ventureLAB’s President and CEO, Hugh Chow, welcomed Denis Gaudreault, Country Manager at Intel Canada, global leader in design and manufacturing of essential technologies in the smart world, to its space.
Micron Low-Power Memory Solution Boosts Mixed and Virtual Reality Experiences on Snapdragon XR2 Gen 2
Micron Technology, Inc. announced today that its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1 embedded solutions are now qualified on Qualcomm Technologies’ latest extended reality (XR) platform, Snapdragon XR2 Gen 2 Platform.
Omdia: Amid the Struggling Market Conditions, Low-Priced Notebook Display Demand Stays Firm
New research from Omdia’s Notebook and tablet display & OEM Intelligence Service has found that global notebook PC panel shipment is estimated to reach 188.5 million units in 2023 and down by 13% YoY, having declined for two consecutive years since 2021.
Micron Low-Power Memory Solution Boosts Mixed and Virtual Reality Experiences on Snapdragon XR2 Gen 2
Micron Technology, Inc. announced today that its low-power double data rate 5X (LPDDR5X) DRAM and Universal Flash Storage (UFS) 3.1 embedded solutions are now qualified on Qualcomm Technologies’ latest extended reality (XR) platform, Snapdragon XR2 Gen 2 Platform.
ROHM’s New Five-Model Lineup of Low ON-Resistance 100V Dual MOSFETs
Lower power consumption and smaller size of fan motors applied in communication base stations and industrial equipment with 5.0mm × 6.0mm and 3.3mm × 3.3mm sizes.
New Institute Accelerates Future of Microelectronic System Integration, Advanced Packaging
Purdue collaborates with Cadence, imec, SRC, Osaka University to bolster rapid technology development in U.S.
Neurxcore Introduces Innovative NPU Product Line for AI Inference Applications, Powered by NVIDIA Deep Learning Accelerator Technology
Neurxcore, a provider of cutting-edge Artificial Intelligence (AI) solutions, today announced the launch of its groundbreaking Neural Processor Unit (NPU) product line for AI inference applications.
Ardian Innovates with Pioneering Semiconductor Investment Platform
Ardian, a private investment house, today announces that it is expanding into semiconductor investment with the launch of Ardian Semiconductor.
CEA-Leti Launches R&D Program to Improve ‘Cooperation’ Between Autonomous Vehicles Via V2X Communication
CEA-Leti today announced a new R&D initiative to contribute to a higher level of vehicle automation and cooperation by expanding the latest developments in vehicular wireless communications that improve reaction time, pedestrian detection and overall vehicle performance.
GlobalFoundries Awarded $35 Million Funding from U.S. Government to Accelerate Manufacturing of Next-Generation GaN Chips
In partnership with U.S. Government, GF’s semiconductor manufacturing facility in Vermont continues to move closer to large-scale production of next-generation gallium nitride chips for use in aerospace and defense, cellular communications, industrial IoT and automobiles.
