Texas Instruments today introduced new semiconductors designed to improve automotive safety and intelligence.
National Semiconductor and Advanced Manufacturing Technician Apprenticeship Program Launched to Support State Efforts to Develop Strategic Talent Pipelines
Today the National Institute for Innovation and Technology—the nation’s leader in the semiconductor talent pipeline development and U.S. Department of Labor (USDOL) national Intermediary responsible for establishing and expanding Registered Apprenticeships (RAs) throughout semiconductor and nanotechnology-related industry supply chains—launched the national Semiconductor and Advanced Manufacturing Technician Apprenticeship Program (SAM-TAP).
TDK Ventures Invests in Silicon Box and its Chiplet Technology
TDK Corporation announced today that subsidiary TDK Ventures, Inc. has invested in Singaporean tech disruptor Silicon Box and its innovative semiconductor chiplet packaging design and fabrication capabilities, which offers newfound standards in performance and scale.
Kopin Corporation and MICLEDI Microdisplays Announce Agreement to Collaborate on microLED Displays for Next Generation Vision Solutions
Kopin Corporation and MICLEDI Microdisplays today announced a strategic agreement to work together to design, develop, and manufacture advanced microLED displays to provide a more immersive and information-rich AR experience for use in high-brightness light conditions.
MACOM Announces Appointment of Raj Shanmugaraj to its Board of Directors
MACOM Technology Solutions Holdings, Inc., a supplier of semiconductor products, today announced the appointment of Murugesan “Raj” Shanmugaraj as an independent director to MACOM’s Board of Directors, effective January 4, 2024.
Low-Cost Microscope Projection Photolithography System for High-Resolution Fabrication
Scientists from the Leibniz University Hannover have developed a low-cost and user-friendly fabrication technique, called UV-LED-based microscope projection photolithography (MPP), for rapid high-resolution manufacturing of optical elements within seconds.
SIA Applauds Announcement of New CHIPS Incentives
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced today by the U.S. Department of Commerce and Microchip Technology.
Renowned Japanese Semiconductor Specialist Joins SEMIFIVE
SEMIFIVE, a semiconductor design partner and pioneer of platform-based custom silicon solutions, has announced the appointment of semiconductor specialist, Tatsuo Noguchi.
A KAIST Research Team Develops High-Performance Stretchable Solar Cells
A KAIST research team from the Department of Chemical and Biomolecular Engineering (CBE) led by Professor Bumjoon Kim announced the development of a new conductive polymer material that achieved both high electrical performance and elasticity while introducing the world’s highest-performing stretchable organic solar cell.
Biden-Harris Administration Announces CHIPS Preliminary Terms with Microchip Technology
The Biden-Harris Administration announced that the U.S. Department of Commerce and Microchip Technology Inc. have reached a non-binding preliminary memorandum of terms (PMT) to provide approximately $162 million in federal incentives under the CHIPS and Science Act to support the onshoring of the company’s semiconductor supply chain.
