Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its popular RZ Family of microprocessors (MPUs) with a new device targeting high-performance robotics applications.
Pfeiffer Vacuum Introduces New HiCube Neo Turbo Pumping Station
With pumping speeds ranging from 80 to 800 l/s, the HiCube Neo vacuum pumping station is ideal for demanding high vacuum and ultra-high vacuum applications.
FormFactor and Tabor Electronics Collaborate on Full Stack 5-Qubit Quantum Computer
FormFactor, Inc., a semiconductor test and measurement supplier, together with Tabor Electronics LLC, today presented the Echo-5Q project, a demonstration of a full stack 5-Qubit Quantum Computer for research and education, leveraging a QPU supplied by QuantWare.
TANAKA Precious Metals Appoints Bodo Albrecht as President for the Americas
TANAKA Precious Metals announced the appointment of Bodo Albrecht as President of TANAKA Kikinzoku (America).
Shahriar Moinian of Broadcom Wins Si2 Pinnacle Award
Shahriar Moinian, distinguished engineer at Broadcom Corp., has won the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for their exceptional contributions to Si2’s success as a leading semiconductor research and development joint venture.
Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies
IPC, the global association for electronics manufacturing, praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
CHIPS for America Announces Funding Opportunity to Expand U.S. Semiconductor Packaging
Today, the U.S. Department of Commerce issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors.
Wise-integration Raises €15 Million in Series B Funding Round to Support International Growth for Its Innovative GaN Solutions
Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power supplies, today announced financing of €15 million.
Silicon Wafers Market – Growth on the Horizon 2024-2028
Wafer shipments expected to pick up in late 2024.
Keysight Introduces Leading Benchmarking Solution to Fast-Track Deployment of Artificial Intelligence Infrastructure
The solution significantly improves benchmarking of new AI infrastructures with unprecedented scale and efficiency.
