Intel Foundry certified Ansys (NASDAQ: ANSS) multiphysics solutions for signoff verification of advanced integrated circuits (ICs) designed with the Intel 18A process technology with new RibbonFET transistor technology and backside power delivery.
TSMC’s Kumamoto Plant (JASM) Grand Opening on 24th February
TrendForce’s latest report reveals that in 2023, global foundry revenues hit US$117.47 billion, with TSMC capturing a dominant 60% share.
Mixed-Dimensional Transistors Enable High-Performance Multifunctional Electronic Devices
A research team led by materials scientists from City University of Hong Kong (CityUHK) recently discovered a new strategy for developing highly versatile electronics with outstanding performance, using transistors made of mixed-dimensional nanowires and nanoflakes.
Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors
Intrinsic ID, the provider of Physical Unclonable Function (PUF) technology field-proven in more than 650 million devices across the globe, today announced that it is now a member of the Intel Foundry Accelerator IP Alliance program to ensure the availability of hardware-based root-of-trust (RoT) solutions for Intel Foundry customers.
Fujitsu Collaborates With QuTech
Fujitsu today announced a collaboration with QuTech for the development of the world’s first cryogenic electronic circuits for controlling diamond-based quantum bits.
SEALSQ Further Expands its Asian Footprint with the Signing of a Distribution Agreement with Okaya
SEALSQ Corp, a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and software products, today announced a Distribution Agreement with Okaya Electronics Corp. (“Okaya”), a leading Japanese semiconductor distributor company headquartered in Tokyo.
IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC
Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.
Ideal Power Successfully Completes Phase II of Development Program with Stellantis
Ideal Power Inc. today announced the successful completion of Phase II deliverables of a product development agreement with Stellantis, a top 10 global automaker.
New Omdia Research Shows AI Processors for the Edge Will Nearly Double by 2028
PCs will be the main driver of growth in the AI edge processor market over the next four years, according to new research from Omdia.
STMicroelectronics Expands into 3D Depth Sensing With Latest Time-of-Flight Sensors
The world’s smallest iToF sensor with 672×804-pixel resolution, is now in volume production with a first design win at Lanxin Technology.
