A new market study published by Global Industry Analysts Inc., (GIA) the premier market research company, today released its report titled “Silicon Reclaim Wafers – Global Market Trajectory & Analytics”. The report presents fresh perspectives on opportunities and challenges in a significantly transformed post COVID-19 marketplace.
Global Silicon Reclaim Wafers Market to Reach $840.4 Million by 2026
Silicon Reclaim Wafers are defined as reprocessed used test and prime wafers, which are stripped and re-polished for re-use. Silicon wafers are used extensively in semiconductors industry and today form the foundation of all electronics components. As the fundamental building block for semiconductors, silicon wafer demand is significantly linked to the sales of electronic products including computers, telecommunication products, and consumer, automotive and industrial electronics. While silicon wafers are offered in various sizes, the trend is towards larger sizes that allow fabrication of multiple chips on a single silicon, thereby reducing manufacturing costs per semiconductor chip. At present, 12-inch or 300mm diameter wafers comprise the largest category. New processing technologies are helping reduce the risk of defect formation in silicon wafers, an important benefit given the escalating cost of raw semiconductor grade silicon and silicon wafer development. Given the large number of wafers required for testing purposes, use of reclaim wafers for testing applications is poised to benefit due to the significant cost savings offered as compared to virgin test wafers.
Amid the COVID-19 crisis, the global market for Silicon Reclaim Wafers estimated at US$529.7 Million in the year 2020, is projected to reach a revised size of US$840.4 Million by 2026, growing at a CAGR of 7.6% over the analysis period. 300mm, one of the segments analyzed in the report, is projected to record a 8.2% CAGR and reach $584.8 Million by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the 200mm segment is readjusted to a revised 5.9% CAGR for the next 7-year period. In the semiconductor industry, wafer diameter is steadily increasing from 200mm to 300mm. This transition to larger diameter wafer sizes is primarily the result of the growing focus on reducing cost per die. Key factors driving the transition to larger silicon wafer sizes include the constant need for miniaturization, and developments in packing density i.e. very large scale integration (VLSI) as well as system on chip (SOC).
The U.S. Market is Estimated at $120.7 Million in 2021, While China is Forecast to Reach $42 Million by 2026
Silicon Reclaim Wafers market in the U.S. is estimated at US$120.7 Million in the year 2021. China is forecast to reach a projected market size of US$42 Million by the year 2026 trailing a CAGR of 9.8% over the analysis period. Among the other noteworthy geographic markets are Japan and Europe, each forecast to grow at 5.9% and 6.5% respectively over the analysis period. In North America, growing installations of solar panels are leading to high demand for silicon wafer reclaim services. The region is home to several major players engaged in offering the reclaim wafer services due to the widespread availability of technical expertise. In Europe, demand for reclaim silicon wafers will be supported by the growing adoption of renewable energy sources and the increasing demand for various electronic devices and components. Growth of the electronic industries of India, China, Thailand, Taiwan and South Korea is anticipated to contribute to market growth in Asia-Pacific. The regions are also witnessing major shift towards renewable energy, which also contributes to increased silicon wafer reclaims demand
