After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon Technologies AG has unveiled the next milestone in semiconductor manufacturing technology.
Leading University Selects Veeco’s Molecular Beam Epitaxy System
Veeco Instruments Inc. announced today that it has received an order from the Ohio State University for its GENxcel R&D Molecular Beam Epitaxy (MBE) System.
Ultraprecise Method of Aligning 3D Semiconductor Chips Invented at UMass Amherst
The approach uses lasers and holograms and can detect misalignment as small as 0.017 nanometers.
Applied Materials and National University of Singapore Expand Semiconductor Research Lab
New phase will include larger, more advanced cleanroom, establishment of a Professorship at NUS, and new programmes for talent development.
Texas Instruments Expands Internal Manufacturing for GaN Semiconductors
Texas Instruments today announced it has begun production of gallium nitride (GaN)-based power semiconductors at its factory in Aizu, Japan.
Magnachip Expands Production of 7th Generation MXT LV MOSFETs
Magnachip Semiconductor Corporation announced today the expansion of production for its 7th generation 1)MXT LV MOSFETs, which are based on Magnachip’s Super Short Channel FET technology.
Towards Implementing Neural Networks on Edge IoT Devices
Researchers propose a novel magnetic RAM-based architecture that leverages spintronics to realize smaller, more efficient AI-capable circuits.
Critical Manufacturing Brings Highly Advanced Semiconductor MES Solution to SEMICON Europa
Critical Manufacturing is returning to SEMICON Europa 2024 to showcase its advanced Manufacturing Execution System (MES), tailored to the unique needs of the semiconductor industry.
ZEISS Launches New Crossbeam 550 Samplefab FIB-SEM
New TEM preparation platform with industry-leading automation yield.
New DUV Micro-LED Array Advances Maskless Photolithography
A team led by Prof. Sun Haiding from the University of Science and Technology of China (USTC) developed a vertically integrated micro-scale light-emitting diode (micro-LED) array, which was then applied in deep ultraviolet (DUV) maskless photolithography system for the first time.
