Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation, a subsidiary of TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

Pure Wafer Acquired by Private Equity Group, ZMC

With the acquisition by ZMC, Pure Wafer will undertake a new growth phase with substantial investments in fab capacity expansion across its U.S. wafer fab operations.

Pivotal Systems Opens New Manufacturing Facility in Malaysia to Meet Growing Demand for Gas Flow Solutions

Pivotal Systems Corporation has officially announced the opening of a new high volume manufacturing facility in Malaysia.

SilTest Semiconductors and yieldWerx Announce Strategic Partnership to Elevate Semiconductor Yield Optimization in Europe

SilTest Semiconductors GmbH, a European player in semiconductor product development and testing services, announced a strategic partnership with yieldWerx, a global provider of advanced semiconductor yield management software.

Lightmatter and ASE Partner to Bring 3D Photonics to Market

Lightmatter today announced a strategic collaboration with Advanced Semiconductor Engineering, Inc., the world’s largest semiconductor packaging and testing services provider.

Professors from Georgia Tech and University of Michigan To Be Honored for Excellence in Semiconductor Research

The Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC) today announced the recipients of the 2024 University Research Awards.

Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package

Lightmatter today announced a strategic partnership with Amkor Technology, Inc., a provider of semiconductor packaging and test services, to create the largest-ever 3D-packaged chip complex utilizing Lightmatter’s innovative Passage platform.

Microchip to Accelerate Real-time Edge AI with NVIDIA Holoscan

To enable developers building artificial intelligence (AI)-driven sensor processing systems, Microchip Technology has released its PolarFire FPGA Ethernet Sensor Bridge that works with the NVIDIA Holoscan sensor processing platform.

RED Semiconductor Chosen for Silicon Catalyst Semiconductor Incubator

RED Semiconductor, a UK based startup innovating processors for AI and cryptography at the edge, has won a place to join the semiconductor industry’s highly acclaimed Silicon Catalyst Incubator program.

Wise-integration Expands in North America With Ottawa Design Center

Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power conversion, today announced the opening of its North American Design & Development Center in Ottawa, Ontario, Canada.