QuickLogic Corporation today announced that it has been selected by a leading global semiconductor company for an eFPGA IP targeting the UMC 22nm platform.
Amkor Announces US Advanced Packaging and Test Facility
Amkor Technology, Inc., a provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona.
2D Material Reshapes 3D Electronics for AI Hardware
Researchers demonstrated monolithic 3D integration of layered 2D material into novel processing hardware for artificial intelligence computing. The new approach provides a material-level solution for fully integrating many functions into a single, small electronic chip — and paves the way for advanced AI computing.
TPL for Photonic Packaging: A Promising Solution
In a new paper published in Light Advanced Manufacturing, a team of scientists led by Dr. Shaoliang Yu and Qingyang Du have developed new packaging technologies.
Vertiv Collaborates with Intel on Liquid Cooled Solution for the Intel Gaudi3 AI Accelerator Platform
Intel’s next-generation AI accelerators will be supported by Vertiv liquid-cooled data center infrastructure solutions to help organizations accelerate AI adoption while achieving sustainability goals.
INU Researchers Develop Novel Deep Learning-Based Detection System for Autonomous Vehicles
The new system, aided by the Internet of things, improves the detection capabilities of autonomous vehicles even under unfavorable conditions.
Q3 2023 Global Semiconductor Equipment Billings Drop 11% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings contracted 11% year-over-year to US$25.6 billion in the third quarter of 2023, while quarter-over-quarter billings slipped 1% during the same period.
New Energy Collaborative Aims to Accelerate Creation of Low-Carbon Energy Access in Asia-Pacific for the Semiconductor Climate Consortium
Aiming to reduce global semiconductor ecosystem carbon emissions, SEMI and the Semiconductor Climate Consortium (SCC) have created the Energy Collaborative.
Sony Semiconductor Solutions to Release SWIR Image Sensor
Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the IMX992 short-wavelength infrared (SWIR) image sensor for industrial equipment, with the industry’s highest pixel count, at 5.32 effective megapixels.
MediaTek’s Chairman Ming-Kai Tsai Awarded Prestigious IEEE Robert N. Noyce Medal
MediaTek today announced its chairman Ming-Kai Tsai has been awarded the IEEE Robert N. Noyce Medal, one of the most prestigious awards in the electronics industry.
