The IEEE Electronic Components and Technology Conference (ECTC), the world’s premier technical conference and product exhibition for the semiconductor packaging industry, has announced the winners of its prestigious Best and Outstanding Paper Awards for 2024.
Advanced Semiconductor Packaging Market to Generate US$ 40.3 Billion in Revenue by 2031
The Advanced Semiconductor Packaging Market, valued at US$ 30.1 Bn in 2022, is poised for steady expansion.
Ruth Hernandez Appointed as Chief Sales Officer at Soitec
Soitec announces the appointment of Ruth Hernandez as Chief Sales Officer. She will join the Executive Committee with responsibility for driving Soitec’s commercial success.
Development of a High-Performance AI Device Utilizing Ion-Controlled Spin Wave Interference in Magnetic Materials
A research team from NIMS and the Japan Fine Ceramics Center (JFCC) has developed a next-generation AI device—a hardware component for AI systems—that incorporates an iono-magnonic reservoir.
Micross Acquires Integra Technologies
Micross Components, Inc., a provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today closed the acquisition of Integra Technologies.
GF Piping Systems and Gradiant Partner Up to Drive Innovation for Sustainable Water Treatment
The collaboration aims to address the growing demands of the microelectronics and water industry, where precision, sustainability, and innovation are critical to success.
U.S. Department of Commerce Announces CHIPS Incentives Awards with Corning, Edwards Vacuum, and Infinera
Today, the U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Infinera’s Expansion Enhances Lehigh Valley’s Legacy of Technological Innovation
Infinera announced up to $93 million in federal funding to expand operations, including in the Lehigh Valley.
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
First of-its-kind center will offer advanced packaging and test capabilities in New York for U.S.-made essential chips used in AI, automotive, aerospace and defense, and other applications.
Department of Commerce Finalizes Long-Term Partnership with Natcast to Operate the National Semiconductor Technology Center
CHIPS for America award will support critical research and development to drive U.S. leadership in semiconductor innovation, economic growth, and national security.
