Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Renesas Collaborates with Intel on Power Management Solution for New Intel Core Ultra 200V Series Processors

Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel Core Ultra 200V series.

US CHIPS Act Set to Reshape Helium Demand in the US

Two years after signing the US Chips Act into law for onshore chip manufacturing, over US$30 billion of the total US$39 billion in direct incentives have been awarded to date.

Tech and Talent to Supercharge the Semiconductor Industry

New CHIPS and Science Act funding supports Arizona State University efforts to create an ultra-energy-efficient chip and fill microelectronics workforce shortages.

Sunlit Chemical Expands Global Reach with U.S. Facility Opening in Phoenix

The new plant, strategically located in Phoenix, Ariz., will provide critical materials to support the U.S. semiconductor industry.

Top MRAM Maker Selects ClassOne Solstice S8 Single-Wafer System for High-Volume Manufacture of Non-Volatile MRAM Devices

The customer selected the Solstice system for its ability to deliver repeatable wet processing essential to meeting high-volume manufacturing (HVM) requirements.

DELO Introduces UV-Approach for Fan-Out Wafer-Level Packaging

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP).

EV Group Announces Management Board Expansion In Light Of Unabated Growth

EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced the expansion of its management board.

The Busch Group Drives Sustainable Future Technologies

October 24 is International Day of Climate Action, which aims to raise awareness of climate change and to highlight the importance of environmental protection.

Fractile Licenses Andes Technology’s RISC-V Vector Processor

Andes Technology, a supplier of high-efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, announced a partnership with Fractile, the company building the chips and systems needed to reach the next frontier of AI performance.

Broadcom President & CEO Hock Tan to Receive Global Semiconductor Alliance’s Highest Honor

Global Semiconductor Alliance (GSA) announced it will honor Hock Tan, President and CEO of Broadcom, with its prestigious Dr. Morris Chang Exemplary Leadership Award at this year’s Annual Awards Celebration on Dec. 5, 2024.