Researchers from Intel Corporation and the University of Minnesota and the University of Wisconsin have shown that strained atom-scale films of pure ruthenium (Ru) metal exhibit ferromagnetism at room temperature, openning up the possibility of using the material to build…
Mott Memristor Chaos could make Efficient AI
Congratulations to Suhas Kumar, John Paul Strachan, and R. Stanley Williams of Hewlett Packard Labs in Palo Alto for showing not just how to make a Mott memristor, but that you can create controlled chaos with one. “We showed that…
MEMS Mirrors for LIDAR
Clever integration of new microelectronic/nanoelectronic technologies will continue to provide increased functionalities for modern products. Light Imaging, Detection, And Ranging (LIDAR) technology uses lasers to see though fog and darkness, and smaller less expensive LIDAR systems are needed for autonomous…
Moore’s Law Smells Funny
…maybe we need “Integrated Cleverness Law” “Jazz is not dead, it just smells funny.” – Frank Zappa 1973 from Be-Bop Tango (Of The Old Jazzmen’s Church) Marketing is about managing expectations. IC marketing must position next-generation chips as adding significant…
Flagello to receive Zernike Award at SPIE Advanced Lithography
Donis Flagello, president, CEO, and COO of Nikon Research Corporation of America (NRCA), will be presented with the 2017 Frits Zernike Award for Microlithography on Monday 27 February during SPIE Advanced Lithography in San Jose, California. The award, presented annually…
Photoelectric measure of atomically thin stacks
A team led by researchers at the University of Warwick have discovered a breakthrough in how to measure the electronic structures of stacked 2D semiconductors using the photoelectric (PE) effect. Materials scientists around the world have been investigating various heterostructures…
XMC becomes YRST or Changjiang Storage
As reported by Digitimes, a major enterprise in Wuhan, China has broken ground on the first of three mega-fabs to produce 3D-NAND chips. The final fab name-plate may ultimately read XMC or YMTC or YRST or possibly Changjiang Storage (not…
China to be 15% of World Fab Capacity by 2018
Currently there are eight Chinese 300mm-diameter silicon IC fabs in operation as 2016 comes to a close. Chinese IC fab capacity now accounts for approximately 7% of worldwide 300mm capacity, as reported by VLSIresearch in a recent edition of its…
