Chief Executive magazine today announced that Dr. Lisa Su, CEO of AMD, has been named 2024 Chief Executive of the Year by her peer CEOs.
Gstar Announces Groundbreaking of Silicon Wafer Factory Construction in Indonesia
Recently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
Celestial AI Announces Appointment of Diane Bryant to Board of Directors
Celestial AI, creator of the Photonic Fabric optical interconnect technology platform, today announced the appointment of Diane Bryant to the Company’s Board of Directors effective April 11, 2024.
Guerrilla RF Completes Strategic Acquisition of GaN Device Portfolio from Gallium Semiconductor
Guerrilla RF, Inc. has finalized the acquisition of Gallium Semiconductor’s entire portfolio of GaN power amplifiers and front-end modules.
Design Strategies Toward Plasmon-Enhanced 2-Dimensional Material Photodetectors
A research group from Southeast University provided a detailed overview of plasmon-enhanced 2D material photodetectors, mainly focusing on the clarification of different hybridization modes between plasmonic nanostructures and 2D materials.
Revolutionizing Memory Technology: Multiferroic Nanodots for Low-Power Magnetic Storage
In a significant milestone for multiferroic memory devices, a team of researchers led by Professor Masaki Azuma and Assistant Professor Kei Shigematsu from Tokyo Institute of Technology in Japan has successfully developed nanodots with single ferroelectric and ferromagnetic domains.
IBM, Government of Canada, Government of Quebec Sign Agreements to Strengthen Canada’s Semiconductor Industry
The agreements reflect a combined investment valued at approximately $187M CAD.
Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
SEMI Applauds U.S. CHIPS Act Award for Micron Technology
“SEMI commends the U.S. Department of Commerce for this key step to strengthen the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas.
Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
Synopsys, Inc. today announced broad EDA and IP collaborations with TSMC for advanced node designs and have been deployed across a range of AI, high-performance computing, and mobile designs.
