3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.
“As the demands of AI and other high performance computing technologies increase, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines.” said Steven Vander Louw, 3M’s president of display and electronics product platforms. “The companies in the US-JOINT Consortium represent US and Japanese innovation leaders in a range of advanced packaging technologies. 3M is pleased to join the consortium in order to bring our decades of materials science expertise, across more than 50 technology platforms, to help address these challenges.”
For more than 25 years, 3M has been a supplier of materials and processing aids for semiconductor polishing, advanced packaging, and chip transport applications. Teaming up with industry leaders continues to reinforce 3M’s commitment to be an integrated total solutions provider for the semiconductor industry.
The consortium was founded in 2023 and led by Japan-based Resonac, a global leader in the semiconductor and electronics industry.
“We are delighted to welcome 3M to the US-JOINT Consortium,” said Hidenori Abe, CTO for semiconductor materials, Resonac. “3M’s expertise in materials science and commitment to innovation in advanced packaging device and process solutions will be an asset as we work together to solve difficult technical and integration challenges for customers onshore in the United States.”
The new US-JOINT Consortium R&D facility is expected to be unveiled later this year in conjunction with a public launch event.
