Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Purdue-Created Technology Makes 3D Microscopes Easier to Use, Less Expensive to Manufacture

3D microscopes are used in applications from the life sciences to semiconductor manufacturing. Now Purdue engineers are developing patented and patent-pending innovations making them work faster to capture even more 3D images and less expensive to manufacture.

Rogue Valley Microdevices’ Unveils 300mm MEMS Capability at its Upcoming Palm Bay, Florida Facility

CEO Jessica Gomez presents this week at the MEMS & Sensors Technical Congress.

Morse Micro Expands Presence in Taiwan with New Office

Morse Micro today announced the official opening of its new Taiwan branch. 

Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024, SEMI Reports

Worldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024.

2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies

The world’s leading forum for unveiling, discussing and exhibiting the latest advancements in microelectronics packaging and component science and technology is the IEEE Electronic Components and Technology Conference (ECTC).

Women MAKE Awards Recognizes GlobalFoundries’ Jennifer Robbins and Katelyn Harrison for Manufacturing Excellence

Last week, the Manufacturing Institute (MI)—the workforce development and education affiliate of the National Association of Manufacturers—honored two outstanding women from GlobalFoundries at their annual Women MAKE Awards

TSMC Certifies Ansys Multiphysics Platforms

Ansys today announced the certification of its power integrity platforms for TSMC’s N2 technology full production release.

StratEdge Takes High-Frequency Packaging Technology to New Heights at Upcoming Events

StratEdge Corporation is set to showcase its latest packaging technology for high-frequency applications at several industry conferences in May.

Great Strides in the Development of High Refractive Index Polymers for Optoelectronics

Researchers report a novel family of low-cost, sustainable polymers that could be useful for modern displays, photodetectors, and lighting devices.

Nordson Electronics Solutions Receives EM China Innovation Award

Nordson Electronics Solutions received the conformal coating equipment award from EM Asia China for the new ASYMTEK Select Coat SL-1040 conformal coating system, at an award ceremony during Productronica China, held March 21 in the Shanghai New International Expo Centre, Shanghai, China.