Adeia Inc. (Nasdaq: ADEA), the company whose patented innovations enhance billions of devices, will showcase the latest developments in hybrid bonding technology at the 20th Annual Device Packaging Conference (DPC 2024) on March 18-21, 2024, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona. DPC 2024 is organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
Hybrid bonding technology in advanced 2.5 and 3D packaging has rapidly gained traction in the semiconductor industry to enhance performance and scalability. Advanced packaging architectures integrate multiple semiconductor components into a single package or module to create functional systems. Within the package or module, a chip-to-chip, also known as chiplet, interconnect formed with hybrid bonding can deliver the highest bandwidth with low latency.
“The explosive growth of artificial intelligence applications is placing a premium on high bandwidth chip-to-chip architectures in the semiconductor sector. Hybrid bonding technology is a key enabler that improves the performance of sensors, memory chips and logic devices,” said Dr. Laura Mirkarimi, senior vice president, engineering, at Adeia.
With an extensive and growing portfolio of intellectual property covering hybrid bonding, advanced process nodes and advanced packaging technologies, Adeia licenses and partners with leading semiconductor companies worldwide.
To learn more about Adeia’s work with chiplet architectures and hybrid bonding during the DPC 2024 event:
- Visit Adeia Booth #41 – The Adeia team will showcase the latest innovations in hybrid bonding technology.
- Attend Poster Session – Adeia’s Dr. Oliver Zhao, staff integration engineer, integrated packaging, will deliver a presentation titled, “Surface Metrology and Defect Characterization for Hybrid Bonding” on March 20, 2024, from 6:00-8:00 pm.
