The Silicon Integration Initiative Compact Model Coalition has released a new version of the Open Model Interface, an Si2 standard, C-language application programming interface that supports SPICE compact model extensions.
SEALSQ to Establish an OSAT Center in Saudi Arabia
SEALSQ Corp. today announced a significant initiative to establish an Open Semiconductors Assembly and Test (OSAT) Center in Saudi Arabia.
Greene Tweed Introduces Fusion F07 Performance-Enhanced FKM for Subfab Exhaust Lines
Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Fusion F07, a performance-enhanced fluoroelastomer.
SEMI Publishes Priorities on European Economic Security Strategy
SEMI applauded the European Commission for inviting industry feedback as it formulates the European Economic Security Strategy to strengthen Europe’s economic security in the face of ongoing geopolitical tensions and strategic dependencies that characterize the European semiconductor industry.
Nanothin Printing of Electronics Hardware Could Slash Costs
Engineering researchers have developed a 2D printing process using liquid metals that they say could create new ways of creating more advanced and energy efficient computing hardware that is manufactured at the nanoscale.
CG Power and Industrial Solutions Limited, Renesas, and Stars Microelectronics, to Jointly Build OSAT Facility in India
The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.
Airspace Expands Presence in Asia
Airspace Technologies, Inc., the California-based provider of critical logistics solutions powered by AI, announced its recent expansion into Southeast Asia.
Jon Kemp Named Chair of SEMI Board of Industry Leaders
DuPont today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI.
Edgewater Wireless Selected to Join the Alliance of Semiconductor Innovation Canada (ASIC)
Edgewater Wireless Systems Inc. announced that it has joined the Alliance of Semiconductor Innovation Canada (‘ASIC’),an organization dedicated to promoting the Canadian semiconductor ecosystem.
AI-enabled Atomic Robotic Probe to Advance Quantum Material Manufacturing
Scientists from the National University of Singapore (NUS) have pioneered a new methodology of fabricating carbon-based quantum materials at the atomic scale by integrating scanning probe microscopy techniques and deep neural networks.
