MAGAZINE
June
Top Five MPU Suppliers Expand Share of Sales to 86% in 2021
New ranking shows long-time leader Intel sliding closer to half the total sales in microprocessors.
Photon-Controlled Diode: An Optoelectronic Device with a New Signal Processing Behavior
In a recent paper published in National Science Review, Chinese scientists report an optoelectronic device with a new signal processing behavior named photon-controlled diode.
More is Better: Epitaxial Multilayer MoS2 Wafers with Promises in High-Performance Transistors
In a paper published in National Science Review, a research team from China achieves the layer-by-layer epitaxy of 4-inch multilayer MoS2 wafers.
Battery Materials Must Evolve to Keep Pace with Societal Needs
Rensselaer Professor Nikhil Koratkar and team find critical advances in nanostructures.
SEMI’s S23 Standard – Save Energy, Save Money, Save the Planet
The greatest potential for immediate reductions in GHG emissions in semiconductor manufacturing lies in reducing the energy used by manufacturing equipment.
Si2 Names Recipients of Annual Power of Partnerships Award
Technologists from Intel, IBM, Microsoft and Cadence Design Systems are this year’s Silicon Integration Initiative Power of Partnerships Award winners, recognizing the Si2 volunteer team with the most significant contributions to silicon-to-system implementation.
Samsung Begins Chip Production Using 3nm Process Technology with GAA Architecture
Optimized 3nm process achieves 45% reduced power usage, 23% improved performance, and 16% smaller surface area compared to 5nm process.
Breker Verification Systems Joins RISC-V International
Breker Verification Systems, a provider of advanced test content synthesis solutions, including RISC-V Cache Coherency and other SoC integration Verification Intellectual Property (VIP) in the “TrekApps” family, today joined RISC-V International (RVI) as a strategic member.
Renesas Partners with Tata to Accelerate Progress in Advanced Electronics for India and Emerging Markets
These joint endeavors extend the companies’ longstanding relationship as technology and business partners, including the recently announced next-generation EV Innovation Center (NEVIC) jointly established by Renesas and Tata Group’s Tata Elxsi in March 2022.
Advantest and Singapore Polytechnic Jointly Establish New Test Engineering Center
This is the first time that Advantest is collaborating with an Institute of Higher Learning (IHL) in Singapore.
Imec Shows Path to Line Resistance Halving using Semi-Damascene with High-Aspect-Ratio Processing
This week, at the 2022 IEEE International Interconnect Technology Conference (IITC 2022), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents options to reduce the metal line resistance at tight metal pitches, mitigating the resistance/capacitance (RC) increase of future interconnects using direct metal patterning.
Palomar Technologies places SST 5100 Vacuum Furnace at the EPIC-CENTRE-Torbay to Support Optoelectronics Packaging
Palomar Technologies announced the consignment of an SST 5100 Vacuum Reflow Furnace at the Electronics and Photonics Innovation Centre (EPIC) in Paignton, UK.
LEGO Stacking of 2D Materials Brings Us a Step Closer to Ultracompact Memory and Spintronic Technology
SUTD scientists designed a novel functional 2D hybrid material for ultracompact memory and spintronic device applications.
Siemens and NVIDIA to Enable Industrial Metaverse
Siemens and NVIDIA today announced an expansion of their partnership to enable the industrial metaverse and increase use of AI-driven digital twin technology that will help bring industrial automation to a new level.
Weebit Nano Tapes Out ReRAM Demo Chip to SkyWater Foundry
Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, announced it has taped-out (released to manufacturing) demonstration chips integrating its embedded Resistive Random-Access Memory (ReRAM) module to SkyWater Technology’s foundry.
Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
Flex Logix EFLX embedded FPGA brings reconfigurable computing to CEVA-X2 DSP instruction extension to support demanding and changing workloads.
Lam Research Outlines Path, Progress to Net Zero Emissions
Semiconductor industry leader releases annual environmental, social and governance report, and unveils new program to empower social impact.
SiFive Expands Global Operations, Opens UK R&D Center in Cambridge
SiFive, Inc., the founder and leader of RISC-V computing, today announced the opening of its new UK Research & Development (R&D) Center headquartered in Cambridge, United Kingdom.
Micron Delivers Industry’s First 176-Layer NAND SATA SSD for Data Centers
Micron Technology, Inc. today announced it is shipping the world’s first 176-layer NAND SATA SSD designed for data center workloads.
Anari AI Launched Thor X – the First “System-on-Cloud” for Processing 3D Point Clouds
A new Cloud-based technology “System-on-Cloud”, developed by the Anari AI team, introduces an optimized and efficient system from various different hardware and software architectures combined with machine learning models to revolutionize the way AI compute systems are utilized.
Purdue University Partners with Leading Global Chipmaker on Midwest’s First Semiconductor Design Center
Purdue University’s College of Engineering is partnering with MediaTek Inc., a global fabless chipmaker, to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.
ALD/CVD Precursor Markets – Burgeoning Applications
Advanced Logic and Memory Applications require more deposition materials.
Intel Labs Announces Integrated Photonics Research Advancement
Intel demonstrates a tightly controlled eight-wavelength laser array on a silicon wafer with matched power and uniform spacing.
EMD Electronics’ Digital Solutions organization focuses on leveraging data in R&D, quality, and supply chain to solve industry challenges and accelerate learning cycles. Customers can proactively identify the parameters that matter for their fab performance before excursions occur. They can also gain better control of newly identified parameters to improve the performance of materials in their fabs, which can contribute to yield optimization. The learnings are also useful in R&D for new material innovation which accelerates the ramp up of next generation technology nodes. Watch this video interview with Kutup Kurt, Head of Operations, Digital Solutions at EMD Electronics to learn more.
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The Chip Shortage Wake-up Call
An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.
IPCC 6th Assessment Report Working Group III – Mitigation
The evidence is clear: the time for action is now. We can halve emissions by 2030.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What’s Driving Changes in MEMS Sensors for Automotive?
The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive.
Sony, Samsung, Toshiba, Toppan Have Image Sensor/LiDAR Papers at the VLSI Symposia in June
Since the development of mobile phone camera image sensors, they have been a hot topic with continuous evolution to sub-micron pixels, and more recently the move towards self-driving cars (and other ranging needs) is pushing LiDAR systems.
