Third-party-verified III-Nitride transistors, fabricated on 4-inch wafers produced at IQE, are moving towards commercial production with standard foundry processes.
Cadence and Dassault Systèmes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems
Cadence Design Systems, Inc. and Dassault Systèmes today announced at 3DEXPERIENCE World that they have extended their ongoing strategic partnership by integrating the AI-driven Cadence OrCAD X and Allegro X with Dassault Systèmes’ extended 3DEXPERIENCE Works Portfolio, for SOLIDWORKS existing and future customers.
Flex Logix Joins Intel Foundry Services Accelerator IP Alliance
Flex Logix Technologies, Inc. announced today that it has joined the Intel Foundry Services (IFS) Accelerator IP Alliance.
Global Solid State Lighting Market Size is Estimated to Reach USD 120.12 billion by 2031
The Solid-State Lighting Market size was valued at USD 44.02 billion in 2022. It is expected to reach USD 120.12 billion by 2031, growing at a CAGR of 11.80% during the forecast period (2023–2031).
SEALSQ Announces Groundbreaking Entry Into AI Chip Market With Advanced AIoT Strategy
This strategic pivot leverages the fusion of AI and IoT technologies to offer a fully integrated platform aiming to revolutionize digital transformation and innovation for its customers.
ASMC 2024 to Spotlight Advanced Semiconductor Manufacturing Innovations and Excellence
The 35th annual ASMC will feature over 30 hours of technical and poster presentations by more than 120 industry experts on the latest manufacturing strategies and methodologies.
New Adhesive Tape Picks Up and Sticks Down 2D Materials as Easily as Child’s Play
Researchers create UV-sensitive tape that can transfer 2D materials like graphene in an easier, cheaper and less-damaging way.
With More Than 24,000 Registered, SPIE Photonics West 2024 Showcased a Robust and Expanding Industry
The largest annual optics and photonics event of the year, which includes the rapidly growing Quantum West conference and the co-located SPIE AR|VR|MR, encompassed more than 1,500 exhibitors and over 5,000 technical presentations.
Infineon and Worksport Collaborate to Reduce Weight and Cost of Portable Power Stations with GaN
Infineon Technologies AG has announced a collaboration with Worksport Ltd.
SEALSQ Broadens Market Reach and Semiconductor Innovation in the United States
The US center is expected to be operational by the fourth quarter of 2024.
