Kioxia Corporation today announced that the company’s research papers have been accepted for presentation at IEEE International Electron Devices Meeting (IEDM) 2024, a prestigious international conference to be held in San Francisco, USA, from December 7th to 11th.
Global Silicon Wafer Shipments to Remain Soft in 2024 Before Strong Expected Rebound in 2025, SEMI Reports
Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delyated until 2025 to reach 13,328 MSI as wafer demand continues to recover from the downcycle, SEMI reported today in its annual silicon shipment forecast.
Process Materials Lead the Way in 2024 with 7% CAGR through 2028 Amid Global Challenges
Following a 12% year-over-year decline in 2023 driven by a sluggish industry and inventory correction, revenues for total materials in 2024 is expected to see 3-4% growth as conditions improve.
Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
Arteris, Inc. today announced an innovative evolution of its network-on-chip (NoC) IP products with tiling capabilities and extended mesh topology support for faster development of Artificial Intelligence (AI) and Machine Learning (ML) compute in system-on-chip (SoC) designs.
POET Wins “Best in Artificial Intelligence” Honors at 2024 Global Tech Awards
The honor is the third top prize the Company has received in 2024, following recognition by the AI Breakthrough Awards for “Best Optical AI Solution” and the Gold Prize for “AI Innovator of the Year” from the Merit Awards.
SEALSQ and Allion Japan Inc. Partner to Help IoT Device Manufacturers Build Secure, Standard-Compliant Products
The partnership aims to assist IoT device manufacturers in creating secure and standard-compliant products, meeting key protocols such as Matter, and complying with new international IoT security regulations like the EU Cyber Resilience Act (CRA) and the US Cyber Trust Mark.
IDTechEx Report Highlights the Rise of Chiplet Technology in Semiconductors
The report highlights how chiplets offer a promising path forward, providing flexibility, modularity, customizability, efficiency, and cost-effectiveness in chip design and manufacturing.
CEA-Leti Launches OpenTRNG
CEA-Leti today announced an open-source project to produce physical True Random Number Generators (TRNG) using ring-oscillator-based architectures.
Samsung Develops Industry’s First 24Gb GDDR7 DRAM for Next-Generation AI Computing
Samsung Electronics Co., Ltd. today announced it has developed the industry’s first 24-gigabit (Gb) GDDR7 DRAM.
Microchip’s RTG4 FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification
QML Class V designation recognizes exceptional reliability and longevity for critical space missions.
