Today, TetraMem Inc & SK hynix Inc announced that they have signed an SOW outlining their partnership on a joint research project to advance the promise of in-memory computing (IMC) for AI applications.
JEDEC Announces Enhanced NAND Flash Interface Standard With Increased Speeds and Efficiency
JEDEC Solid State Technology Association today announced the publication of JESD230G: NAND Flash Interface Interoperability Standard.
NVIDIA Accelerates Google Quantum AI Processor Design With Simulation of Quantum Device Physics
NVIDIA today announced it is working with Google Quantum AI to accelerate the design of its next-generation quantum computing devices using simulations powered by the NVIDIA CUDA-Q platform.
FormFactor Receives SK hynix Best Partner Award
FormFactor, Inc., a supplier of electrical test and measurement solutions for the semiconductor industry, announced today that it has been recognized as an outstanding partner by SK hynix, a global leader in DRAM and Flash memory manufacturing.
TechSearch International Analyzes Hybrid Bonding Developments and Panel Market Growth
In its latest Advanced Packaging Update, TechSearch International provides an update on developments in hybrid bonding including applications, technical challenges, and proposed solutions. The report focuses on hybrid bonding for high-performance applications.
AlixLabs Awarded 345,000€ Swedish Innovation Agency Grant
Funds awarded from Swedish innovation agency’s “Acceleration of deep tech companies 2024” call.
SEMI Europe Recognizes Schneider Electric as a Leader in Diversity and Inclusion at SEMICON Europa 2024
SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion announced Schneider Electric as the recipient of the 2023 SEMI Industry Leader in Diversity and Inclusion Award.
xMEMS Active Micro-Cooling “Fan on a Chip” Named as CES Innovation Awards 2025 Honoree
The recently announced xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling air pump for small, thin electronics devices and next-generation artificial intelligence (AI) solutions, has been named a CES Innovation Awards 2025 Honoree in the best in computer hardware and components category.
TANAKA Successfully Develops the World’s First Manufacturing Technology for Platinum Materials with Nano-Sized Crystal Grains
TANAKA Kikinzoku Kogyo K.K., which develops industrial precious metal products as one of the core companies of TANAKA Precious Metals, announced that it has succeeded in developing the world’s first bulk platinum with controlled crystal grain size in the nano scale.
NVIDIA’s AI-Driven Triumph Over Intel Powered by Strategic Innovations, GlobalData Reveals
In a historic shift, NVIDIA has taken Intel’s coveted spot on the Dow Jones Industrial Average.
