A new evaluation board from STMicroelectronics speeds design of 3-phase AC Watt meters that meet the most stringent international quality and accuracy standards using low-cost, electromagnetic-immune shunt sensors and advanced galvanic-isolation technology for superior reliability and robustness. The EVALSTPM-3PHISO evaluation…
A Scalable Method for the Large-Area Integration of 2D Materials
Two-dimensional (2D) materials have a huge potential for providing devices with much smaller size and extended functionalities with respect to what can be achieved with today’s silicon technologies. But to exploit this potential we must be able to integrate 2D materials into semiconductor manufacturing lines – a notoriously difficult step. A team of Graphene Flagship researchers in Sweden and Germany now reports a new method to make this work.
Wafer-Scale Production of Graphene-Based Photonic Devices
Our world needs reliable telecommunications more than ever before. However, classic devices have limitations in terms of size and cost and, especially, power consumption – which is directly related to greenhouse emissions. Graphene could change this and transform the future of broadband. Now, Graphene Flagship researchers have devised a wafer-scale fabrication technology that, thanks to predetermined graphene single-crystal templates, allows for integration into silicon wafers, enabling automation and paving the way to large scale production.
CHIPS Alliance Brings on Rob Mains as New Executive Director
CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems, today announced the appointment of Rob Mains as the organization’s new executive director. Rob has over 35 years of experience in software engineering and development,…
A*STAR’s Institute of Microelectronics Partners Eight Semiconductor Companies in Chip-to-Wafer Hybrid Bonding Consortium
A*STAR’s Institute of Microelectronics (IME) has partnered leading semiconductor companies to develop Chip-to-Wafer (C2W) Hybrid Bonding for high density 2.5D and 3D integrated circuit (IC) integration. The newly formed pre-competitive C2W Hybrid Bonding Consortium with international and local industry supply chain companies will leverage IME’s expertise in 2.5D and 3D IC integration and bonding technologies for the development of C2W hybrid bonding process and demonstration of 4 chips stacking with ≤10um pitch interconnections. Refer to ANNEX A for the full list of consortium members.
UniKLasers Launch World’s First Laser to Operate with 349nm Single Frequency
UniKLasers Limited, a leading manufacturer of high precision scientific laser instrumentation, has launched its new ultra-violet (UV) laser – The Duetto 349 – a single frequency DPSS CW device which emits at 349 nanometres (nm) with a 50 mW output – making it the world’s first laser to operate with single frequency at 349 nm.
USABC Awards $732,448 Battery Technology Assessment Program Contract to Nanoramic Laboratories
The United States Advanced Battery Consortium LLC (USABC), a subsidiary of the United States Council for Automotive Research LLC (USCAR), today announced the award of a $732,448 technology assessment program contract to Nanoramic Laboratories in Boston, Massachusetts to demonstrate Nanoramic’s high energy and power density lithium-ion battery based on polymer binder-free electrode technology in electric vehicle (EV) applications.
Maskless Lithography Microfabrication for High Volume Production
New Spatial Light Modulators (SLM) allow a single light source to be parallelized into thousands or millions of smaller light beams that can be used to write simultaneously. With this new capability, machines with higher throughput can expose the entire wafer surface in a reasonable amount of time.
