Scintil Photonics, an innovator in silicon Photonic Integrated Circuits (PICs), will demonstrate its latest technology, a single-chip multi-port 100 GHz DFB (Distributed FeedBack) Comb Laser Source for high-performance computing and AI applications, at booth #3351 during OFC 2023.
Named SCINTIL Comb Laser Source, this is the first fully integrated single chip that achieves 100-GHz frequency spacing, which is half to one-quarter of the spacing available today. One of its key advantages is its very narrow controlled channel spacing, an important capability for increasing the number of optical carriers in a single fibre.
“We are thrilled to showcase our latest innovation, a 100 GHz DFB Comb Laser, at OFC 2023,” said Sylvie Menezo, CEO of Scintil Photonics. “Increasing computing capacity requires connecting larger networks of computing units with higher transmission rates. In order to achieve this with sustainable energy efficiency, fiber optic transmission links are used with multiple optical carriers multiplexed on one single fiber. We have succeeded in implementing a comb laser source with only 100 GHz spacing between each optical carrier. This offers at least twice the number of optical carriers compared to what appears to be available today, and therefore enables doubling the transmission speed. Leading customers are currently evaluating our solution.”
The increasing demand for high-performance computing and AI applications has led to the need for faster and more efficient optical interconnects. The SCINTIL 100GHz-Comb Laser Source enables the use of uncooled Dense Wavelength Division Multiplexing (DWDM) links in short reach transmissions, with optical carriers twice as dense (100 GHz versus 200 GHz spacing).
“The Scintil integrated team did an excellent job at every step, from the design of the chip to the packaging and the electronics for a complete solution, with additional locking functions. Thanks to our CMOS commercial foundry, we anticipate ramping up volume by Q4, 2024. We think that our technology will be a game-changer in the field of interconnects for high-performance computing and AI applications,” Menezo added.
