Shannon Davis

News and Web Editor

6712 Articles0 Comments

Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Continental and Ethernovia Announce Partnership to Develop Automotive Switch in 7nm

Today, Continental and Ethernovia, Inc. announced a development partnership to create a high-bandwidth, low-latency switch in an automotive-qualified 7nm process to efficiently and securely move data within software-defined vehicles (SDVs).

Keysight Launches Next-Generation Vector Signal Generator for Dense Wideband Multichannel Applications

Keysight Technologies, Inc. introduces a new compact, four-channel vector signal generator (VSG) capable of signal generation up to 8.5 GHz with 960 MHz of modulation bandwidth per channel.

GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs

The new facility, which broke ground in 2021, will bolster GF’s global manufacturing footprint across Singapore, the U.S., and Europe to provide customers with capacity to enhance supply chain flexibility and business resilience.

Major U.S. 300mm Chip Manufacturer Places Repeat Order for EAGLEi 300 FOUP Inspection Technology

SHELLBACK Semiconductor Technology announced today a follow-on EAGLEi 300 FOUP Inspection System order from a global 300mm chip manufacturer.

SkyWater Appoints John Sakamoto as President and Chief Operating Officer

Company prepares for strategic growth in the face of unprecedented opportunities for the U.S. semiconductor industry.

New Metamaterial-Based Strategy to Combine and Transmit Multiple Light Modes

Innovative technique achieves unprecedented data transfer rates with on-chip optical communication.

Advancing Cu-Cu Hybrid Bonding: Overcoming Challenges for the Future of Semiconductor Packaging

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional flip-chip soldering.

Micron Selects Nutanix Cloud Platform for Its Manufacturing Facilities Globally

Nutanix today announced that Micron Technology, an industry leader in innovative memory and storage solutions, selected Nutanix to build a cloud platform for Micron’s manufacturing facilities globally.

Empire State Development Announces Application Window is Now Open for Luminate NY Accelerator and Business Competition

Empire State Development (ESD) today announced that Luminate NY—the world’s largest business accelerator for startup companies that have optics, photonics, and imaging (OPI) enabled technologies—is now accepting applications for its seventh cohort.

A Brightly (Multi)colored Future for Electrochromic Devices Shines Ahead

Vivid displays, enriched color variations and boosted stability are something everyone can look forward to encountering as advances are made in the electrochromic device (ECD) field.