BOB PATTI, President of NHanced Semiconductors
In the coming year, I expect to see more prototype designs making use of integrated photonics. The demand for better performance is pushing photonic technology toward commercial status and the market is more than ready. I also expect prototypes with integrated thermal solutions – heat spreaders, liquid cooling, etc. – to deal with dense 3D circuitry and rising power usage. These solutions are also in active development and should hit the market in 2 to 3 years.
Of course, the chiplet story continues to unfold. Big chip vendors already make extensive use of chiplets in their own designs, but this vertical usage is due to expand. I predict that some chip vendors will announce their entry into the commercial chiplet market next year. They are likely to begin by offering external availability of their existing in-house chiplets. This will be a win-win, giving the vendors a new revenue source from their existing chiplet designs and boosting the capabilities of assembly houses and advanced packaging companies like NHanced.
Click here to read the 2025 Executive Viewpoints in Semiconductor Digest
