ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the receipt of a first tool order for its Ultra C SAPS-V cleaning tool from a major Europe-based global semiconductor manufacturer. The tool is expected to be shipped to the prospective customer’s European facility in the fourth quarter of 2023.
“We are pleased to make further progress on ACM’s mission to become a supplier to major global semiconductor manufacturers,” said Dr. David Wang, President and Chief Executive Officer of ACM Research. “With our business scaled in mainland China and the evaluation at a major US manufacturer underway, we are beginning to see traction for our SAPS technology in the European market. The receipt of our first tool order in Europe is a testament to the strength of our technology and the efforts of our sales team. We are optimistic that success with this tool can lead to repeat business from this customer, as well as new opportunities with other major customers in the region.”
