SkyWater Technology and BRIDG today announced the delivery and installation of Nordson TEST & INSPECTION’s D9650 C-SAM system at the Center for Neovation located at NeoCity in Osceola County, Florida. The new tool will be utilized by SkyWater Florida to enhance onsite metrology capabilities for advanced packaging and heterogeneous integration technology.
Made possible through an award granted to the Central Florida Semiconductor Coalition from the U.S. Department of Commerce EDA Build Back Better Regional Challenge (EDA BBBRC), announced in September 2022 with Osceola County, the Nordson D9650 acoustic micro imaging instrument represents the first new tool acquired by the coalition to support facility and equipment enhancements at the Center for Neovation. This grant will be used to grow Osceola County’s NeoCity as an innovation center for semiconductor research, design and manufacturing, and will help address the microchip shortage, lower costs and boost local high paying jobs.
Coalition partners include the Orlando Economic Partnership, the University of Central Florida (UCF), BRIDG, SkyWater, the Florida High Tech Corridor, Valencia College and the Osceola Chamber. The Osceola County coalition was one of 21 winners out of over 500 submissions and the only recipient from the semiconductor industry.
“During a time when our nation’s semiconductor industry is losing global market share, we’re working together at NeoCity to change this trajectory,” stated Don Fisher, Osceola County manager. “Through funding made possible from the EDA BBBRC award, we welcome our newest inspection tool to the Center for Neovation – the first of several tools to come!”
“Investments made in semiconductor technology R&D are critical to our nation, and partnerships are essential to building an attractive economic ecosystem,” said Jim Vandevere, BRIDG president. “We’re proud to leverage the EDA BBBRC award in Osceola County, Florida to reach this key milestone and continue investing in our region, strengthening our role as the domestic hub for advanced packaging.”
“The implementation of Nordson TEST & INSPECTION’s D9650 C-SAM system at SkyWater Florida represents a significant addition to our metrology capabilities for heterogeneous integration technologies that we’re establishing,” said Dale Miller, VP and general manager of SkyWater Florida. “This system will primarily support package and assembly inspection operations and can also support the hybrid wafer bonding technology we have licensed from Adeia as well as other advanced packaging applications we continue to implement at the Center for Neovation.”
