Semiconductor materials known as 2D halide perovskites can be used in devices such as solar cells and light-emitting diodes. Scientists led by Assoc Prof Nripan Mathews of NTU’s School of Materials Science and Engineering have synthesized four unique types of 2D halide perovskites.
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
The Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors.
The 2024 MRAM Global Innovation Forum Showcases the Latest Innovations, Advances, and Research Findings in MRAM Technology
The MRAM Global Innovation Forum is the industry’s premier platform that brings together leading magnetics experts, researchers, and industry professionals to share the latest advancements in Magnetoresistive Random Access Memory (MRAM) technology.
Merit America and America’s Frontier Fund Foundation Partner With Austin Community College to Help Prepare Americans for the Semiconductor Workforce
This initiative will provide individuals from low-income backgrounds nationwide access to high-quality technical training at no upfront cost, addressing workforce gaps in critical technology sectors and driving economic mobility.
ASU and Deca Technologies Selected to Lead $100M SHIELD USA Project
The National Institute of Standards and Technology — part of the U.S. Department of Commerce — announced today that it plans to award as much as $100 million to Arizona State University and Deca Technologies for the SHIELD USA initiative.
CHIPS for America Announces up to $300M in Funding to Boost U.S. Semiconductor Packaging
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Applied Materials Breakthrough To Bring OLED Displays to Tablets, PCs and TVs
Applied Materials, Inc. today introduced the MAX OLED solution, a patented OLED pixel architecture and revolutionary display manufacturing technology designed to bring the superior OLED displays found in high-end smartphones to tablets, PCs and eventually TVs.
PI’s New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
PI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
xMEMS Introduces Sycamore, a 1mm Thin Near-Field Full-Range MEMS Micro Speaker
xMEMS Labs, developers of the foremost platform for piezoMEMS innovation and creators of the world’s leading all-silicon micro speakers, today announced xMEMS Sycamore, the company’s latest breakthrough in micro fidelity (µFidelity) audio.
Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs
Renesas Electronics Corporation today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).
