Veeco Instruments Inc. (NASDAQ: VECO) today announced that a semiconductor manufacturer has ordered multiple Veeco WaferStorm Wet Processing Systems for advanced packaging applications. The systems were chosen due to the low cost of ownership advantage and process performance compared to other platforms. The customer also operates Veeco’s LSA201 Laser Spike Annealing System for their front-end-of-line processes and AP300 Lithography Systems for advanced packaging.
“We are proud to have been selected by yet another world-leading semiconductor manufacturer for our wet processing technology,” commented Adrian Devasahayam, Ph.D., Senior Vice President, Product Line Management. “The WaferStorm platform consistently demonstrates low chemistry usage driving low operating costs. Our wet processing systems enable next generation advanced packaging in large part because of our proprietary ImmJETTM solvent technology, a combination of batch immersion and single wafer spray processing that delivers superior process capabilities and low cost of ownership for photoresist strip and dry film strip applications.”
Veeco’s lithography and wet processing products offer key differentiation related to performance and cost of ownership that enables growth of the advanced packaging market. According to Yole Développement, the global advanced packaging market is projected to grow at an 8 percent compound annual growth rate and reach $48.2 billion USD by 2026.
