DR. JEORGE HURTARTE, Teradyne
As semiconductor technologies advance, 2025 will see automated test equipment (ATE) evolve to meet new testing challenges, particularly as chip complexity and demand for performance continue increasing.
As chips approach the limits of Moore’s Law, advanced nodes like 3nm and 2nm will bring significant challenges for test due to higher transistor density, power efficiency demands, and increased variability in manufacturing. The role of advanced ATE systems will become even more critical; smaller geometries increase test sensitivity requirements, demanding ATE systems with higher precision and accuracy.
Additionally, semiconductor packaging innovations such as chiplets and 2.5D/3D advanced packaging integration mean each component must be tested individually and as part of an integrated package requiring specialized probes and interfaces, with new standards helping streamline these processes. ATE’s focus is on enhancing precision and reducing the cost of test while maintaining high-quality yields.
Edge AI also plays a role—further driving the need for new ATE testing strategies due to its localized, real-time data processing requirements. This shift away from centralized data centers introduces challenges related to latency, bandwidth, and privacy. This requires ATE systems to adapt to the complexity of testing AI applications in edge environments, with solutions that can efficiently handle real-time, diverse, and distributed AI workloads.
To achieve this, the industry is shifting toward flexible strategies that encompass both ATE and system level test (SLT). Manufacturers must evaluate semiconductor devices under real-world conditions, ensuring comprehensive validation of the chip’s performance and interactions with other hardware and software components. This is particularly critical for advanced system-on-chip (SoC) and system-in-package (SiP) designs, that require meticulous testing to identify issues early in production.
Advanced data analytics are critical; integrating AI into test is providing new ways to analyze vast amounts of data, identify patterns, and optimize testing parameters in real-time. AI-driven data analytics offer valuable insights for continuous yield improvement, allowing test partners to deliver higher quality across the semiconductor lifecycle.
In 2025, the ATE industry will be deeply influenced by semiconductor evolution. As chip sizes shrink and devices become more complex, the demand for advanced, flexible, and AI-driven testing solutions will increase. Collaboration and adherence to emerging standards will help ATE providers stay competitive and lead the way in tackling these challenges.
Companies that can adapt to these changes — whether through AI integration, SLT, or the use of data analytics — will thrive in the rapidly shifting landscape of semiconductor development.
Click here to read the 2025 Executive Viewpoints in Semiconductor Digest
