Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI

United Microelectronics Corporation, a global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.

Japan Flexes Its Advantages in Semiconductor Upstream Equipment and Raw Materials, and Unveils Strategic Progress of Key Players

In the face of unceasing geopolitical upheavals in recent years, nations worldwide are striving to cultivate homegrown semiconductor supply chains and fortify the stability of their industrial supply dynamics.

Worldwide Silicon Wafer Shipments Fall in Q3 2023, SEMI Reports

Worldwide silicon wafer shipments decreased 9.6% quarter-over-quarter to 3,010 million square inches in the third quarter of 2023, a 19.5% drop from the 3,741 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

Silicon Mitus and Pico Semiconductor Partner to Develop Ultra-Small High-Frequency Silicon Capacitors

Silicon Mitus’s ultra-small silicon capacitor is the result of its collaboration with Pico Semiconductor on analog semiconductor and cell manufacturing technology.

Thermo Fisher Scientific Announces New Fault Localization Solution for the Analysis of Advanced Logic Semiconductors

Thermo Fisher Scientific has introduced the Thermo Scientific Meridian EX System— an electron-beam-based failure analysis solution designed to enable precise fault localization on advanced semiconductor logic technologies.

Renesas’ New Ultra-High Performance MCUs are Industry’s First Based on Arm Cortex-M85 Processor

This level of performance will allow system designers to use the RA MCUs in applications that previously required microprocessors (MPUs).

Synopsys Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New Synopsys Cloud OpenLink Program

Synopsys, Inc. today announced the launch of its new Synopsys Cloud OpenLink program to foster semiconductor industry interoperability through an open cloud environment.

Magnachip Commences Mass Production of Two New 650V SJ MOSFETs with a Slim Form Factor

Magnachip Semiconductor Corporation announced today that the Company has begun mass production of two new 650V Super Junction Metal-Oxide-Semiconductor Field-Effect Transistors (SJ MOSFETs) offerings.

Element Six Selected for U.S Department of Defense LADDIS Program

Element Six (E6), a CVD diamond manufacturer and part of the De Beers Group, has been selected as a performer for the LADDIS (Large Area Device-quality Diamond Substrates) program, set up by the United States Defense Advanced Research Projects Agency (DARPA). 

Jabil Invests in the Future of AI with Intel Silicon Photonics Transceiver Deal

Jabil Inc. today announced it will take over the manufacture and sale of Intel’s current Silicon Photonics-based pluggable optical transceiver (“module”) product lines and the development of future generations of such modules.