Nordson Electronics Solutions announced that their Nordson B.V. division, which covers Europe, the Middle East, and Africa, has consolidated its offices into one site in Valkenswaard, The Netherlands, in early July.
Nearfield Instruments Secures Purchase Order for its QUADRA Metrology System from Leading Semiconductor Manufacturing Fab in Asia
Nearfield Instruments, provider of metrology and process control equipment for advanced semiconductor fabrication plants, today announced the receipt of a purchase order for its QUADRA metrology systems from a major semiconductor manufacturing fab in Asia.
Micron Announces Volume Production of Ninth-Generation NAND Flash Technology
Micron Technology, Inc. announced today that it is shipping ninth-generation (G9) TLC NAND in SSDs, making it the first in the industry to achieve this milestone.
‘Kink State’ Control May Provide Pathway to Quantum Electronics
Researchers develop a robust quantum highway with switch to control electron movement.
SEMI Europe Announces Educational Leaders Board
The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the formation of the Educational Leaders Board to help bridge the talent gap in Europe’s microelectronics sector.
NUS Researchers Develop a Novel Technique to Fabricate Three-Dimensional Circuits for Advanced Electronics
CHARM3D paves the way for the efficient printing of free-standing 3D structures that offer high electrical conductivity, self-healing capabilities and recyclability — a boon for electronics in healthcare, communications and security.
3D-Micromac Receives Laser-Trimming-System Order from Infineon for New Dresden Smart Power Fab
3D-Micromac AG equips Infineon Technologies Dresden GmbH & Co. KG with production equipment for laser trimming.
Researchers Develop Device to Make Artificial Intelligence More Energy Efficient
Energy consumption from artificial intelligence could be reduced by a factor of at least 1,000 with this device.
AMI Joins NXP Semiconductors Partner Program
AMI announced that it has formally joined the NXP Semiconductors Partner Program.
Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility
Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced today it has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act.
