Forty-eight hours ago we obtained an iPad 2 and brought it back to the lab, and took it apart to have a look at Apple’s A5 processor chip. We’ve come to the conclusion that the main innovation in the new…
Apple’s A5 Processor is by Samsung, not TSMC
Forty-eight hours ago we obtained an iPad 2 and brought it back to the lab, and took it apart to have a look at Apple’s A5 processor chip. We’ve come to the conclusion that the main innovation in the new…
How to Get 5 Gbps Out of a Samsung Graphics DRAM
It’s well known that electronics games buffs like their image creation as realistic (or at least as cinema-like) as possible, which in image-processing terms means handling more and more fine-grained pixel data as fast as possible. That means more and…
How to Get 5 Gbps Out of a Samsung Graphics DRAM
It’s well known that electronics games buffs like their image creation as realistic (or at least as cinema-like) as possible, which in image-processing terms means handling more and more fine-grained pixel data as fast as possible. That means more and…
Samsung’s 3x DDR3 SDRAM – 4F2 or 6F2? You Be the Judge..
We recently acquired Samsung’s latest DDR3 SDRAM, allegedly a 3x-nm part. When we did a little research, we found that the package markings K4B2G0846D-HCH9 lined up with a press release from Samsung last year about their 2 Gb 3x-nm generation…
Common Platform Goes Gate-Last – at Last!
At the IBM/GLOBALFOUNDRIES/Samsung Common Platform Technology Forum on Tuesday, Gary Patton of IBM announced that the Platform would be moving to a gate-last high-k, metal-gate (HKMG) technology at the 20-nm node. At the 45- and 32-nm nodes there has been…
Common Platform Goes Gate-Last – at Last!
At the IBM/GLOBALFOUNDRIES/Samsung Common Platform Technology Forum on Tuesday, Gary Patton of IBM announced that the Platform would be moving to a gate-last high-k, metal-gate (HKMG) technology at the 20-nm node. At the 45- and 32-nm nodes there has been…
IEDM 2010 Retrospective – Part 1
The International Electron Devices Meeting started its 56th session last week on Sunday in San Francisco. This year the program appears to more academic than in previous years, and this was confirmed by the conference chair in his opening address…
IEDM Next Week!
Next Sunday the great and the good of the electron device world will be gathering in San Francisco for the 2010 IEEE International Electron Devices Meeting. To quote the conference web front page, “IEDM has been the world’s main forum…
TI Ships 40-µm Fine Pitch Copper Pillar Flip Chip Packages
The week before Semicon West, Texas Instruments and Amkor released a joint announcement that they were shipping parts in fine pitch copper pillar packages. Mark Lapedus at EETimes picked the story up and added the detail that the latest OMAP…
