FPT Semiconductor, a subsidiary of FPT Corporation (FPT), today announced its partnership with Silvaco, US-based leading provider of TCAD, EDA software, and Design IP, aiming at fostering workforce and business growth in the semiconductor sector.
Samco Plasma Etching System RIE-10NR Updates University of Illinois Urbana-Champaign’s Material Research Lab
Samco reveals plans to install plasma etching system RIE-10NR early 2024 as the newest update to the Materials Research Lab (MRL) at the University of Illinois Urbana-Champaign (UIUC).
Linx Consulting to Host Conference and Workshop this November
The Electronic Specialty Gases & Systems Conference 2023 will be held November 14 to 16, 2023 at Gila River Resorts in Chandler, AZ.
Wearable Optical Device Shows Promise for Detecting Postpartum Hemorrhage
Researchers use laser speckle imaging to provide early warning for a common cause of maternal mortality.
NXP Honored with Prestigious Automotive Awards
NXP Semiconductors N.V. announced that it has been honored by three automotive partners.
Purdue Center Addresses Pressing Challenge of Securing Semiconductor Chips
Purdue University’s emergence as a leader in semiconductor chips also requires it to usher in a new level of security that protects those essential chips needed for everything from your car and cellphone to artificial intelligence and machine learning.
MITRE Responds to CHIPS Act Awards for Eight Regional Innovation Hubs
Yesterday, the Department of Defense (DoD) announced the first set of awards under the CHIPS Act totaling nearly $240 million to build eight regional innovation hubs through its Microelectronics Commons initiative.
Deputy Secretary of Defense Kathleen Hicks Announces $238M CHIPS and Science Act Award
Deputy Secretary of Defense Kathleen Hicks announced the award today of $238 million in “Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act” funding for the establishment of eight Microelectronics Commons (Commons) regional innovation hubs.
ITRI Leads Global Semiconductor Collaboration for Heterogeneous Integration to Pioneer Pilot Production Solutions
The introduction of Generative AI (GAI) has significantly increased the demand for advanced semiconductor chips, drawing increased attention to the development of complex calculations for large-scale AI models and high-speed transmission interfaces.
Cadence to Acquire Intrinsix Corporation from CEVA
Cadence Design Systems, Inc. and CEVA, Inc., a licensor of wireless connectivity and smart sensing technologies, today announced that they have entered into a definitive agreement for Cadence to acquire Intrinsix Corporation, a wholly owned subsidiary of CEVA and a provider of design engineering solutions focused on the U.S. aerospace and defense industry.
