Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Brainstorming With a Bot

CFN’s Kevin Yager develops a chatbot with an expertise in nanomaterials.

Photonic Chip That ‘Fits Together like Lego’ Opens Door to Semiconductor Industry

Integrating photons into electronic chips expands bandwidth and filter control.

Mycronic Receives Order for an SLX Mask Writer

Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 5-7 million. Delivery of the system is planned for the second quarter of 2024.

Applied Materials Receives SBTi Validation of its Science-based Scope 1, 2 and 3 Emissions Reductions Targets

The validation marks a significant step towards Applied’s Net Zero 2040 Playbook – a collaborative approach to reducing the semiconductor industry’s carbon emissions.

QuickLogic Secures New eFPGA IP Contract on UMC’s 22nm Process

QuickLogic Corporation today announced that it has been selected by a leading global semiconductor company for an eFPGA IP targeting the UMC 22nm platform.

Amkor Announces US Advanced Packaging and Test Facility

Amkor Technology, Inc., a provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona.

2D Material Reshapes 3D Electronics for AI Hardware

Researchers demonstrated monolithic 3D integration of layered 2D material into novel processing hardware for artificial intelligence computing. The new approach provides a material-level solution for fully integrating many functions into a single, small electronic chip — and paves the way for advanced AI computing.

TPL for Photonic Packaging: A Promising Solution

In a new paper published in Light Advanced Manufacturing, a team of scientists led by Dr. Shaoliang Yu and Qingyang Du have developed new packaging technologies.

Vertiv Collaborates with Intel on Liquid Cooled Solution for the Intel Gaudi3 AI Accelerator Platform

Intel’s next-generation AI accelerators will be supported by Vertiv liquid-cooled data center infrastructure solutions to help organizations accelerate AI adoption while achieving sustainability goals.

INU Researchers Develop Novel Deep Learning-Based Detection System for Autonomous Vehicles

The new system, aided by the Internet of things, improves the detection capabilities of autonomous vehicles even under unfavorable conditions.