Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Semiconductor Materials Market – Better Things to Come in 2024

Despite downturn in 2023, material demand and market growth are on the rise.

Global Semiconductor Alliance Announces Winners of 2023 GSA Awards

Last night, the Global Semiconductor Alliance (GSA) celebrated the achievements of remarkable individuals and exceptional semiconductor companies at its annual GSA Awards Ceremony gala. Join us in congratulating this year’s recipients.

Polaritons Open Up a New Lane on the Semiconductor Highway

On the highway of heat transfer, thermal energy is moved by way of quantum particles called phonons. But at the nanoscale of today’s most cutting-edge semiconductors, those phonons don’t remove enough heat. That’s why Purdue University researchers are focused on opening a new nanoscale lane on the heat transfer highway by using hybrid quasiparticles called “polaritons.”

Thermal Impact of 3D Stacking Photonic and Electronic Chips

Researchers investigate how the thermal penalty of 3D integration can be minimized.

Advantest Targets NAND Flash/NVM Market with New Group of Memory Test Products

Semiconductor test equipment supplier Advantest Corporation today announced three new additions to its suite of memory test products

Omdia Research Finds Public Display Market Grew 13.8% YoY in 3Q23

The public display market saw a 13.8% growth year-over-year (YoY) backed by increased shipments across multiple regions, particularly for Interactive Flat Panel (IFP)/touch displays in China in 3Q23.

EV Group Brings Revolutionary Layer Transfer Technology to High-Volume Manufacturing With EVG850 NanoCleave System

Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and transistor scaling.

CEA-Leti Paper in Nature Communications Reports First Complete Memristor-Based Bayesian Neural Network Implementation For Real-World Task

Breakthrough classifies types of arrhythmia recordings with precise aleatoric and epistemic uncertainty.

NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data for Ground-Breaking 3D X-DRAM

NEO Semiconductor, a developer of technologies for 3D NAND flash and DRAM memory, today announced findings of 3D X-DRAM simulations.

VMS SOLUTIONS Introduces MOZART Fab WISE: Transforming Simulation in Semiconductor and Display Manufacturing

VMS SOLUTIONS introduces its latest simulation software, MOZART Fab WISE, tailor-made for the semiconductor and display manufacturing sectors.