Murata, a manufacturer of electronics components and solutions, today announced its second generation LTE-M/NB-IoT module, the Type2GD. Featuring recently announced ALT1350 chipset from Sony Semiconductor Israel (Sony), it is the first solution on the market that offers ultra-low power and multiple LPWA communication protocols including non-terrestrial networks (NTN) satellite connectivity support in a single system-on-chip (SoC) package.
Combining Sony’s advanced LTE Cat M/NB-IoT technology with Murata’s proprietary packaging technology, the solution distinguishes itself with the smallest physical dimensions, lowest power consumption, and most advanced feature set available. It is well-suited for a variety of IoT applications including smart meters, smart labels, asset tracking, mobile healthcare, wearables, and telematics. The operating current is greatly reduced from the previous generation with an 80 percent reduction in 3GPP™ eDRX mode, 85 percent reduction for short message transmission, and 4x overall improvement in battery life for typical IoT applications.
A new short-range radio subsystem provides hybrid communication capability to meet the needs of industrial IoT applications such as smart meter and smart city. The onboard IEEE 802.15.4-based radio is compliant with Wi-SUN®, U-Bus Air, and wM-Bus protocols and supports both point-to-point and mesh networks. The Type2GD has multiple onboard options for location tracking, including new Wi-FiTM-based positioning for indoor tracking as well as cell tower and GNSS tracking.
The optimized software architecture of the Type2GD provides a fully isolated user MCU, separating user applications from the details of the cellular protocol and network stack. Combined with a new ultra-low power sensor hub capability for collecting sensor data in sleep mode, designing battery-operated devices with multiple year life spans is now easier than ever. Configuration and deployment are also simplified, with a fully 3GPP-compatible iSIM enabling Zero Touch Provisioning, a groundbreaking feature for automating and streamlining IoT device configuration for cloud connectivity.
Murata’s module is enclosed in an RF-shielded, ultra-miniaturized package with an advanced industry-unique, non-silvered molding compatible with post-reflow conformal coating and potting. This enables the end-product to work reliably in extreme conditions over an extended lifetime.
“The collaboration with Sony, an industry leader in cellular IoT connectivity, ensures that we deliver unsurpassed feature integration, security, and system cost in the smallest form factor possible,” said Akira Sasaki, General Manager of Connectivity Module Marketing, Murata, “The module is designed to address specifications of vertical markets such as tracking, metering, wearables, and other emerging markets. Looking forward, it will offer worldwide operator certificates to allow customers to launch the product globally with a single design.”
“We are excited to have Murata as our strategic module partner for next generation LTE solution,” said Dima Feldman, VP Product Management and Marketing at Sony Semiconductor Israel. “Combining Sony’s Altair game changing new ALT1350 solution and Murata’s technological innovation, highest product quality, worldwide footprint and channel partnership, we hope to contribute to providing feature-rich and easy-to-use solution for both vertical and mass market IoT customers through Murata’s 2nd generation cellular IoT module.”
