IMAPS has rebranded its well-attended, annual Advanced System-in-Package conference to the Chiplet & Heterogeneous Integration Packaging Conference (CHIPcon). As the world’s leading semiconductor companies continue to push the edge of process technology, the industry is seeing a marked shift in device design and architectures to overcome economic and time-to-market challenges. The conference name change is the result of the rapidly rising adoption of chiplet-based device architectures, and the increasingly critical role packaging technology is taking in the manufacture and enablement of these advanced products.
The IMAPS CHIPcon conference will be held July 24-27, 2023, at the DoubleTree by Hilton San Jose in San Jose, California, and will focus exclusively on innovative device integration technology developments, solutions, and business trends. The program will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, high-performance computing and networking market segments. Speaker opportunities are by invitation only from the technical committee.
Advanced CHIP technology is an umbrella term that covers a variety of packaging technology subsets, including laminate/glass/ ceramic/silicon/leadframe based SiP, FanOut RDL, 2.5D/3D Heterogeneous Integration, and modules.
CHIPcon will explore the current state-of-the-art and emerging packaging technology roadmap supporting the integration and delivery of a complete system or subsystem solution. Attendees will be exposed to thought-provoking advanced package structures with high functioning system performance, mechanical reliability, thermal management and high-yield manufacturability.
