Synopsys, Inc. today announced that it has completed the acquisition of Intrinsic ID.
Three Strong Brands Form the Global Busch Group
Busch Vacuum Solutions, Pfeiffer Vacuum and centrotherm clean solutions have become one under the new Busch Group.
Biden-Harris Administration Awards $8.5B in CHIPS Act Funds to Intel
The U.S. Department of Commerce and Intel Corporation have reached a non-binding preliminary memorandum of terms (PMT) to provide up to $8.5 billion in direct funding under the CHIPS and Science Act to strengthen the U.S. supply chain and re-establish American leadership in semiconductor manufacturing.
STMicroelectronics Breaks the 20nm Barrier for Cost-Competitive Next-Gen Microcontrollers
STMicroelectronics announces an advanced process based on 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology with embedded phase change memory (ePCM) to support next-generation embedded processing devices.
Abundant Nexus Conference Announces Final Program
The organizing committee of the conference event, Abundant Nexus: The Convergence of MEMS Technology, Entrepreneurism & Abundance, has today announced its final program.
Synopsys Showcases EDA Performance and Next-Gen Capabilities with NVIDIA Accelerated Computing, Generative AI and Omniverse
Building on more than three decades of collaboration, Synopsys, Inc. today announced it is working with NVIDIA to substantially accelerate chip design and advance automotive prototyping using the power of AI and accelerated computing.
ASU and Deca Technologies to Launch R&D Center for Advanced Fan-Out Wafer-Level Packaging
Advanced packaging advances next wave of innovation in global chips manufacturing.
TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
NVIDIA today announced that TSMC and Synopsys are going into production with NVIDIA’s computational lithography platform to accelerate manufacturing and push the limits of physics for the next generation of advanced semiconductor chips.
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC, the global association for electronics manufacturing, as its chief strategist for advanced packaging.
UMass Amherst Researchers Join $26M Quantum Computing Effort to Build Internet of the Future
UMass is leading the core effort to design architectures and protocols for quantum networking for the National Science Foundation’s Center for Quantum Networks.
