MAGAZINE
October
Biomedical Engineering Researchers to Study Knee Re-Injury Risk Using Wearable Sensors
Each year, the number of people wearing smart watches increases, according to recent surveys. These wearable sensors are commonplace and provide useful feedback to individuals about their health. Wearable sensors can also be used in labs and clinics to gain real-time data and inform health decisions.
Applied Materials Unveils eBeam Metrology System that Enables a New Playbook for Patterning Advanced Logic and Memory Chips
Applied Materials, Inc. today unveiled a unique eBeam metrology system that enables a new playbook for patterning control based on massive on-device, across-wafer and through-layer measurements.
PragmatIC Semiconductor Secures $80M Funding
PragmatIC Semiconductor announced that it has secured $80 million of Series C funding.
Akoustis Acquires Majority Ownership Position of RFM Integrated Device, Inc.
Akoustis Technologies, Inc., an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it is acquiring a 51% majority ownership position of RFM Integrated Device, Inc., with the right to purchase the remaining 49% in 2022.
Porotech Creates World’s First Native Red InGaN Microdisplay
A microdisplay breakthrough from University of Cambridge spin-out Porotech is set to accelerate the long-awaited commercialisation of augmented reality (AR) glasses.
Bridging Optics and Electronics
Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences, in collaboration with a team from Washington University, have developed a simple spatial light modulator made from gold electrodes covered by a thin film of electro-optical material that changes its optical properties in response to electric signals.
Intelligent Optical Chip to Improve Telecommunications
An INRS team uses autonomous learning approaches for optical waveform generators to boost optical signal processing functionalities for current and future telecom applications.
Veeco Receives Multi-System Order for New, Dual-Technology Platform that Enables Next Generation Power Electronic Devices
Veeco Instruments Inc. announced today that it has received a multi-system order for its new ADS-800 SRD System from a leading semiconductor supplier.
IBM Commits to Skill 30 Million People Globally by 2030
IBM today unveiled a groundbreaking commitment and global plan to provide 30 million people of all ages with new skills needed for the jobs of tomorrow by 2030.
Imec Signs Licensing Agreement with miDiagnostics to Commercialize its Patented Technology for Fast and Reliable COVID-19 Diagnosis Based on Exhaled Breath
Imec and miDiagnostics announce that they have signed a non-exclusive licensing agreement for imec’s patented technology whereby aerosols and droplets from exhaled breath are captured for screening for viral RNA through miDiagnostics ultrafast PCR technology.
IC Industry at Heart of Possible China Takeover of Taiwan
Combined, China and Taiwan would hold about 37% of global IC capacity, almost 3x that of North America.
The Worldwide Quantum Dot Industry is Expected to Reach $8.6 Billion by 2026
The global quantum dot market is estimated to be worth USD 4 billion in 2021 and is projected to reach USD 8.6 billionby 2026, at a CAGR of 16.2%.
NEXTY Electronics to Distribute Blaize AI Edge Computing Products in Japan
Blaize, the AI computing innovator revolutionizing automotive and edge computing, and NEXTY Electronics Corp., a core member of the Toyota Tsusho Group, today announced NEXTY is now a Blaize distribution partner serving automotive and industrial markets for AI edge computing in Japan.
Panasonic Launches Novel Substrate Film Enabling the Development of Soft Printed Electronics
Leveraging patented thermoset polymer technology, Panasonic researchers have developed BEYOLEX, a pliable, yet durable, stretchable substrate for printed electronics and other applications.
STMicroelectronics and Sierra Wireless Collaborate to Simplify and Accelerate Connected IoT Solutions Deployment
STMicroelectronics and Sierra Wireless, an IoT services provider, have announced an agreement that will enable the STM32 microcontroller (MCU) user community to leverage flexible cellular IoT connectivity and edge-to-cloud solutions from Sierra Wireless.
Power and Compound Fab Capacity Projected to Top Record 10 Million Wafers Per Month in 2023, SEMI Reports
Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions wrought by the pandemic, worldwide installed capacity for power and compound semiconductor fabs is projected to top 10 million wafers per month (WPM) for the first time in 2023, growing to 10.24 million WPM (in 200mm equivalents) and climbing to 10.6 million WPM in 2024, SEMI announced today.
Rambus Advances Server Memory Performance with the Industry’s First 5600 MT/s DDR5 Registering Clock Driver
Rambus Inc. (NASDAQ: RMBS), a chip and silicon IP provider making data faster and safer, today announced it is now sampling its 5600 MT/s 2nd-generation RCD chip to the major DDR5 memory module (RDIMM) suppliers.
SkyWater Signs Technology Transfer and License Agreement for Deca’s Gen 2 M-Series Fan-out and Adaptive Patterning Technology
SkyWater Technology, the trusted technology realization partner and Deca Technologies(Deca), a provider of advanced electronic interconnect technology, today announced an agreement for Deca’s second generation M-Series fan-out wafer-level packaging (FOWLP) technology with Adaptive Patterning within SkyWater’s advanced packaging facility in Florida.
Semtech Launches Upgraded LoRa Developer Portal
Semtech Corporation, a global supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced the upgraded launch of the LoRa Developer Portal, which makes it easier for developers, regardless of experience level, to quickly build Internet of Things (IoT) devices connected with the LoRaWAN standard.
New Nanostructure Could Be the Key to Quantum Electronics
Using a completely new synthesis approach, nanostructures made of aluminium single crystals and the semiconductor germanium are jointly explored at TU Wien and CNRS-UGA Grenoble for future quantum technologies.
Contributing to Solve the Heat Concentration Problem in Power Semiconductors
In high-performance CPUs used in large servers and power semiconductors used in inverters for hybrid electric vehicles (HEVs), as the integration density rises and the higher the power consumption becomes, the semiconductor package is also becoming smaller.
2021 IEDM to Unveil the Latest Advances in Semiconductors and Related Technologies
The foundational elements of digital technologies – semiconductors and other micro/nanoelectronic devices – have become indispensable to modern life, and the place to learn about cutting-edge research in the field is the 67th annual IEEE International Electron Devices Meeting, to be held December 11–15, 2021 at the Hilton San Francisco Union Square hotel.
AI Chipmaker Hailo Raises $136 Million to Expand Edge AI Solutions as Global Demand Surges
AI chipmaker Hailo today announced it has raised$136 million in a Series C funding round led by Poalim Equity and Gil Agmon.
Meet the Brooks Instrument pressure-based mass flow controller (P-MFC) that can HANDLE the PRESSURE, the GP200 Series.
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The Chip Shortage Wake-up Call
An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt.
Sustainable Manufacturing
Regular followers of this blog will notice a shift in focus with this post. For the last year or so we have covered issues related to service and support for vacuum and abatement systems that enable semiconductor processes. With this post we will shift our focus to the more general topic of sustainability in semiconductor manufacturing.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What’s Driving Changes in MEMS Sensors for Automotive?
The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive.
AMD Announces Use of TSMC 3D Fabric for Stacked Vertical SRAM Cache, TechInsights Confirms Current Ryzen 5950X is TSV-Capable
At Computex a couple of months ago Lisa Su of AMD gave a keynote talk detailing their new products, but at the tail end she surprised attendees by discussing their advancements in packaging technology.
