Global semiconductor equipment billings contracted 11% year-over-year to US$25.6 billion in the third quarter of 2023, while quarter-over-quarter billings slipped 1% during the same period.
New Energy Collaborative Aims to Accelerate Creation of Low-Carbon Energy Access in Asia-Pacific for the Semiconductor Climate Consortium
Aiming to reduce global semiconductor ecosystem carbon emissions, SEMI and the Semiconductor Climate Consortium (SCC) have created the Energy Collaborative.
Sony Semiconductor Solutions to Release SWIR Image Sensor
Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the IMX992 short-wavelength infrared (SWIR) image sensor for industrial equipment, with the industry’s highest pixel count, at 5.32 effective megapixels.
MediaTek’s Chairman Ming-Kai Tsai Awarded Prestigious IEEE Robert N. Noyce Medal
MediaTek today announced its chairman Ming-Kai Tsai has been awarded the IEEE Robert N. Noyce Medal, one of the most prestigious awards in the electronics industry.
The Chip That Makes Calculations With Light
The devices developed in this research are small silicon chips that serve as smart transceivers: working in pairs, they can automatically and independently ‘calculate’ what shape a beam of light needs to be in order to pass through a generic environment with maximum efficiency.
Festo Announces the Launch of Electeo: A New Web-Based Electronics Training System
Electeo, a new learning solution from Festo, will be unveiled at ACTE CareerTech VISION in Phoenix, Arizona on November 29, 2023.
SmartKem Appoints Melisa A. Denis to the Board of Directors
SmartKem, Inc. today announced the appointment of Melisa A. Denis to the SmartKem Board of Directors, effective November 21, 2023.
CoreFlow Ltd. Introduces GripJet
CoreFlow Ltd. unveiled its GripJet vacuum chuck, a revolutionary solution for advanced wafer-level packaging (AWLP) and other processes.
Untether AI Joins UCIe Consortium to Drive Chiplet Technology and Energy-Centric AI Acceleration
Untether AI today announced that it has joined Universal Chiplet Interconnect Express (UCIe) Consortium, the industry organization that has developed an open specification that defines the interconnect between chiplets within a package.
Researchers Advance ‘Placenta-On-a-Chip’ With Sensing, Imaging Technology
A research poster dated Dec. 9, 2015, hangs just outside Nicole Hashemi’s Iowa State University laboratory. It introduces a major project for Hashemi and her research group. And it’s evidence that scientific persistence sometimes equals scientific advancement.
