Intel UltraHypes Ultrabook at Monday’s Press Briefing The Intel press session Monday morning at CES was focused exclusively on the Ultrabook, with Mooly Eden hyping up this supposedly new category of laptop. He prefaced the talk by saying there would be…
Intel Press Briefing and Keynote at CES 2012
Intel UltraHypes Ultrabook at Monday’s Press Briefing The Intel press session Monday morning at CES was focused exclusively on the Ultrabook, with Mooly Eden hyping up this supposedly new category of laptop. He prefaced the talk by saying there would be…
Intel Press Briefing and Keynote at CES 2012
Intel UltraHypes Ultrabook at Monday’s Press Briefing The Intel press session Monday morning at CES was focused exclusively on the Ultrabook, with Mooly Eden hyping up this supposedly new category of laptop. He prefaced the talk by saying there would be…
TI Debuts 28-nm OMAP 5 Processor at CES
This year, for the first time I made it to the International Consumer Electronics Show (CES) in Las Vegas. To say it is an endurance test is putting it mildly – close to 150,000 attendees predicted and ~5,000 media/analysts, so…
TI Debuts 28-nm OMAP 5 Processor at CES
This year, for the first time I made it to the International Consumer Electronics Show (CES) in Las Vegas. To say it is an endurance test is putting it mildly – close to 150,000 attendees predicted and ~5,000 media/analysts, so…
TI Debuts 28-nm OMAP 5 Processor at CES
This year, for the first time I made it to the International Consumer Electronics Show (CES) in Las Vegas. To say it is an endurance test is putting it mildly – close to 150,000 attendees predicted and ~5,000 media/analysts, so…
IEDM 2011: IBM displays via-middle TSV process for die stacking
A few days after IBM and Micron publicized their hybrid memory cube, IBM gave their TSV paper at IEDM on the Monday afternoon (paper 7.1). Entitled "3D Copper TSV Integration, Testing and Reliability," they described a node-agnostic through-silicon via (TSV)…
IEDM 2011: IBM displays via-middle TSV process for die stacking
A few days after IBM and Micron publicized their hybrid memory cube, IBM gave their TSV paper at IEDM on the Monday afternoon (paper 7.1). Entitled "3D Copper TSV Integration, Testing and Reliability," they described a node-agnostic through-silicon via (TSV)…
IEDM 2011: IBM displays via-middle TSV process for die stacking
A few days after IBM and Micron publicized their hybrid memory cube, IBM gave their TSV paper at IEDM on the Monday afternoon (paper 7.1). Entitled "3D Copper TSV Integration, Testing and Reliability," they described a node-agnostic through-silicon via (TSV)…
IEDM 2011 Preview
Next week the researchers and practitioners of the electron device world will be gathering in Washington D.C. for the 2011 IEEE International Electron Devices Meeting. To quote the conference web front page, “IEDM is the world’s pre-eminent forum for reporting technological…
