NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, announced the delivery of the first BE Semiconductor Industries (Besi) next-generation hybrid bonding system to the NHanced advanced packaging facility in Morrisville, NC.
Nordson Corporation Announces Agreement to Acquire Atrion Corporation
Nordson Corporation today announced that it has entered into a definitive agreement to acquire Atrion Corporation.
Arrow Electronics and SiMa.ai Enter Distribution Agreement in EMEA
Global technology provider Arrow Electronics and SiMa.ai, the software centric, embedded edge machine learning system-on-chip company, have entered into a strategic collaboration, enabling Arrow to distribute SiMa.ai products in the EMEA region.
Researchers Create Materials With Unique Combo of Stiffness, Thermal Insulation
Researchers have demonstrated the ability to engineer materials that are both stiff and capable of insulating against heat. This combination of properties is extremely unusual and holds promise for a range of applications, such as the development of new thermal insulation coatings for electronic devices.
VSORA and Partners CEA-Grenoble and Valeo Named Winners of France 2030 Embedded AI Call for Projects
VSORA, an innovative startup offering high-performance AI chips for Generative AI (GenAI) and autonomous driving, and partners CEA-Grenoble and Valeo were named winners of the Embedded AI Call for Projects, part of France 2030.
Himax Announces Strategic Investment in Obsidian Sensors
Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, today announced its strategic investment in Obsidian Sensors, Inc., a San Diego-based thermal imaging sensor solution manufacturer.
Axus Technology Secures $12.5 Million in Capital Funding
Axus Technology, a provider of chemical mechanical planarization (CMP) equipment, critical for manufacturing semiconductors and compound semiconductors, today announced it has received $12.5 million in capital funding from growth capital firm IntrinSiC Investment LLC.
SEMICON Southeast Asia 2024 Opens Today
Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 opens today at MITEC in Kuala Lumpur with visionaries and experts gathered for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development.
New Survey to Access Job Skills Needs in Europe’s Microelectronics Industry
SEMI invites key industry stakeholders to participate in a survey designed to access job skills in highest demand in Europe’s microelectronics industry in 2024.
IEEE International Electron Devices Meeting (IEDM) Announces 2024 Call for Papers
Under the theme “Shaping Tomorrow’s Semiconductor Technology,” the 70th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
