The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is now accepting abstract submissions for its 2024 event, May 13-16, in Albany, New York. ASMC 2024 will feature technical presentations of more than 90 peer-reviewed manuscripts on advanced semiconductor manufacturing along with keynotes, a tutorial, a panel discussion, and networking events. Technical abstracts are due October 20, 2023. See the ASMC 2024 Author Kit for submission details.
ASMC 2024 encourages submissions of abstracts of papers co-authored by device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing.
Selected speakers will present to IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academics gathered at the event. All technical papers will be published by IEEE, and papers may be published in a special section on ASMC 2024 in IEEE Transactions on Semiconductor Manufacturing.
Technical presentation topics include:
- Advanced Equipment Processes and Materials
- Advanced Metrology
- Advanced Patterning, Design for Manufacturability and Design-Technology Co-Optimization
- Advanced Process Control
- Big Data Management and Mining
- Contamination Free Manufacturing
- Defect Inspection and Reduction
- Discrete and Power Devices
- Equipment Optimization
- Factory Automation
- Industrial Engineering
- Innovative Silicon Devices and Processes
- Lean Manufacturing
- Manufacturing for Sustainability
- Non-silicon and Non-CMOS
- Packaging and Through Silicon Via
- Smart Manufacturing
- The Fabless Experience
- Workforce Development
- Yield Enhancement and Learning
- Yield Methodologies
ASMC, in its 35th year, provides critical insights into advanced semiconductor manufacturing and remains a vital venue for professionals to network and exchange knowledge about best practices.