Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

DHL Industrial Project Appoints New Global Sector Head Semiconductor Fabrications

DHL Industrial Projects, a unit of DHL Global Forwarding that manages complex project logistics, deep sea chartering activity and heavy-lift cargo, has appointed industry veteran John Lu as Global Sector Head Semiconductor Fabrications.

SemiQon and CMC Microsystems Announce Collaboration

Fully tested silicon-based chips are now shipping to partners for scalable and manufacturable quantum computer projects in the UK, United States, Finland, and Germany.

Quartz, Ceramic, and Silicon Equipment Components

Semiconductor fab expansion met with pause before strong rise in 2025.

AI Semiconductors Data, New Service by Liftr Insights

Liftr data introduces a new data service for market intelligence about AI Training and AI Inference semiconductors.

DISCOVER-US Initiates New Era in EU-US Edge AI Research

Launched on 1 January 2024, the Horizon Europe DISCOVER-US project is a 30-month project set to energize EU-US collaborative research around the computing continuum, distributed computing, and swarm intelligence.

Fraunhofer IPMS and NY CREATES Strengthen Cooperation

The research institutes Fraunhofer IPMS and NY CREATES provide the framework for international understanding and collaboration.

Applied Materials Announces Supplier Excellence Awards

Applied Materials, Inc. today announced the recipients of Supplier Excellence Awards for contributions made to Applied’s business over the past year

Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging

Tape out confirms most efficient and flexible UCIe-, BoW-, and UMI-compatible multi-die solution for standard or advanced packaging implementations.

SEMI and UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States

SEMI today announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain.

Solvay Advances STEM Education with MIT and Fermi High School Through Scholarship Initiative

The scholarship award ceremony included a tour of Rosignano’s factory, showcasing Solvay’s commitment to safety and sustainability, bridging academia with industry challenges.