MAGAZINE
March
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
AMD Completes Acquisition of ZT Systems
AMD today announced the completion of its acquisition of ZT Systems, a provider of AI and general-purpose compute infrastructure for the world’s largest hyperscale providers.
Georgia Tech Launches Tech AI to Accelerate the Real-World Impact of Artificial Intelligence
The announcement marks the start of Tech AI Fest, the Southeast’s leading AI event, bringing together leading academics, industry experts, government figures, and students for three days of creative partnerships and transformative ideas.
What’s in the March Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the March issue.
Self-Powered Wireless Sensing Fibers for New Wearable Technology
With the rapid development of the Internet of Things (IoT) and smart devices, wearable technology is becoming an important part of people’s lives.
Bosch Establishes Company with the Synthetic Diamond Solutions Provider Element Six
Quantum sensors: partnership to extend innovation leadership.
DuPont Wins Four Edison Awards
DuPont today announced that four of its innovative material technologies were recognized with the prestigious 2025 Edison Awards. Selected from hundreds of nominees, DuPont received two Gold awards, a Silver and a Bronze.
TECHCET Forecasts Strong Expansion in Sputtering Targets
TECHCET projects semiconductor sputtering target revenues to grow near 9% in 2025, reaching $1.45 billion.
Imec Identifies Stable Operating Range for GaN MISHEMTs in RF Power Amplifiers
The findings support GaN-Si’s potential for high reliability 5G+/6G communication systems.
Global Semiconductor Sales Increase 17.1% Year-to-Year in February
Sales hit highest-ever total for month of February; worldwide chip sales decrease 2.9% month-to-month.
Quantinuum Selected by DARPA to Advance to First Stage of Quantum Benchmarking Initiative
Quantinuum has been selected by the Defense Advanced Research Projects Agency (DARPA), a research and development agency of the United States Department of Defense, to participate in the first stage of the agency’s Quantum Benchmarking Initiative (QBI).
European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
The European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.
Twisted Crystals Open Door to Smaller, More Powerful Optical Devices
Researchers develop first-of-its-kind optical sensor that can simultaneously measure wavelength, polarization.
Ultrathin Interlayer Empowers Green ZnSeTe QD-LEDs: Brighter, More Efficient, Driving Eco-Friendly Displays Forward
New research from the Henan University proposes an effective defect passivation strategy for green-emitting ZnSeTe-based quantum dots.
Novel Miniaturized Anti-Spring MEMS Accelerometer with Enhanced Performance
In a major leap forward for microelectromechanical systems (MEMS) technology, researchers have unveiled a novel miniaturized accelerometer that can boost sensitivity, reducing noise and bias instability while maintaining compact chip size.
Photonic Inc. Selected for DARPA’s Quantum Benchmarking Initiative Stage A
Photonic Inc. announced its selection for Stage A of the Defense Advanced Research Projects Agency (DARPA) Quantum Benchmarking Initiative (QBI).
The World’s Smallest PPG Sensor Head
SCIVAX Corporation and TSLC Corporation, a SemiLEDs Corporation wholly owned company announced that SCIVAX+TSLC have developed the world’s smallest PPG sensor head, which will be presented at the display related technology exhibition ”Touch Taiwan” to be held in Taipei, Taiwan from April 16 to 18, 2025.
Toshiba Appoints Jim Hawkins as Chief Operating Officer
Toshiba America Business Solutions is elevating its vice president of sales operations and Toshiba Business Solutions Latin America Jim Hawkins to the role of chief operating officer.
FormFactor Doubles Capacity at Taiwan Service Center to Meet Growing Demand
Strategic investment enhances local capabilities to elevate customer support and satisfaction with FormFactor products.
Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
Ansys today announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC’s N2 silicon process technology.
Sivers Semiconductors Announces Strategic OEM Partnership with O-Net Technologies
Sivers Semiconductors AB today announced a strategic partnership with O-Net Technologies to produce high-performance external laser sources, a critical component enabling next-generation AI data center architectures.
Tokyo Electron and IBM Renew Collaboration for Advanced Semiconductor Technology
Today, IBM and Tokyo Electron (TEL) announced an extension of their agreement for the joint research and development of advanced semiconductor technologies.
Exploring AI’s Role in Decarbonizing the Chemical Industry: A Multi-Scale Perspective
As the chemical industry seeks sustainable transformation, decarbonization requires intelligent solutions across multiple scales to enhance efficiency and reduce emissions. A research team led by Professor Xiaonan Wang at Tsinghua University has systematically reviewed AI-driven multi-scale smart systems for decarbonizing this energy-intensive sector.
lowRISC and SCI Semiconductor Release Sunburst Chip Repository for Secure Microcontroller Development
Open source release accelerates path to market for commercial CHERIoT-based secure microcontrollers, supporting industry adoption and innovation.
Natcast Announces Dr. Craig Child as Director of the CHIPS for America EUV Accelerator
Industry veteran will lead Natcast on-site staff and enable NSTC Members and Natcast researchers to leverage state-of-the-art EUV technology in advancing innovation and U.S. economic and national security.
Featured Video
At SEMICON West 2024, Editor-in-Chief Pete Singer caught up with Nordson TEST & INSPECTION’s Carla Furanna who provides some insights into the company’s products for front, middle and backend applications. Products highlighted at the show include WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), and Gen 7™ Acoustic Micro Imaging (AMI) system. Additionally, the innovative SpinSAM™ AMI system was unveiled for the first time at the show. The new system delivers industry-leading throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies.
Semiconductor Daily Digest in your inbox
Featured Products
Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
EVENTS
April
May
June
