Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Weebit Nano to Demo its ReRAM Technology on GlobalFoundries’ 22FDX Platform

Weebit Nano Limited will showcase a live demo of Resistive Random-Access Memory (ReRAM) technology implemented in GlobalFoundries’ 22FDX platform.

Eurex Launches Futures Contract on Semiconductor Industry

Eurex, Europe’s leading derivatives exchange, is expanding its suite of sector index futures.

HiPace 30 Neo: Smallest Hybrid-Bearing High-Power Turbopump on the Market

The new HiPace 30 Neo turbopump from Pfeiffer Vacuum is a vacuum pump for compact analysis systems and portable applications.

Semiconductor Assembly and Test Facility Database Now Tracks OSAT and Integrated Device Manufacturers in 670 Facilities

New edition of SEMI’s database tracks 33% more facilities and highlights advanced packaging and factory certifications.

MPI Corporation’s Advanced Semiconductor Test Division Joins Forces with Keysight Technologies

MPI Corporation announced a landmark partnership with Keysight Technologies, a global innovation partner delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster.

Archer Miniaturizes Biochip gFET Chip Design

Archer Materials Limited, a semiconductor company advancing the quantum computing and medical diagnostics industries, has designed a miniaturized version of its Biochip graphene field effect transistor chip for fabrication at a commercial foundry.

SEALSQ Launches SEALBOX

SEALSQ Corp today announced the launch of SEALBOX, its innovative solution for IoT device provisioning at the manufacturing level.

Hitachi High-Tech Launches High-sensitivity and High-throughput Wafer Surface Inspection System

LA9300AD enables detection of shallow microscopic defects, contributing to reduced manufacturing costs and improved yield.

Toray Develops Hybrid Bonding Resin for Enhancing Yield and Reliability in Semiconductor Packaging

Toray Industries, Inc., announced today that it has developed an insulating resin material for hybrid bonding (micro bonding).

New Study Shows Analog Computing Can Solve Complex Equations and Use Far Less Energy

UMass Amherst research demonstrates that a memristor device can solve complex scientific problems using significantly less energy, overcoming one of the major hurdles of digital computing.