Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with SK hynix
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded SK hynix up to $458 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
NexWafe Hits Key Milestones in Solar Efficiency and Scalability
NexWafe GmbH (NexWafe) today announced significant breakthroughs in its solar wafer manufacturing technology.
Micromax and Phison Partner to Launch MiPhi, Powering India’s Next-Generation of NAND Storage Technology
The joint venture will enable MiPhi to develop high-end and customized NAND storage products for enterprise, consumer, embedded, AI, and security applications for India and specific agreed-upon regions.
CreeLED Inc. Files Patent Infringement Lawsuit Against ADJ Products, LLC
Cree LED, a Penguin Solutions brand, today announced that it has filed a patent infringement lawsuit in the United States District Court for the Northern District of California against ADJ Products, LLC (ADJ).
SonicEdge Unveils World’s First MEMS Speaker-Microphone Solution for TWS Devices
SonicEdge LTD announced the launch of SonicTwin at CES 2025.
NXP to Acquire Aviva Link
NXP Semiconductors N.V. announced today that it has entered into a definitive agreement to acquire Aviva Links, a provider of Automotive SerDes Alliance (ASA) compliant in-vehicle connectivity solutions in an all-cash transaction valued at $242.5 million.
Microchip Adds MTCH2120 to its Portfolio of Turnkey Capacitive Touch Controllers
The touch controller is designed to integrate with a comprehensive ecosystem of tools to streamline development and speed time to market.
EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure
Alliance membership enables EdgeCortix to collaborate with industry leaders and accelerate the adoption of power-efficient AI-RAN integrated systems.
SignOff Semiconductors Unveils Expansion Plans Opening a New Office in Penang, Malaysia
SignOff Semiconductors Pvt. Ltd., headquartered in Bengaluru, India, and a provider of VLSI and Embedded Design services, announced the opening of its new office in Penang, Malaysia.
