Veeco Instruments Inc. (NASDAQ: VECO) today announced that the Taiwan Semiconductor Research Institute, National Applied Research Laboratories (TSRI, Narlabs) has selected Veeco’s Propel R&D Metal Organic Chemical Vapor Deposition (MOCVD) System for advanced development and collaboration related to gallium nitride (GaN)-based power and RF devices. The single wafer Propel platform is ideal for high volume manufacturing and 300mm capabilities, as well as R&D applications. This Propel R&D system has been installed in TSRI’s Hsinchu, Taiwan laboratory. It enables a joint collaborative effort to drive technology innovations, as well as develop and demonstrate technical capabilities in the emerging GaN markets. The joint effort and collaboration accelerate wide-bandgap compound semiconductor technology to high volume and low-cost applications on 200 and 300mm substrates.
“Veeco’s Propel R&D System is uniquely qualified to deliver the performance and flexibility required to conduct advanced developments of power and RF devices,” commented Dr. Chang-Hong Shen, Deputy Director-General, Research Fellow at TSRI. “We are excited to have this R&D system operating in our facility and look forward to support from the Veeco team in the years to come.”
Veeco’s Propel GaN MOCVD system is designed specifically for power and RF applications. Featuring a single-wafer reactor platform, the system deposits high-quality GaN films for the production of highly efficient power and RF devices. The single-wafer reactor is based on Veeco’s TurboDisc technology including the IsoFlange and SymmHeat breakthrough technologies, which provide homogeneous laminar flow and uniform temperature profile across the entire wafer.
“We are pleased to have our MOCVD system selected by TSRI to help develop their advanced power and RF applications,” said Adrian Devasahayam, Ph.D., Senior Vice President, Product Line Management. “We now have multiple technologies installed at TSRI’s facility and we look forward to helping them maximize the value of our platforms and the opportunity for technology collaboration.”
