ACM Research, Inc. (ACM) (NASDAQ: ACMR), a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today, through its operating subsidiary ACM Research (Shanghai), Inc., announced receipt of the first purchase order (PO) for its Ultra C SiC substrate cleaning tool. The platform leverages ACM’s patented Space Alternated Phase Shift (SAPS) cleaning technology which is designed to achieve more comprehensive cleaning without damage to device features. The PO was received from a leading Chinese silicon carbide (SiC) substrate manufacturer and is expected to ship before the end of the third quarter of 2023.
SiC substrates are used to manufacture power semiconductors, which are used in a wide range of applications such as power conversion, electric vehicles, and renewable energy. The key advantages of SiC-based technology include reduced switching power losses, higher power density, better heat dissipation, and increased bandwidth capability. Increased demand for power semiconductors from various industries such as automotive and renewable energy is driving growth in the SiC device market, which is expected to exceed $4 billion USD by 2026 according to Yole Développement[1].
“The power semiconductor market is experiencing strong growth, with the electric vehicle market and related infrastructure seeing rapidly accelerating deployments,” said David Wang, founder and CEO of ACM. “This order represents the successful application of ACM’s experience in advanced semiconductor wafer processing equipment to meet the unique requirements of SiC substrate manufacturing. We remain committed to expanding our product portfolio to support additional market opportunities.”
