Governor Kathy Hochul today announced a $10 billion partnership with leaders from the semiconductor industry such as IBM, Micron, Applied Materials, Tokyo Electron, and others to establish a next-generation semiconductor research and development center at NY CREATES’ Albany NanoTech Complex.
Biden-Harris Administration and BAE Systems, Inc. Announce CHIPS Preliminary Terms to Support Critical U.S. National Security Project in Nashua, New Hampshire
The Department’s PMT with BAE Systems, Inc., marks the beginning of the next phase of implementation of the CHIPS and Science Act, a key part of President Biden’s Investing in America agenda.
Ansys RaptorX Certified by Samsung Foundry for High-Speed Design
Samsung Foundry certified Ansys RaptorX on-chip electromagnetic (EM) solution for analyzing high-speed products manufactured with Samsung’s 8nm (nanometer) LN08LPP Low Power Plus silicon process.
SEMI Launches Leadership Accelerator to Cultivate Future-Ready Microelectronics Industry Leaders
SEMI today announced the SEMI Leadership Accelerator to foster industry growth by assisting organizations in cultivating the next generation of leaders.
Hitachi High-Tech Launches Dark Field Wafer Defect Inspection System
Hitachi High-Tech Corporation announced today the launch of the Hitachi Dark Field Wafer Defect Inspection System DI4600 – a new tool for inspecting particles and defects on patterned wafer in semiconductor production lines.
ROHM Now Offers the Industry’s Largest Library of LTspice Models by Adding SiC Power Devices and IGBTs
ROHM Semiconductor today announced an expansion to their SPICE model lineup for the LTspice circuit simulator.
Semiconductor Materials Market – Better Things to Come in 2024
Despite downturn in 2023, material demand and market growth are on the rise.
Global Semiconductor Alliance Announces Winners of 2023 GSA Awards
Last night, the Global Semiconductor Alliance (GSA) celebrated the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala. Join us in congratulating this year’s recipients.
Polaritons Open Up a New Lane on the Semiconductor Highway
On the highway of heat transfer, thermal energy is moved by way of quantum particles called phonons. But at the nanoscale of today’s most cutting-edge semiconductors, those phonons don’t remove enough heat. That’s why Purdue University researchers are focused on opening a new nanoscale lane on the heat transfer highway by using hybrid quasiparticles called “polaritons.”
Thermal Impact of 3D Stacking Photonic and Electronic Chips
Researchers investigate how the thermal penalty of 3D integration can be minimized.
