DR. MICHAEL ZEUNER, CEO, scia Systems GmbH
To celebrate the 100th anniversary of quantum mechanics, the United Nations has officially designated 2025 as the “International Year of Quantum Science and Technology”. This designation is appropriate since 2025 will see greater innovations around optical communications systems, which are fundamental to quantum science and technology advancements. In particular, innovations around photonic integrated circuits (PICs) have the potential to transform our ability to meet the demands of our increasingly data-driven world. The exponential growth in data traffic, driven by trends such as the Internet of Things (IoT), 5G, and cloud computing, demands innovative solutions that enhance bandwidth, efficiency, and speed. PICs represent a pivotal advancement, offering the ability to process and transmit data at optical speeds while significantly reducing energy consumption compared to traditional electronic circuits.
PICs contain photonic components, such as waveguides, lasers, modulators, and detectors, that are designed to manipulate and transmit light signals. As a result, this enables high-speed data transmission, reduced signal loss over long distances, and immunity to electromagnetic interference. The importance of PICs lies in their capacity to integrate multiple optical functions—such as modulation, detection, and amplification on a single chip. PICs are versatile components used across a wide range of industries, from telecommunications to healthcare, quantum computing, and beyond, providing advanced optical solutions for data transmission, sensing, and computing applications.
One of the critical enabling technologies for advancing PICs is ion beam processing. Ion beam processing enables the manufacture of three-dimensional optoelectronic microstructures for PICs, such as waveguides and other optical components. This technique allows, for example, high-precision etching and trimming with nanometer precision, which is essential for fabricating these complex structures. Ion beam processing also contributes to the yield and reliability of PIC production by improving microroughness to minimize defects and maintain the performance standards required in high-speed communications systems.
While we continue to push the boundaries of data transmission and processing capabilities, leveraging ion beam processing and other technologies will be vital to maintaining a competitive advantage. PICs, bolstered by ion beam processing, will undoubtedly play a central role in shaping the future of optical communications systems. When looking to the future, we must prioritize investments in these areas to ensure we are positioned to lead in this rapidly evolving landscape.
Click here to read the 2025 Executive Viewpoints in Semiconductor Digest
