever more essential technique in modern society.
Chinese Scientists Develop Self-Healing Elastomer for Flexible Electronics
Scientists in China have fabricated a high-strength elastomer with self-healing properties. The polymer has significant potential in the field of flexible electronic devices.
Featured Video
Process Technology’s co-CEOs Jody Richards and Sid Srivastava share a vision of how the company is bringing new innovation to heating and power in the semiconductor industry, “Enabling our customers to achieve more with products that do more.” At SEMICON West 2023, Editor-in-Chief Pete Singer talked to the duo about the company’s sustainability efforts and new products, including the Lufran DI water recycling system, the SHX explosion proof heater for IPA, and the Dynatronix power supply for electrochemical deposition.
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Update: China May Win in AI Computing
Leveraging hybrid bonding as an alternative to dimensional scaling.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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